公开(公告)号：US20190214514A1

公开(公告)日：2019-07-11

申请号：US16315521

申请日：2017-07-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Eun Ju HONG

IPC: H01L31/0352 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/167 ,  H01L31/107

CPC classification number: H01L31/035281 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02165 ,  H01L31/107 ,  H01L31/167 ,  H01L33/00 ,  H01L33/02 ,  H01L33/22 ,  H01L33/36 ,  H01L33/40 ,  H01L33/58 ,  H01L33/62

Abstract: An embodiment provides a semiconductor element, which comprises: a substrate; and a semiconductor structure disposed on the substrate, wherein the semiconductor structure comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and a light absorption layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and the light absorption layer has a value of 1.2 to 1.5 as a ratio of a maximum outer periphery length of an upper surface thereof with respect to a maximum area of the upper surface thereof.

公开(公告)号：US20160336497A1

公开(公告)日：2016-11-17

申请号：US15150161

申请日：2016-05-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Don SONG ,  Ki Man KANG ,  Seung Hwan KIM ,  Sung Won David ROH ,  Jin Wook LEE ,  Eun Ju HONG ,  Yee Rang HONG

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/64 ,  H01L33/48 ,  H01L33/46 ,  H01L33/60 ,  H01L33/32 ,  H01L33/40

CPC classification number: H01L33/62 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/46 ,  H01L33/48 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2933/0016

Abstract: A light emitting device having an enhanced surface property and an electrical property is provided. The light emitting device includes a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode disposed on one side of the light emitting structure and electrically connected to the first semiconductor layer, a second electrode disposed on one side of the light emitting structure and electrically connected to the second semiconductor layer, and an ohmic contact including a first layer disposed between the second electrode and the second semiconductor layer and having aluminum (Al), a second layer including at least one MxAly alloy formed by a reaction with Al included in the first layer, and a third layer disposed on the second layer and having gold (Au) is provided.

Abstract translation: 提供具有增强的表面性质和电性能的发光器件。 发光器件包括：发光结构，包括第一半导体层，有源层和第二半导体层，第一电极，设置在发光结构的一侧并与第一半导体层电连接;第二电极， 在所述发光结构的一侧并且电连接到所述第二半导体层，以及欧姆接触，所述欧姆接触包括设置在所述第二电极和所述第二半导体层之间并具有铝（Al）的第一层，第二层包括至少一个M×Aly 提供了通过与包含在第一层中的Al的反应形成的合金和设置在第二层上并具有金（Au）的第三层。

公开(公告)号：US20150098224A1

公开(公告)日：2015-04-09

申请号：US14509195

申请日：2014-10-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Eun Ju HONG ,  Jung Hun OH

IPC: H01L33/62 ,  F21K99/00 ,  H01L33/06 ,  H01L33/60 ,  H01L33/30 ,  H01L33/12 ,  F21V3/04 ,  F21V8/00

CPC classification number: H01L33/62 ,  F21K9/00 ,  F21V3/049 ,  F21V3/10 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  G02B6/0011 ,  H01L24/14 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments provide a light emitting device including a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a sub-mount, first and second metal pads disposed on the sub-mount and electrically spaced apart from one another, a one first bump disposed between the first conductive semiconductor layer and the first metal pad and a second bump located between the second conductive semiconductor layer and the second metal pad. A plurality of active areas in which The first semiconductor layer and the active layer are disposed are spaced apart from one another when viewed in plan.

Abstract translation: 实施例提供一种发光器件，其包括衬底，设置在衬底下方的发光结构，所述发光结构包括第一导电半导体层，有源层和第二导电半导体层，子安装，第一和第二金属焊盘 设置在子安装座上并彼此电隔离，设置在第一导电半导体层和第一金属焊盘之间的一个第一凸块和位于第二导电半导体层和第二金属焊盘之间的第二凸块。 其中设置有第一半导体层和有源层的多个有效区域在平面图中观察时彼此间隔开。