公开(公告)号：US5759320A

公开(公告)日：1998-06-02

申请号：US834302

申请日：1997-04-13

申请人： Govindarajan Natarajan ,  Robert W. Pasco ,  Charles H. Perry ,  Vincent P. Peterson

发明人： Govindarajan Natarajan ,  Robert W. Pasco ,  Charles H. Perry ,  Vincent P. Peterson

IPC分类号： H01L21/48 ,  B32B31/20

CPC分类号： B32B37/26 ,  B32B37/0023 ,  H01L21/4807 ,  Y10T156/10

摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.

摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏 到层压过程中的腔架或角落。 在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。 该垫可以重复使用多次以形成这些MLC空腔衬底。

公开(公告)号：US5788808A

公开(公告)日：1998-08-04

申请号：US834304

申请日：1997-04-15

申请人： Govindarajan Natarajan ,  Robert W. Pasco ,  Charles H. Perry ,  Vincent P. Peterson

发明人： Govindarajan Natarajan ,  Robert W. Pasco ,  Charles H. Perry ,  Vincent P. Peterson

IPC分类号： H01L21/48 ,  B32B31/20

CPC分类号： B32B37/0023 ,  B32B37/26 ,  H01L21/4807 ,  B32B2315/02 ,  H01L2924/15787

摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.

摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏 到层压过程中的腔架或角落。 在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。 该垫可以重复使用多次以形成这些MLC空腔衬底。

公开(公告)号：US06528145B1

公开(公告)日：2003-03-04

申请号：US09606359

申请日：2000-06-29

申请人： Daniel George Berger ,  Shaji Farooq ,  Lester Wynn Herron ,  James N. Humenik ,  John Ulrich Knickerbocker ,  Robert William Pasco ,  Charles H. Perry ,  Krishna G. Sachdev

发明人： Daniel George Berger ,  Shaji Farooq ,  Lester Wynn Herron ,  James N. Humenik ,  John Ulrich Knickerbocker ,  Robert William Pasco ,  Charles H. Perry ,  Krishna G. Sachdev

IPC分类号： G02B600

CPC分类号： H05K1/0373 ,  H01L21/4857 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/249955 ,  Y10T428/249956 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/259 ,  H01L2924/00

摘要： A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

摘要翻译： 包括聚合物和陶瓷材料的复合电子和/或光学基底，其中复合基底具有小于4的介电常数和8-14ppm /℃的热膨胀系数。 在100℃下。复合衬底可以是陶瓷填充的聚合材料或聚合物填充的陶瓷材料。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US06858111B2

公开(公告)日：2005-02-22

申请号：US09911069

申请日：2001-07-23

申请人： Charles H. Perry ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Gregory B. Martin

发明人： Charles H. Perry ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Gregory B. Martin

IPC分类号： H01L21/60 ,  H05K3/32 ,  H05K3/34 ,  C09J5/00

CPC分类号： H01L24/10 ,  B23K2101/36 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

摘要翻译： 公开了一种在两个装置之间形成电连接的方法。 在本发明的示例性实施例中，该方法包括将互连的第二可焊接焊锡焊接到第一部件的第一接触焊盘。 互连还包括包含聚合物组分和导电组分的导电聚合物。第一可焊接帽设置成与导电聚合物接触，并且第二可焊接帽设置成与第一可焊接帽相对的导电聚合物接触。 然后将第一可焊接帽焊接到第二部件的第二接触焊盘。

公开(公告)号：US06848914B2

公开(公告)日：2005-02-01

申请号：US09975213

申请日：2001-10-11

申请人： Brian S. Beaman ,  William L. Brodsky ,  James A. Busby ,  Benson Chan ,  Voya R. Markovich ,  Charles H. Perry

发明人： Brian S. Beaman ,  William L. Brodsky ,  James A. Busby ,  Benson Chan ,  Voya R. Markovich ,  Charles H. Perry

IPC分类号： H01R12/52 ,  H01R13/24 ,  H01R43/00 ,  H01R12/00

CPC分类号： H01R43/007 ,  H01R12/52 ,  H01R13/2421

摘要： A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

摘要翻译： 用于电耦合两个基板（例如，印刷线路板和电子模块）的结构和方法。 首先，提供介质芯。 导电布线围绕介质芯螺旋缠绕。 此外，可以在导电布线周围形成电介质护套。 所得的导电杆结构沿着导电棒的长度被轴向地切割，以产生具有端部触头的导电按钮。 导电按钮的端部触点可用于将两个基板电耦合到两个基板的相应焊盘处。

公开(公告)号：US06333104B1

公开(公告)日：2001-12-25

申请号：US09580131

申请日：2000-05-30

申请人： Charles H. Perry ,  Mark G. Courtney ,  Lewis s. Goldmann ,  Gregory B. Martin

发明人： Charles H. Perry ,  Mark G. Courtney ,  Lewis s. Goldmann ,  Gregory B. Martin

IPC分类号： B32B516

CPC分类号： H01L24/10 ,  B23K2101/36 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.

摘要翻译： 这里公开了用于两个电气设备的电连接的互连。 互连包括与一个或两个可焊接盖接触设置的导电聚合物。 一起，可焊接帽和导电聚合物形成互连，其可以用于通过电气设备上的接触焊盘连接两个电气设备。 例如，封装的集成电路芯片可以使用互连阵列连接到“卡”。 由于互连具有可焊接表面，所以可以使用互连来代替常规生产线中的焊球。

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US07278207B2

公开(公告)日：2007-10-09

申请号：US11182167

申请日：2005-07-15

申请人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

发明人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC分类号： H01K3/10 ,  H01R12/04 ,  H01L21/00

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

公开(公告)号：US06486415B2

公开(公告)日：2002-11-26

申请号：US09761124

申请日：2001-01-16

申请人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

发明人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC分类号： H01P1204

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

摘要翻译： 提供电子封装和制造电子封装的方法。 电介质材料层位于包括多个导电触点的衬底的第一表面上。 至少一个通孔形成在电介质材料层中，与多个导电触点中的至少一个对准。 导电材料位于基本上填充通孔的至少一个通孔中。 至少一个导电构件定位在通孔中的导电材料上并与导电材料电接触。 该电子封装提高了组件的现场使用寿命，该组件包括附接到衬底的第二表面的半导体芯片和附着到导电构件的印刷线路板。