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公开(公告)号:US08643047B2
公开(公告)日:2014-02-04
申请号:US13414458
申请日:2012-03-07
申请人: Kozo Uemura , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
发明人: Kozo Uemura , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
IPC分类号: H01L33/00
CPC分类号: H05K3/284 , F21S8/04 , F21V19/0055 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K3/244 , H05K2201/0162 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.
摘要翻译: 发光装置包括基板,形成在基板上的反射层,放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /(m2·day·atm),并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30%和75%之间。
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公开(公告)号:US20140218908A1
公开(公告)日:2014-08-07
申请号:US14235877
申请日:2011-07-29
申请人: Seiko Kawashima , Tsuyoshi Oyaizu , Hiroki Tamai , Yumiko Hayashida , Shuhei Matsuda , Soichi Shibusawa , Masahiro Ogata , Kozo Uemura , Kiyoshi Nishimura
发明人: Seiko Kawashima , Tsuyoshi Oyaizu , Hiroki Tamai , Yumiko Hayashida , Shuhei Matsuda , Soichi Shibusawa , Masahiro Ogata , Kozo Uemura , Kiyoshi Nishimura
CPC分类号: H01L33/54 , F21K9/27 , F21S8/031 , F21Y2103/10 , F21Y2115/10 , F21Y2115/30 , G02B19/0019 , G02B19/0066 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L2224/48091 , H01L2224/73265 , H05K3/284 , H05K2201/10106 , H05K2201/2054 , H05K2203/1316 , H01L2924/00014
摘要: To improve an angular color difference and emit uniform illumination light. According to an embodiment, a light-emitting device in an embodiment includes a light-emitting module (15). The light-emitting module (15) includes a substrate (21), a plurality of light-emitting elements (45) made of semiconductor, and a plurality of sealing members (54). The light-emitting elements (45) are disposed on the substrate (21). The sealing members (54) contain, as a main component, translucent resin mixed with a phosphor. The sealing members (54) are heaped up from the bottom surfaces thereof bonded on the substrate (21) and are each formed to bury a singularity or a plurality of the light-emitting elements (45). A ratio (H/D) of a diameter D of the bottom surfaces to height H of the heaps of the sealing members (54) is set to 0.22 to 1.0.
摘要翻译: 改善角色差并发出均匀的照明光。 根据实施例,实施例中的发光装置包括发光模块(15)。 发光模块(15)包括基板(21),由半导体形成的多个发光元件(45)和多个密封构件(54)。 发光元件(45)设置在基板(21)上。 密封构件(54)含有与荧光体混合的半透明树脂作为主要成分。 密封构件(54)从结合在基板(21)上的底面堆积起来,并且分别形成为埋入奇点或多个发光元件(45)。 密封构件(54)的堆的底面的直径D与高度H的比(H / D)设定为0.22〜1.0。
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公开(公告)号:US20120305963A1
公开(公告)日:2012-12-06
申请号:US13414458
申请日:2012-03-07
申请人: Kozo UEMURA , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
发明人: Kozo UEMURA , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
IPC分类号: H01L33/60
CPC分类号: H05K3/284 , F21S8/04 , F21V19/0055 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K3/244 , H05K2201/0162 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要: According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.
摘要翻译: 根据一个实施例,发光装置包括基板,形成在基板上的反射层,放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /(m2·day·atm),并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30%和75%之间。
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公开(公告)号:US20120099309A1
公开(公告)日:2012-04-26
申请号:US13280433
申请日:2011-10-25
CPC分类号: H01L33/641 , F21K9/00 , F21V29/505 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L33/483 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K1/113 , H05K3/284 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要: According to one embodiment, a light emitting device includes a substrate, a lead pattern and a plurality of mounting pads, and a plurality of light emitting elements. The substrate includes an insulating layer. The lead pattern and the plurality of mounting pads are formed on a surface of the substrate. The lead pattern and the plurality of mounting pads are conductive. The plurality of mounting pads are configured not to electrically conduct. The lead pattern is configured to electrically conduct. The plurality of light emitting elements are mounted on the mounting pads and electrically connected to the lead pattern.
摘要翻译: 根据一个实施例,发光器件包括衬底,引线图案和多个安装焊盘以及多个发光元件。 基板包括绝缘层。 引线图案和多个安装焊盘形成在基板的表面上。 引线图案和多个安装焊盘是导电的。 多个安装焊盘被构造成不进行导电。 引线图案被配置为电导电。 多个发光元件安装在安装焊盘上并电连接到引线图案。
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公开(公告)号:US20130271971A1
公开(公告)日:2013-10-17
申请号:US13819296
申请日:2011-09-27
申请人: Kozo Uemura , Kiyoshi Nishimura , Soichi Shibusawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
发明人: Kozo Uemura , Kiyoshi Nishimura , Soichi Shibusawa , Nobuhiko Betsuda , Shuhei Matsuda , Masatoshi Kumagai
IPC分类号: F21S2/00
CPC分类号: F21S2/00 , F21K9/27 , F21K9/61 , F21S8/031 , F21V3/02 , F21V7/005 , F21V11/02 , F21V19/004 , F21Y2103/10 , F21Y2107/90 , F21Y2115/10
摘要: A light-emitting circuit is formed as a straight tube in a stable shape and capable of appropriately housing and holding an LED module and the like. The light-emitting circuit includes: a plurality of light-emitting elements configured to emit light; a substrate, functioning as an arrangement member, including an arrangement surface on which the plurality of light-emitting elements are arranged; and a substantially cylindrical lamp body including a translucent section at least in a part thereof, including the arrangement member disposed on the inside, and including a louver functioning as a projecting body projecting from an inner wall opposed to the arrangement surface and extending toward the arrangement surface.
摘要翻译: 发光电路形成为稳定形状的直管,能够适当地容纳和保持LED模块等。 发光电路包括:多个被配置为发光的发光元件; 用作布置构件的基板,包括布置有多个发光元件的布置表面; 以及至少在其一部分上具有半透明部分的大致圆柱形的灯体,包括设置在内部的布置构件,并且包括用作突出体的百叶窗,所述突出体从与所述布置表面相对的内壁突出并延伸到所述布置 表面。
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公开(公告)号:USD663866S1
公开(公告)日:2012-07-17
申请号:US29387895
申请日:2011-03-21
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公开(公告)号:USD663865S1
公开(公告)日:2012-07-17
申请号:US29387866
申请日:2011-03-18
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公开(公告)号:US08770795B2
公开(公告)日:2014-07-08
申请号:US13236672
申请日:2011-09-20
申请人: Kozo Uemura , Soichi Shibusawa , Shuhei Matsuda , Nobuhiko Betsuda , Kiyoshi Nishimura , Masatoshi Kumagai
发明人: Kozo Uemura , Soichi Shibusawa , Shuhei Matsuda , Nobuhiko Betsuda , Kiyoshi Nishimura , Masatoshi Kumagai
IPC分类号: F21V21/00
CPC分类号: H01L25/0753 , F21K9/27 , F21S8/031 , F21V23/023 , F21Y2103/10 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要: A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.
摘要翻译: 发光装置包括基板和安装在基板上的多个发光元件。 放置发光元件以满足以下条件:安装部件的每单位面积(cm2)的发光元件的数量B不小于0.4,平均安装密度D不小于58至不大于334 当建立公式“D = A×B”的关系时,假设D作为基板上的发光元件的平均安装密度,A作为流过一个发光元件的电流(mA),B作为 用于发光元件的基本安装部件的每单位面积的发光元件的数量(cm2)。
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公开(公告)号:USD663443S1
公开(公告)日:2012-07-10
申请号:US29387857
申请日:2011-03-18
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公开(公告)号:USD663444S1
公开(公告)日:2012-07-10
申请号:US29387863
申请日:2011-03-18
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