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    Adapter plate for polishing and cleaning electrodes
    4.
    发明授权
    Adapter plate for polishing and cleaning electrodes 有权
    用于抛光和清洁电极的适配器板

    公开(公告)号：US09393666B2

    公开(公告)日：2016-07-19

    申请号：US14137049

    申请日：2013-12-20

    Applicant: Lam Research Corporation

    Inventor： Catherine Zhou ,  Duane Outka ,  Cliff LaCroix ,  Hong Shih

    IPC: B24B41/06 ,  H01J37/32

    CPC classification number: B24B41/06 ,  H01J37/3288

    Abstract: An adapter plate configured to be attachable to a universal platen of a cleaning unit for cleaning upper electrodes from a plasma processing chamber is disclosed, the adapter plate includes a support surface and a mounting surface configured to be fastened to the universal platen of the cleaning unit. The support surface is configured to support an inner electrode or an outer electrode of a showerhead electrode assembly for cleaning upper or lower surfaces thereof. The support surface having a first set of holes configured to receive pins engaged in an upper surface of the inner electrode, a second set of holes configured to receive pins surrounding an outer periphery of the inner electrode, a third set of holes configured to receive pins engaged in an upper surface of the outer electrode, and a fourth set of holes configured to receive pins surrounding an outer periphery of the outer electrode.

    Abstract translation: 公开了一种适配器板，其构造成可附接到用于从等离子体处理室清洁上部电极的清洁单元的通用压板上，所述适配器板包括支撑表面和安装表面，所述安装表面被构造成紧固到所述清洁单元的通用压板 。 支撑表面被配置为支撑用于清洁其上表面或下表面的喷头电极组件的内电极或外电极。 所述支撑表面具有第一组孔，所述第一组孔用于接纳接合在所述内部电极的上表面中的销;第二组孔，被配置为接纳围绕所述内部电极的外周的引脚;第三组孔， 接合外电极的上表面，以及第四组孔，其构造成接收围绕外电极的外周的引脚。

    Platen and adapter assemblies for facilitating silicon electrode polishing
    5.
    发明授权
    Platen and adapter assemblies for facilitating silicon electrode polishing 有权
    用于促进硅电极抛光的压板和适配器组件

    公开(公告)号：US09120201B2

    公开(公告)日：2015-09-01

    申请号：US14021300

    申请日：2013-09-09

    Applicant: Lam Research Corporation

    Inventor： Armen Avoyan ,  Duane Outka ,  Catherine Zhou ,  Hong Shih

    IPC: B24B41/06 ,  B08B3/08 ,  B08B3/12 ,  C11D7/08 ,  C11D7/26 ,  C11D11/00

    CPC classification number: B24B41/06 ,  B08B3/08 ,  B08B3/12 ,  C11D7/08 ,  C11D7/261 ,  C11D7/265 ,  C11D11/0047

    Abstract: A process is provided for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen secured to the polishing, which can comprise a plurality of electrode mounts arranged to project from an electrode engaging face of the dual function electrode platen. The electrode mounts and mount receptacles can be configured to permit non-destructive engagement and disengagement of the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode. The silicon electrode can be polished by (i) engaging the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode via the electrode mounts and mount receptacles, (ii) utilizing the polishing turntable to impart rotary, and (iii) contacting an exposed face of the silicon electrode with a polishing surface as the silicon electrode. Additional embodiments are contemplated, disclosed and claimed.

    Abstract translation: 提供了一种利用抛光转盘和固定到抛光的双功能电极压板来抛光硅电极的工艺，其可以包括布置成从双功能电极压板的电极接合面突出的多个电极安装件。 电极安装座和安装座可构造为允许电极台板的电极接合面和硅电极的台板接合面的非破坏性接合和分离。 可以通过（i）通过电极座和安装座接合电极台板的电极接合面和硅电极的台板接合面，（ii）利用抛光转台来旋转，并（iii） ）使硅电极的暴露面与作为硅电极的抛光表面接触。 预期，公开和要求保护附加实施例。

    METHOD FOR TREATING A NONHOMOGENOUS SURFACE
    6.
    发明申请
    METHOD FOR TREATING A NONHOMOGENOUS SURFACE 有权
    处理非均质表面的方法

    公开(公告)号：US20170074646A1

    公开(公告)日：2017-03-16

    申请号：US14855242

    申请日：2015-09-15

    Applicant: Lam Research Corporation

    Inventor： Amir Yasseri ,  Duane Outka ,  Michael Lopez

    IPC: G01B11/30 ,  H01J37/32

    CPC classification number: G01B11/30 ,  H01J37/32009 ,  H01J37/32119 ,  H01J37/32935

    Abstract: A method for treating a nonhomogeneous material surface of an object is provided. A plurality of test patches of the surface is treated for different amounts of time wherein the plurality of test patches have a total surface area. A property of each test patch is measured. A calibration curve of the property is generated with respect to time. The calibration curve and a target property are used to obtain a target time. A surface of the object with a surface area, which is greater than the total surface area of the plurality of test patches, is treated for the target time.

    Abstract translation: 提供了一种用于处理物体的非均匀材料表面的方法。 将多个表面的测试贴片处理不同的时间量，其中多个测试贴片具有总表面积。 测量每个测试补丁的属性。 产生相对于时间的属性的校准曲线。 使用校准曲线和目标属性来获得目标时间。 处理具有大于多个测试片的总表面积的表面积的物体的表面，以达到目标时间。

    ADAPTER PLATE FOR POLISHING AND CLEANING ELECTRODES
    7.
    发明申请
    ADAPTER PLATE FOR POLISHING AND CLEANING ELECTRODES 有权
    用于抛光和清洁电极的适配板

    公开(公告)号：US20150179416A1

    公开(公告)日：2015-06-25

    申请号：US14137049

    申请日：2013-12-20

    Applicant: Lam Research Corporation

    Inventor： Catherine Zhou ,  Duane Outka ,  Cliff LaCroix ,  Hong Shih

    IPC: H01J37/32 ,  B24B41/06

    CPC classification number: B24B41/06 ,  H01J37/3288

    Abstract: An adapter plate configured to be attachable to a universal platen of a cleaning unit for cleaning upper electrodes from a plasma processing chamber is disclosed, the adapter plate includes a support surface and a mounting surface configured to be fastened to the universal platen of the cleaning unit. The support surface is configured to support an inner electrode or an outer electrode of a showerhead electrode assembly for cleaning upper or lower surfaces thereof. The support surface having a first set of holes configured to receive pins engaged in an upper surface of the inner electrode, a second set of holes configured to receive pins surrounding an outer periphery of the inner electrode, a third set of holes configured to receive pins engaged in an upper surface of the outer electrode, and a fourth set of holes configured to receive pins surrounding an outer periphery of the outer electrode.

    Abstract translation: 公开了一种适配器板，其构造成可附接到用于从等离子体处理室清洁上部电极的清洁单元的通用压板上，所述适配器板包括支撑表面和安装表面，所述安装表面被构造成紧固到所述清洁单元的通用压板 。 支撑表面被配置为支撑用于清洁其上表面或下表面的喷头电极组件的内电极或外电极。 所述支撑表面具有第一组孔，所述第一组孔用于接纳接合在所述内部电极的上表面中的销;第二组孔，被配置为接纳围绕所述内部电极的外周的引脚;第三组孔， 接合外电极的上表面，以及第四组孔，其构造成接收围绕外电极的外周的引脚。

    PLATEN AND ADAPTER ASSEMBLIES FOR FACILITATING SILICON ELECTRODE POLISHING
    9.
    发明申请
    PLATEN AND ADAPTER ASSEMBLIES FOR FACILITATING SILICON ELECTRODE POLISHING 审中-公开
    用于促进硅电极抛光的板和适配器组件

    公开(公告)号：US20140030966A1

    公开(公告)日：2014-01-30

    申请号：US14021300

    申请日：2013-09-09

    Applicant: Lam Research Corporation

    Inventor： Armen Avoyan ,  Duane Outka ,  Catherine Zhou ,  Hong Shih

    IPC: B24B41/06

    CPC classification number: B24B41/06 ,  B08B3/08 ,  B08B3/12 ,  C11D7/08 ,  C11D7/261 ,  C11D7/265 ,  C11D11/0047

    Abstract: A process is provided for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen secured to the polishing, which can comprise a plurality of electrode mounts arranged to project from an electrode engaging face of the dual function electrode platen. The electrode mounts and mount receptacles can be configured to permit non-destructive engagement and disengagement of the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode. The silicon electrode can be polished by (i) engaging the electrode engaging face of the electrode platen and the platen engaging face of the silicon electrode via the electrode mounts and mount receptacles, (ii) utilizing the polishing turntable to impart rotary, and (iii) contacting an exposed face of the silicon electrode with a polishing surface as the silicon electrode. Additional embodiments are contemplated, disclosed and claimed.

    Abstract translation: 提供了一种利用抛光转盘和固定到抛光的双功能电极压板来抛光硅电极的工艺，其可以包括布置成从双功能电极压板的电极接合面突出的多个电极安装件。 电极安装座和安装座可构造为允许电极台板的电极接合面和硅电极的台板接合面的非破坏性接合和分离。 可以通过（i）通过电极座和安装座接合电极台板的电极接合面和硅电极的台板接合面，（ii）利用抛光转台来旋转，并（iii） ）使硅电极的暴露面与作为硅电极的抛光表面接触。 预期，公开和要求保护附加实施例。

    Conditioning chamber component
    10.
    发明授权
    Conditioning chamber component 有权

    公开(公告)号：US10967407B2

    公开(公告)日：2021-04-06

    申请号：US15969626

    申请日：2018-05-02

    Applicant: Lam Research Corporation

    Inventor： Amir A. Yasseri ,  Hong Shih ,  John Daugherty ,  Duane Outka ,  Lin Xu ,  Armen Avoyan ,  Cliff La Croix ,  Girish Hundi

    IPC: B08B7/00 ,  B08B7/04 ,  B08B5/02 ,  B08B3/04 ,  B08B3/14 ,  B08B3/12 ,  H01J37/32

    Abstract: An apparatus for conditioning a component of a processing chamber is provided. A tank for holding a megasonic conditioning solution is provided. A mount holds the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution. A megasonic conditioning solution inlet system delivers the megasonic conditioning solution to the tank. A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution. A megasonic conditioning solution drain system drains the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution. An actuator moves the megasonic transducer head across the tank.

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