-
1.发明授权Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip 失效从用于微电子芯片空腔的多层陶瓷基板制造中使用的金属插件中除去残留物
公开(公告)号：US5643818A
公开(公告)日：1997-07-01
申请号：US642238
申请日：1996-05-02
CPC分类号： H01L21/4857 , H01L21/4864 , H01L2924/15153 , H01L2924/1517
摘要： After a metallic insert has been used precisely to define a cavity for a microelectronic chip in a laminated, multi-sheet, predominantly ceramic substrate having metallic features, any green sheet and metal-polymer composite paste residues are removed from the metallic insert by immersing the metallic insert in an ultrasonically agitated bath containing a first solvent having a relatively high boiling point for about five to fifteen minutes, replacing the first solvent with a second solvent having a relatively low boiling point, and drying the metallic insert in hot air or hot nitrogen to remove the second solvent. Preferably, the first solvent is an alkoxy alcohol, such as 1-methoxy-2-propanol or 3-methoxy-1-butanol, or a hydroxy ester, such as ethyl lactate, and the second solvent is a lower alkyl alcohol, such as isopropanol. Alternatively, the first solvent may be a ketone or an alkyl ester. The metallic insert is rinsed in the second solvent, preferably in an ultrasonically agitated bath, to replace the first solvent with the second solvent before the metallic insert is dried to remove the first solvent.
摘要翻译： 在金属插入件被精确地用于在具有金属特征的层压，多片，主要为陶瓷的基底中限定用于微电子芯片的空腔的情况下，通过将任何生片和金属 - 聚合物复合糊料残留物从金属插入物中浸渍 金属插入物在包含具有较高沸点的第一溶剂的超声波搅拌浴中约5至15分钟，用具有相对低沸点的第二溶剂代替第一溶剂，并在热空气或热氮中干燥金属插入物 以除去第二溶剂。 优选地，第一溶剂是烷氧基醇，例如1-甲氧基-2-丙醇或3-甲氧基-1-丁醇，或羟基酯如乳酸乙酯，第二溶剂是低级烷基醇，例如 异丙醇 或者，第一溶剂可以是酮或烷基酯。 金属插入物在第二溶剂中，优选在超声波搅拌浴中漂洗，以在将金属插入物干燥以除去第一溶剂之前用第二溶剂替换第一溶剂。
-
2.发明授权Method of forming defect-free ceramic structures using thermally depolymerizable surface layer 失效使用可热解聚表面层形成无缺陷陶瓷结构的方法公开(公告)号：US06261927B1
公开(公告)日：2001-07-17
申请号：US09302943
申请日：1999-04-30
IPC分类号： H01L2130
CPC分类号： H01L21/481 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y10S438/976 , H01L2924/00
摘要： This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.
摘要翻译： 本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。 特别地，本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。 更具体地说，本发明包括一种制造半导体衬底的方法，其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。 本发明还包括用于制造表面保护的生片层压板的方法，其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。 在层压之后，由于在烧结过程中挥发物质的热解聚和燃烧，因此可方便且清洁地除去热可分解/可分解的膜，从而提供无表面缺陷的陶瓷基材。
-
3.发明授权Method of forming defect-free ceramic structures using thermally depolymerizable surface layer 失效使用可热解聚表面层形成无缺陷陶瓷结构的方法公开(公告)号：US06597058B1
公开(公告)日：2003-07-22
申请号：US09370733
申请日：1999-08-09
IPC分类号： H01L2358
CPC分类号： H01L21/481 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y10S438/976 , H01L2924/00
摘要： This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.
摘要翻译： 本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。 特别地，本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。 更具体地说，本发明包括一种制造半导体衬底的方法，其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。 本发明还包括用于制造表面保护的生片层压板的方法，其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。 在层压之后，由于在烧结过程中挥发物质的热解聚和燃烧，因此可方便且清洁地除去热可分解/可分解的膜，从而提供无表面缺陷的陶瓷基材。
-
4.发明授权Apparatus and insertless method for forming cavity substrates using coated membrane 失效使用涂覆膜形成腔体衬底的装置和无插入方法公开(公告)号：US06423174B1
公开(公告)日：2002-07-23
申请号：US08668291
申请日：1996-06-21
IPC分类号： B32B3120
CPC分类号： B32B18/00 , B32B37/0023 , B32B2038/042 , B32B2309/12 , B32B2315/02 , C04B35/10 , C04B35/581 , C04B35/6455 , C04B2235/658 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/64 , H01L21/4807
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.
摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将涂覆的膜片放置在空腔上方并使其符合空腔的轮廓，从而防止凹陷或损坏， 层压过程中的腔架。 在层压处理之后，方便地去除涂覆的膜，而不会损坏腔架或糊状物拉出。
-
公开(公告)号：US06255827B1
公开(公告)日：2001-07-03
申请号：US09302944
申请日：1999-04-30
IPC分类号： H01H3102
CPC分类号： G01R1/06705
摘要： A system for locating electrically conductive contact points on an integrated circuit semiconductor substrate utilizes capacitance and line continuity measurements to control and direct the movement of a two-point probe tester in order to locate and precisely align each test probe with designated contact points. The system is capable of testing for continuity conditions or defects and perform other related electrical measurements.
摘要翻译： 用于在集成电路半导体衬底上定位导电接触点的系统利用电容和线路连续性测量来控制和指导两点探针测试仪的移动，以便将每个测试探针与指定的接触点定位和精确对准。 该系统能够测试连续性条件或缺陷，并执行其他相关的电气测量。
-
公开(公告)号：US5788808A
公开(公告)日：1998-08-04
申请号：US834304
申请日：1997-04-15
CPC分类号： B32B37/0023 , B32B37/26 , H01L21/4807 , B32B2315/02 , H01L2924/15787
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏 到层压过程中的腔架或角落。 在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。 该垫可以重复使用多次以形成这些MLC空腔衬底。
-
7.发明授权Interposer for maintaining temporary contact between a substrate and a test bed 失效用于保持基板和试验台之间的临时接触的插入件公开(公告)号：US06281692B1
公开(公告)日：2001-08-28
申请号：US09166468
申请日：1998-10-05
申请人： Paul F. Bodenweber , Ralph R. Comulada , Mukta S. Farooq , Charles J. Hendricks , Philo B. Hodge , Vincent P. Peterson , Terence W. Spoor , Kathleen M. Wiley , Yuet-Ying Yu
发明人： Paul F. Bodenweber , Ralph R. Comulada , Mukta S. Farooq , Charles J. Hendricks , Philo B. Hodge , Vincent P. Peterson , Terence W. Spoor , Kathleen M. Wiley , Yuet-Ying Yu
IPC分类号： G01R3102
CPC分类号： G01R1/07378
摘要： Disclosed is an interposer and test structure for making contact between a substrate and a test bed. One embodiment of the interposer has a floating, rigid conductive element in a nonconductive body which makes temporary contact between the test bed and the substrate. In another embodiment of the invention, the interposer includes two layers of material, in which one layer includes pogo pins for contacting the substrate and the other layer includes pads for contacting the test bed. The pogo pins are on a grid spacing corresponding to that of the substrate input/output pads while the interposer pads are on a grid spacing corresponding to that of the pogo pin contactors of the test bed.
摘要翻译： 公开了一种用于在基板和试验台之间进行接触的插入件和测试结构。 插入器的一个实施例在非导体中具有浮动的刚性导电元件，其使得测试台与基板之间暂时接触。 在本发明的另一个实施例中，插入件包括两层材料，其中一层包括用于接触衬底的弹簧针，另一层包括用于接触测试台的衬垫。 弹簧针位于与衬底输入/输出焊盘相对应的栅格间隔上，而插入垫位于对应于测试台的弹簧针接触器的栅格间隔上。
-
公开(公告)号：US5759320A
公开(公告)日：1998-06-02
申请号：US834302
申请日：1997-04-13
CPC分类号： B32B37/26 , B32B37/0023 , H01L21/4807 , Y10T156/10
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏 到层压过程中的腔架或角落。 在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。 该垫可以重复使用多次以形成这些MLC空腔衬底。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.02 秒)
