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公开(公告)号：US08643047B2
公开(公告)日：2014-02-04
申请号：US13414458
申请日：2012-03-07
申请人： Kozo Uemura , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
发明人： Kozo Uemura , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
IPC分类号： H01L33/00
CPC分类号： H05K3/284 , F21S8/04 , F21V19/0055 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K3/244 , H05K2201/0162 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.
摘要翻译： 发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。
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公开(公告)号：US20140218908A1
公开(公告)日：2014-08-07
申请号：US14235877
申请日：2011-07-29
申请人： Seiko Kawashima , Tsuyoshi Oyaizu , Hiroki Tamai , Yumiko Hayashida , Shuhei Matsuda , Soichi Shibusawa , Masahiro Ogata , Kozo Uemura , Kiyoshi Nishimura
发明人： Seiko Kawashima , Tsuyoshi Oyaizu , Hiroki Tamai , Yumiko Hayashida , Shuhei Matsuda , Soichi Shibusawa , Masahiro Ogata , Kozo Uemura , Kiyoshi Nishimura
CPC分类号： H01L33/54 , F21K9/27 , F21S8/031 , F21Y2103/10 , F21Y2115/10 , F21Y2115/30 , G02B19/0019 , G02B19/0066 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L2224/48091 , H01L2224/73265 , H05K3/284 , H05K2201/10106 , H05K2201/2054 , H05K2203/1316 , H01L2924/00014
摘要： To improve an angular color difference and emit uniform illumination light. According to an embodiment, a light-emitting device in an embodiment includes a light-emitting module (15). The light-emitting module (15) includes a substrate (21), a plurality of light-emitting elements (45) made of semiconductor, and a plurality of sealing members (54). The light-emitting elements (45) are disposed on the substrate (21). The sealing members (54) contain, as a main component, translucent resin mixed with a phosphor. The sealing members (54) are heaped up from the bottom surfaces thereof bonded on the substrate (21) and are each formed to bury a singularity or a plurality of the light-emitting elements (45). A ratio (H/D) of a diameter D of the bottom surfaces to height H of the heaps of the sealing members (54) is set to 0.22 to 1.0.
摘要翻译： 改善角色差并发出均匀的照明光。 根据实施例，实施例中的发光装置包括发光模块（15）。 发光模块（15）包括基板（21），由半导体形成的多个发光元件（45）和多个密封构件（54）。 发光元件（45）设置在基板（21）上。 密封构件（54）含有与荧光体混合的半透明树脂作为主要成分。 密封构件（54）从结合在基板（21）上的底面堆积起来，并且分别形成为埋入奇点或多个发光元件（45）。 密封构件（54）的堆的底面的直径D与高度H的比（H / D）设定为0.22〜1.0。
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公开(公告)号：US20120305963A1
公开(公告)日：2012-12-06
申请号：US13414458
申请日：2012-03-07
申请人： Kozo UEMURA , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
发明人： Kozo UEMURA , Soichi Shibusawa , Yumiko Hayashida , Kiyoshi Nishimura , Seiko Kawashima , Tsuyoshi Oyaizu , Masahiro Ogata , Shuhei Matsuda , Hiroki Tamai
IPC分类号： H01L33/60
CPC分类号： H05K3/284 , F21S8/04 , F21V19/0055 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K1/0209 , H05K3/244 , H05K2201/0162 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.
摘要翻译： 根据一个实施例，发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。
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4.发明授权Light-emitting module having light-emitting elements sealed with sealing member and luminaire having same 有权具有由密封构件密封的发光元件的发光模块和具有该发光模块的照明器公开(公告)号：US08766536B2
公开(公告)日：2014-07-01
申请号：US13591617
申请日：2012-08-22
CPC分类号： H01L25/0753 , F21K9/20 , F21K9/66 , F21S8/04 , F21V3/02 , F21V19/0045 , F21Y2105/10 , F21Y2113/00 , F21Y2113/17 , F21Y2115/10 , H01L33/54 , H01L33/62 , H01L2224/49113 , H05K1/111 , H05K3/284 , H05K2201/10106 , H05K2201/10522 , H05K2203/049
摘要： Light-emitting modules according to the embodiments is configured by mounting a plurality of semiconductor light-emitting elements having the same light-emitting property in a closed-up manner on a substrate and sealing the closed up plurality of semiconductor light-emitting elements by a dome shaped sealing member altogether.
摘要翻译： 根据实施例的发光模块通过以闭合方式将多个具有相同发光特性的半导体发光元件安装在基板上并将闭合的多个半导体发光元件密封在一起 圆顶形密封件。
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公开(公告)号：US20130106279A1
公开(公告)日：2013-05-02
申请号：US13591617
申请日：2012-08-22
IPC分类号： H05B33/04
CPC分类号： H01L25/0753 , F21K9/20 , F21K9/66 , F21S8/04 , F21V3/02 , F21V19/0045 , F21Y2105/10 , F21Y2113/00 , F21Y2113/17 , F21Y2115/10 , H01L33/54 , H01L33/62 , H01L2224/49113 , H05K1/111 , H05K3/284 , H05K2201/10106 , H05K2201/10522 , H05K2203/049
摘要： Light-emitting modules according to the embodiments is configured by mounting a plurality of semiconductor light-emitting elements having the same light-emitting property in a closed-up manner on a substrate and sealing the closed up plurality of semiconductor light-emitting elements by a dome shaped sealing member altogether.
摘要翻译： 根据实施例的发光模块通过以闭合方式将多个具有相同发光特性的半导体发光元件安装在基板上并将闭合的多个半导体发光元件密封在一起 圆顶形密封件。
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公开(公告)号：US20130105842A1
公开(公告)日：2013-05-02
申请号：US13596161
申请日：2012-08-28
CPC分类号： H01L33/505 , H01L33/501 , H01L2224/73265
摘要： According to one embodiment, a light-emitting module includes a substrate, a light-emitting element and a sealing member. The light-emitting element is mounted on the substrate. The sealing member is formed of a material consisting principally of a translucent resin containing phosphor particles. The sealing member includes a main portion covering the light-emitting element and an outer peripheral portion coming into contact with the substrate. A content percentage of the phosphor particles with respect to the resin is smaller in the outer peripheral portion of the sealing member than that in the main portion.
摘要翻译： 根据一个实施例，发光模块包括基板，发光元件和密封构件。 发光元件安装在基板上。 密封构件由主要由含有荧光体颗粒的半透明树脂组成的材料形成。 密封构件包括覆盖发光元件的主要部分和与基板接触的外周部分。 在密封部件的外周部分中，荧光体颗粒相对于树脂的含量百分比小于主体部分的含量百分比。
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公开(公告)号：US08641232B2
公开(公告)日：2014-02-04
申请号：US13162668
申请日：2011-06-17
申请人： Seiko Kawashima , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
发明人： Seiko Kawashima , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
IPC分类号： F21V21/00
CPC分类号： F21V19/0055 , F21K9/232 , F21V3/00 , F21V29/773 , F21V29/89 , F21Y2115/10 , H01L2224/48137
摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.
摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。
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公开(公告)号：US20110310609A1
公开(公告)日：2011-12-22
申请号：US13162668
申请日：2011-06-17
申请人： Seiko KAWASHIMA , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
发明人： Seiko KAWASHIMA , Yuichiro Takahara , Kazuya Kondo , Yusuke Shibahara , Hiroki Tamai , Haruki Takei , Tsuyoshi Oyaizu
IPC分类号： F21V21/00
CPC分类号： F21V19/0055 , F21K9/232 , F21V3/00 , F21V29/773 , F21V29/89 , F21Y2115/10 , H01L2224/48137
摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.
摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。
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公开(公告)号：US20090290346A1
公开(公告)日：2009-11-26
申请号：US12467395
申请日：2009-05-18
申请人： Kozo Ogawa , Kiyoshi Nishimura , Nobuhiko Betsuda , Hiroki Tamai , Akiko Saito
发明人： Kozo Ogawa , Kiyoshi Nishimura , Nobuhiko Betsuda , Hiroki Tamai , Akiko Saito
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21S2/005 , F21V17/12 , F21V19/0035 , F21V19/0055 , F21V23/005 , F21V29/505 , F21V29/507 , F21V29/713 , F21V29/74 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.
摘要翻译： 光源单元设置有基板和具有导热性的装饰盖。 基板包括在其中间部分设置有多个LED芯片的电路图形区域，具有导热性，并且将热量从电路图案区域传递到其外周方向的区域。 装饰盖包围基板，与电路图形区域电绝缘，并且通过与电路图形区域的周边面接触而与基板的表面侧热耦合。 可以通过装饰盖辐射基板的热量，同时确保相对于电路图案区域的电绝缘性能。
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公开(公告)号：US08414164B2
公开(公告)日：2013-04-09
申请号：US12471579
申请日：2009-05-26
申请人： Kozo Ogawa , Aiko Takahashi , Nobuhiko Betsuda , Hiroki Tamai , Kiyoshi Nishimura , Akiko Saito , Ryotaro Matsuda
发明人： Kozo Ogawa , Aiko Takahashi , Nobuhiko Betsuda , Hiroki Tamai , Kiyoshi Nishimura , Akiko Saito , Ryotaro Matsuda
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21S8/043 , F21S8/06 , F21V21/29 , F21V21/30 , F21V23/005 , F21V29/507 , F21V29/73 , F21V29/75 , F21V29/763 , F21V29/773 , F21V29/89 , F21Y2105/00 , F21Y2115/10 , F21Y2115/15
摘要： A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing.
摘要翻译： 聚光灯具有设置有LED的基板和设置有基板的主体外壳。 主体外壳具有热传导性的后侧部分，其热耦合到基板，并且能够改变从LED发射的光的照射角度。 在主体壳体的后侧部分设置有用于形成沿着改变照射角度的方向作为多个对流路径工作的槽的多个散热片。
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