摘要:
The inventive method for forming a cured film on a substrate surface comprises coating the surface with a room temperature curable organosiloxazane polymer comprising, in a molecule, (a) at least one organosiloxane unit represented by the unit formula (a) at least one organosiloxane unit represented by the unit formulaR.sup.1.sub.a SiO.sub.(4-a)/2,and (b) at least one organosilazane unit represented by the unit formulaR.sup.2.sub.b Si(NR.sup.3).sub.(4-b)/2,in which R.sup.1, R.sup.2 and R.sup.3 are each a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, not all of them being simultaneously hydrogen atoms, and the subscripts a and b are each a positive integer of 1, 2 or 3 with the proviso that a and b cannot be simultaneously equal to 3, in a molecule and subjecting the coating film to exposure to a moisture-containing atmosphere. The method is useful for forming a surface-protecting film or for imparting surface releasability.
摘要:
The invention provides a silicone-coated release paper having a coating surface film of an organopolysiloxane composition curable by irradiation with ultraviolet light or electron beams to give a fully cured film resistant to migration of the organopolysiloxane constituents therefrom on to other surfaces in contact therewith. The composition comprises (a) a diorganopolysiloxane terminatd at both molecular chain ends each with a divinylmethylsilyl group or trivinylsilyl group, (b) an organohydrogenpolysiloxane having at least 2 hydrogen atoms directly bonded to the silicon atoms in a molecule, (c) a catalytic amount of a platinum or rhodium catalyst and, optionally, (d) a compound of a rare earth element such as ceric oxide.
摘要:
The radiation-curable organopolysiloxane composition of the invention is quite free from the problem of the migration of silicone toward the surface of a body in contact with the surface of the cured film of the composition even by curing with an extremely small dose of radiation, e.g. ultraviolet light and electron beams, for curing. The mechanism for curing is in principle the radiation-induced addition reaction between the aliphatically unsaturated bonds in a first organopolysiloxane and the mercapto groups in a second organopolysiloxane but the aliphatically unsaturated bond in the first organopolysiloxane is bonded preferably remotely from the silicon atom with an electron-attractive atom or group intervening therebetween such as the divalent groups of the formula --O--CH.sub.2).sub.2 S-- and --CH.sub.2 --O--CH.sub.2 --S--.
摘要:
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要:
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要:
An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要:
The rubber composition is formulated with (A) a combination of an ethylene-propylene copolymeric rubber and an organopolysiloxane having at least two alkenyl groups per molecule as the polymeric base, (B) a reinforcing silica filler, (C) an alkoxysilane compound and (D) a thiocarbamyl-containing organosilane compound. The rubber composition can be vulcanized with an organic sulfur compound or organic peroxide as the vulcanizing agent to give a vulcanizate having quite satisfactory mechanical properties including, in particular, greatly improved heat resistance and greatly decreased permanent compression set even without using carbon black as the reinforcing filler. The omission of carbon black in the formulation gives an advantage that the rubber may be colored in any light color.
摘要:
A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a stronger bond between the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.
摘要:
A semiconductor laser device suitable as a light source for an optical disk may be operated at a low operating current with low noise for the 780 nm band. The device comprises: a certain conduction type Ga.sub.1-Y1 Al.sub.Y1 As first light guide layer, a Ga.sub.1-Y2 Al.sub.Y2 As second light guide layer of said certain conduction type, or an In.sub.0.5 Ga.sub.0.5 P or an In.sub.0.5 (GaAl).sub.0.5 P or an InGaAsP second light guide layer, successively formed one upon another at least in one side of the principal plane of an active layer; an opposite conduction type Ga.sub.1-Z Al.sub.Z As current blocking layer formed on the second light guide layer and provided with a stripe-like window; and a Ga.sub.1-Y3 Al.sub.Y3 As cladding layer of the same conduction type as the light guide layers formed on the stripe-like window. The relations of Z>Y3>Y2 and Y1>Y2 define the AlAs mole fractions.
摘要:
Organic silicon compounds comprising in the molecule thereof, a polysilane structural unit: -(R.sup.1 R.sup.2 Si).sub.n - and a structural unit: R.sup.3.sub.a SiO.sub.(4-a)/2 absorb UV in the range of 300-400 nm and are well soluble in organic solvent. These compounds are useful UV absorbers for cosmetic compositions.