公开(公告)号：US08643047B2

公开(公告)日：2014-02-04

申请号：US13414458

申请日：2012-03-07

申请人： Kozo Uemura ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

发明人： Kozo Uemura ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

IPC分类号： H01L33/00

CPC分类号： H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

摘要翻译： 发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。

公开(公告)号：US20140218908A1

公开(公告)日：2014-08-07

申请号：US14235877

申请日：2011-07-29

申请人： Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Hiroki Tamai ,  Yumiko Hayashida ,  Shuhei Matsuda ,  Soichi Shibusawa ,  Masahiro Ogata ,  Kozo Uemura ,  Kiyoshi Nishimura

发明人： Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Hiroki Tamai ,  Yumiko Hayashida ,  Shuhei Matsuda ,  Soichi Shibusawa ,  Masahiro Ogata ,  Kozo Uemura ,  Kiyoshi Nishimura

IPC分类号： H01L33/54 ,  F21K99/00 ,  H01L33/50

CPC分类号： H01L33/54 ,  F21K9/27 ,  F21S8/031 ,  F21Y2103/10 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B19/0019 ,  G02B19/0066 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1316 ,  H01L2924/00014

摘要： To improve an angular color difference and emit uniform illumination light. According to an embodiment, a light-emitting device in an embodiment includes a light-emitting module (15). The light-emitting module (15) includes a substrate (21), a plurality of light-emitting elements (45) made of semiconductor, and a plurality of sealing members (54). The light-emitting elements (45) are disposed on the substrate (21). The sealing members (54) contain, as a main component, translucent resin mixed with a phosphor. The sealing members (54) are heaped up from the bottom surfaces thereof bonded on the substrate (21) and are each formed to bury a singularity or a plurality of the light-emitting elements (45). A ratio (H/D) of a diameter D of the bottom surfaces to height H of the heaps of the sealing members (54) is set to 0.22 to 1.0.

摘要翻译： 改善角色差并发出均匀的照明光。 根据实施例，实施例中的发光装置包括发光模块（15）。 发光模块（15）包括基板（21），由半导体形成的多个发光元件（45）和多个密封构件（54）。 发光元件（45）设置在基板（21）上。 密封构件（54）含有与荧光体混合的半透明树脂作为主要成分。 密封构件（54）从结合在基板（21）上的底面堆积起来，并且分别形成为埋入奇点或多个发光元件（45）。 密封构件（54）的堆的底面的直径D与高度H的比（H / D）设定为0.22〜1.0。

公开(公告)号：US20120305963A1

公开(公告)日：2012-12-06

申请号：US13414458

申请日：2012-03-07

申请人： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

发明人： Kozo UEMURA ,  Soichi Shibusawa ,  Yumiko Hayashida ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Masahiro Ogata ,  Shuhei Matsuda ,  Hiroki Tamai

IPC分类号： H01L33/60

CPC分类号： H05K3/284 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0209 ,  H05K3/244 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

摘要翻译： 根据一个实施例，发光装置包括基板，形成在基板上的反射层，放置在反射层上的发光元件和覆盖反射层和发光元件的密封树脂层。 密封树脂层的透氧度等于或低于1200cm3 /（m2·day·atm），并且覆盖在树脂基板上的密封树脂层覆盖的反射层的面积与覆盖的整个面积的比率 通过密封树脂层在30％和75％之间。

公开(公告)号：US08641232B2

公开(公告)日：2014-02-04

申请号：US13162668

申请日：2011-06-17

申请人： Seiko Kawashima ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

发明人： Seiko Kawashima ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

IPC分类号： F21V21/00

CPC分类号： F21V19/0055 ,  F21K9/232 ,  F21V3/00 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  H01L2224/48137

摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。

公开(公告)号：US20110310609A1

公开(公告)日：2011-12-22

申请号：US13162668

申请日：2011-06-17

申请人： Seiko KAWASHIMA ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

发明人： Seiko KAWASHIMA ,  Yuichiro Takahara ,  Kazuya Kondo ,  Yusuke Shibahara ,  Hiroki Tamai ,  Haruki Takei ,  Tsuyoshi Oyaizu

IPC分类号： F21V21/00

CPC分类号： F21V19/0055 ,  F21K9/232 ,  F21V3/00 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10 ,  H01L2224/48137

摘要： According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

摘要翻译： 根据一个实施例，发光器件包括：衬底，其背面侧设置在安装构件上; 安装在所述基板的表面侧的多个发光元件; 以及设置在基板的表面侧并电连接到发光元件的电源端子。 电源端子通过从基板的表面侧引导到安装构件侧的弹性压力连接到电连接单元。 机械固定单元具有与基板的表面侧接触的按压部。 机械固定单元利用从基板的表面侧向安装部件侧引导的按压部的弹性压力将基板固定在安装部件上。

公开(公告)号：US08408724B2

公开(公告)日：2013-04-02

申请号：US12641841

申请日：2009-12-18

申请人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

发明人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

IPC分类号： F21V8/00

CPC分类号： F21S8/02 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

摘要翻译： 光源模块包括模块衬底，金属导体，多个半导体发光元件，白色漫反射层和半透明密封构件。 金属导体以预定图案设置在模块基板的前表面上。 半导体发光元件电连接到金属导体并安装在模块基板的前表面上。 白色漫反射层包括半导体发光元件所在的多个孔，比半导体发光元件薄，并且层叠在模块基板的前表面。 半透明密封件将半导体发光元件埋入漫射反射层下方，并与荧光体混合。

公开(公告)号：US20100165624A1

公开(公告)日：2010-07-01

申请号：US12641841

申请日：2009-12-18

申请人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

发明人： Kozo Ogawa ,  Yusuke Shibahara ,  Kiyoshi Nishimura ,  Seiko Kawashima ,  Tsuyoshi Oyaizu ,  Haruki Takei

IPC分类号： F21V1/00

CPC分类号： F21S8/02 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

摘要翻译： 光源模块包括模块衬底，金属导体，多个半导体发光元件，白色漫反射层和半透明密封构件。 金属导体以预定图案设置在模块基板的前表面上。 半导体发光元件电连接到金属导体并安装在模块基板的前表面上。 白色漫反射层包括半导体发光元件所在的多个孔，比半导体发光元件薄，并且层叠在模块基板的前表面。 半透明密封件将半导体发光元件埋入漫射反射层下方，并与荧光体混合。

公开(公告)号：US08716943B2

公开(公告)日：2014-05-06

申请号：US13027788

申请日：2011-02-15

申请人： Tsuyoshi Oyaizu ,  Seiko Kawashima ,  Haruki Takei ,  Akiko Saito

发明人： Tsuyoshi Oyaizu ,  Seiko Kawashima ,  Haruki Takei ,  Akiko Saito

IPC分类号： H05B37/02 ,  F21S4/00

CPC分类号： H05B33/0884 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H05B33/0803 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.

摘要翻译： 根据一个实施例，一种发光装置包括：基板，包括绝缘表面;多个发光元件，安装在基板的表面上并彼此电连接，正电力馈送导体和负电力供电导体 安装在基板的表面上，以将功率馈送到发光元件，从馈电导体引出的引出端到发光元件的安装区域的外部，以及连接到 引出端子并布置在安装区域外部。

公开(公告)号：USD658601S1

公开(公告)日：2012-05-01

申请号：US29375121

申请日：2010-09-17

申请人： Kazuo Egawa ,  Yuichiro Takahara ,  Seiko Kawashima ,  Akiko Saito ,  Tsuyoshi Oyaizu ,  Takeshi Arimura

设计人： Kazuo Egawa ,  Yuichiro Takahara ,  Seiko Kawashima ,  Akiko Saito ,  Tsuyoshi Oyaizu ,  Takeshi Arimura

公开(公告)号：US20120026738A1

公开(公告)日：2012-02-02

申请号：US13193032

申请日：2011-07-28

申请人： Tsuyoshi Oyaizu ,  Haruki Takei ,  Seiko Kawashima

发明人： Tsuyoshi Oyaizu ,  Haruki Takei ,  Seiko Kawashima

IPC分类号： F21V21/00

CPC分类号： F21V19/004 ,  F21K9/00 ,  F21S8/086 ,  F21V29/70 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a light-emitting apparatus includes a substrate, an attachment member, and a mechanical fixing component. The substrate has light-emitting elements mounted on one surface side thereof. The attachment member includes a concave portion in which the substrate is arranged with a gap between the substrate and a side circumference of the concave portion. The mechanical fixing component includes a pressure portion that is in contact with the one surface side of the substrate, the mechanical fixing component being configured to hold the substrate in the concave portion of the attachment member by elastic pressing force of the pressure portion acting in a direction from the one surface side toward the other surface side of the substrate.

摘要翻译： 根据一个实施例，发光装置包括基板，附接构件和机械固定部件。 基板具有安装在其一个表面侧上的发光元件。 所述安装部件包括凹部，所述基板在所述基板与所述凹部的侧周之间具有间隙。 所述机械固定部件包括与所述基板的一个表面侧接触的压力部，所述机械固定部件构造成通过所述压力部的作用力的弹性压力将所述基板保持在所述安装部件的凹部内 方向从基板的一个表面侧朝向另一个表面侧。