BALANCE CIRCUIT AND INVERTER CIRCUIT COMPRISING THE SAME
    1.
    发明申请
    BALANCE CIRCUIT AND INVERTER CIRCUIT COMPRISING THE SAME 审中-公开
    平衡电路和包含该电路的逆变器电路

    公开(公告)号:US20110062880A1

    公开(公告)日:2011-03-17

    申请号:US12615926

    申请日:2009-11-10

    IPC分类号: H05B41/36

    CPC分类号: H05B41/282

    摘要: The present invention provides a balance circuit including: a first balance trans having a primary coil and a secondary coil, the primary coil being connected to an output terminal of a first lamp, and the secondary coil being connected to an output terminal of a second lamp and having a current controlled by the primary coil; and a second balance trans having a primary coil and a secondary coil, the primary coil being connected to an output terminal of a third lamp, and the secondary coil being connected to an output terminal of a fourth lamp and having a current controlled by the primary coil connected to the output terminal of the third lamp, wherein the secondary coil of the first balance trans is connected to the primary coil of the second balance trans, and an inverter circuit including the same.

    摘要翻译: 本发明提供一种平衡电路,包括:具有初级线圈和次级线圈的第一平衡反相器,所述初级线圈连接到第一灯的输出端子,所述次级线圈连接到第二灯的输出端子 并具有由初级线圈控制的电流; 以及具有初级线圈和次级线圈的第二平衡变换器,所述初级线圈连接到第三灯的输出端子,所述次级线圈连接到第四灯的输出端子并且具有由所述初级线圈和所述次级线圈控制的电流 连接到第三灯的输出端子的线圈,其中第一平衡反相器的次级线圈连接到第二平衡变换器的初级线圈,以及包括其的反相器电路。

    PRINTED CIRCUIT BOARD
    4.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号:US20100319980A1

    公开(公告)日:2010-12-23

    申请号:US12650474

    申请日:2009-12-30

    IPC分类号: H05K1/11 H05K1/00

    摘要: Disclosed herein is a printed circuit board. When power layers for supplying different voltages are sequentially stacked, a first EBG cell formed between a first power layer and a ground layer is arranged within a second EBG cell formed between a second power layer and the ground layer to allow the first EBG cell and the second EBG cell to have a double EBG structure. Accordingly, the present invention can prevent a DC open state while preventing noise and realizing band-stop characteristics.

    摘要翻译: 这里公开了一种印刷电路板。 当依次堆叠用于提供不同电压的功率层时,形成在第一功率层和接地层之间的第一EBG单元被布置在形成在第二功率层和接地层之间的第二EBG单元内,以允许第一EBG单元和 第二EBG细胞具有双EBG结构。 因此,本发明可以在防止噪声并实现带阻特性的同时防止DC打开状态。

    Method of preparing mixed formulation of sustained release microspheres by continuous one-step process
    5.
    发明授权
    Method of preparing mixed formulation of sustained release microspheres by continuous one-step process 有权
    通过连续一步法制备缓释微球混合制剂的方法

    公开(公告)号:US07399486B2

    公开(公告)日:2008-07-15

    申请号:US10562379

    申请日:2004-06-25

    IPC分类号: A61K9/22

    摘要: Disclosed is a method for preparing a mixed formulation of sustained release microspheres with various compositions by a continuous one-step process. The present method is characterized by preparing the mixed formulation of sustained release microspheres with different compositions by a continuous one-step process by continuously introducing the mixed fluids into a dryer from the two or more different fluids for preparation of sustained release microspheres containing a biodegradable polymer, a drug, an additive and a solvent with different types of contents or both of the components, by controlling the mixing ratios of the fluids according to the time, unlike a conventional method including spray-drying a mixture of microspheres containing a biodegradable polymer, a drug, an additive and a solvent with a single composition. The present method can achieve a desired drug release, which is difficult to be obtained by conventional microspheres with a single composition, by preparing microspheres by a continuous one-step process, and can simplify the conventional complex process of separately preparing several microsphere formulations and then mixing the formulations at a proper ratio to achieve a desired drug release.

    摘要翻译: 公开了通过连续一步法制备具有各种组成的缓释微球混合制剂的方法。 本发明的方法的特征在于通过连续一步法制备具有不同组成的缓释微球的混合制剂,通过从两种或更多种不同的流体连续引入混合流体到干燥器中,用于制备含有可生物降解聚合物的缓释微球 ,药物,添加剂和具有不同类型含量的溶剂或两种组分的溶剂通过控制流体的混合比而不同于常规方法,包括喷雾干燥含有可生物降解的聚合物的微球体的混合物, 药物,添加剂和具有单一组成的溶剂。 本发明方法可以通过连续一步法制备微球,实现通过具有单一组成的常规微球难以获得的所需药物释放,并且可以简化分别制备几种微球制剂的常规复合方法,然后 以适当的比例混合制剂以实现期望的药物释放。

    Lateral flow atomic layer deposition device
    7.
    发明授权
    Lateral flow atomic layer deposition device 有权
    侧流原子层沉积装置

    公开(公告)号:US09145609B2

    公开(公告)日:2015-09-29

    申请号:US13439178

    申请日:2012-04-04

    IPC分类号: C23C16/455

    摘要: A lateral flow atomic layer deposition device according to an exemplary embodiment of the present invention eliminates a gas flow control plate in a conventional lateral flow atomic layer deposition device and controls shapes of a gas input part and a gas output part in a reactor cover to make a gas flow path to a center of a substrate shorter than a gas flow path to an edge of the substrate and thereby increase the amount of gas per unit area flowing to the center of the substrate. Therefore, film thickness in the center of the substrate in the lateral flow reactor increases.

    摘要翻译: 根据本发明的示例性实施例的侧流原子层沉积装置消除了常规横流原子层沉积装置中的气流控制板,并控制反应器盖中的气体输入部分和气体输出部分的形状,以使 通向基板中心的气体流动通道,该气体流动通道短于通向基板边缘的气体流动路径,从而增加每单位面积流到基板中心的气体量。 因此,侧流反应器中的基板中心的膜厚度增加。

    Printed circuit board including electromagnetic bandgap structure
    8.
    发明授权
    Printed circuit board including electromagnetic bandgap structure 失效
    印刷电路板包括电磁带隙结构

    公开(公告)号:US08711055B2

    公开(公告)日:2014-04-29

    申请号:US12650482

    申请日:2009-12-30

    IPC分类号: H01Q15/02

    摘要: Disclosed is a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna.

    摘要翻译: 公开了一种印刷电路板,其包括设置在天线周围的电磁带隙结构,以防止噪声被传输到天线。 印刷电路板包括天线,电路芯片,多个金属层和多个电介质层,用于将信号传输到天线的一对传输线以及设置在天线和电路芯片之间的电磁带隙结构 并且用于防止电磁波从电路芯片传输到天线。