摘要:
The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.
摘要:
A device for marking hidden delaminations in a structure subject to hidden delaminations comprising a wheeled spray paint can holder, wherein said holder is adapted to hold a paint can containing a nozzle which when depressed releases an upward spray of paint, and wherein said holder is fixedly connected to an outer tube containing therein an inner tube adapted for freely sliding inside said outer tube, wherein said inner tube contains a section extending beyond said outer tube in an upper axial direction, and wherein said inner tube is mounted on top of a spring in said outer tube, and wherein said inner tube contains a protrusion in said section, and wherein said inner tube contains one or more wheels, at or near the upper end of said section, for rolling said holder on an overhead surface, and wherein said outer tube contains means fixedly attached thereto for engaging said spring and located inside said outer tube and below said spring, and wherein when said outer tube is adapted through said means to connect to an extension pole through said outer tube so as to engage said spring, and wherein when said extension pole is connected in a fixed relationship to said means and is urged against said spring while said one or more wheels are in contact with said overhead surface, said protrusion is urged against said nozzle, thereby releasing said upward spray of paint.
摘要:
The present invention relates to cleaning processes for semiconductor substrates. More particularly, the present inventive method can provide enhanced particle removal efficiencies at a given material loss. In fact, in certain embodiments, the present method can achieve particle removal efficiencies of at least about 90%, while yet removing less than about 2 angstroms of any oxide present on the semiconductor substrate. As such, the present methods find particular applicability in the processing of advanced technology nodes.
摘要:
Methods and apparatus for provisioning the use of multiple readers and/or wireless communication protocols within a defined area are provided. More specifically, a coordinator or the like can be used to manage the activation and deactivation of the multiple readers and/or communication protocols within a single reader such that interference between disparate technologies is avoided.
摘要:
The present invention provides improvements to the use of silyating agents in semiconductor processing. More particularly, the silyating agents may be provided in combination with a substantially non-flammable ether, so that the combination is substantially non-flammable. Additionally, the silyating agent may be utilized in vapor form, or applied in conjunction with the electromagnetic radiation. Each of these embodiments can enhance the usability of the silyating agent, i.e., by rendering the silyating agent more safe, more easily utilized in a variety of processing equipment and/or by enhancing the passivation efficacy/efficiency of the silyating agent.
摘要:
Compositions consisting essentially of the reaction product (including unreacted components) obtained by mixing (a) one or more selected fluorinated compounds and (b) one or more selected organic agents and providing in-situ generation of fluoride ions. Also, kits for forming such compositions and methods for using such compositions.
摘要:
The present invention relates to methods of processing wafer-like objects (e.g., having an exposed copper feature and/or including low-k dielectric material) with ozone. In certain preferred embodiments, a base is also used to process the wafer-like object(s).
摘要:
A device for detecting hidden delaminations in a structure subject to hidden delaminations comprising a rotary percussion tool head adapted at an end thereof to connect to an extension pole, wherein said head comprises at least one circular member, each circular member having on the periphery thereof projections extending in the radial direction and spaced apart in the circumferential direction, and a method of using same.