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    Method for producing a pressure sensor
    4.
    发明授权
    Method for producing a pressure sensor 有权
    压力传感器的制造方法

    公开(公告)号：US06804883B1

    公开(公告)日：2004-10-19

    申请号：US09603060

    申请日：2000-06-26

    申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    IPC分类号： H01R4300

    CPC分类号： B81C1/00333 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/0084 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49174 ,  Y10T29/49176 ,  H01L2924/00014

    摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

    摘要翻译： 一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。 半导体压力传感器电连接到引线栅格的接触部分。 引线格栅与半导体压力传感器一起插入注塑模具中。 模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。 注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。 为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

    Housing and methods of producing a housing
    5.
    发明授权
    Housing and methods of producing a housing 失效
    住房和生产住房的方法

    公开(公告)号：US06661668B2

    公开(公告)日：2003-12-09

    申请号：US10031814

    申请日：2002-05-31

    申请人： Kurt Weiblen

    发明人： Kurt Weiblen

    IPC分类号： H05K506

    CPC分类号： H05K5/063

    摘要： A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.

    摘要翻译： 一种壳体，特别是电子部件用壳体，其包括由塑料制成并具有至少一个开口的壳体部分和用于封闭开口的盖部。 提出盖部分是作为金属冲压部分制成的，盖部分的冲压边缘在盖部分的第一侧上具有冲孔脊，在与第一侧相对的第二侧具有冲头压痕，盖子 部分经由第二侧被压入壳体部分的开口中，使得盖部分经由至少两个分布在盖部分的周边上的边缘部分并且咬合而抵靠开口的内壁的指定部分 通过冲孔脊以倒钩状的方式进入内壁的指定部分。

    Method for manufacturing a pressure sensor
    6.
    发明授权
    Method for manufacturing a pressure sensor 有权
    制造压力传感器的方法

    公开(公告)号：US06300169B1

    公开(公告)日：2001-10-09

    申请号：US09603082

    申请日：2000-06-26

    申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

    IPC分类号： H01L2144

    CPC分类号： G01L19/143 ,  G01L19/141 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.

    摘要翻译： 在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。 具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。 在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。 在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开 装配段 由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在 避免了将注射成型化合物完全渗透到间隙中。

    Electromagnetic compatibility filter utilizing inherently formed capacitance
    8.
    发明授权
    Electromagnetic compatibility filter utilizing inherently formed capacitance 失效
    电磁兼容滤波器利用固有的电容

    公开(公告)号：US5525943A

    公开(公告)日：1996-06-11

    申请号：US223071

    申请日：1994-04-04

    申请人： Walter Roethlingshoefer ,  Kurt Weiblen ,  Peter Tauber ,  Uwe Lipphardt

    发明人： Walter Roethlingshoefer ,  Kurt Weiblen ,  Peter Tauber ,  Uwe Lipphardt

    IPC分类号： H04B15/02 ,  H05K9/00 ,  H03H7/00

    CPC分类号： H04B15/02

    摘要： An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.

    摘要翻译： 用于混合技术电路部件的电磁兼容（EMC）滤波器，具有载流线路和接地导体，用于防止电磁干扰。 载流线和接地导体布置在陶瓷板上。 载流线由电介质覆盖，电介质又由与接地导体电接触的上金属屏蔽覆盖。 下部金属屏幕布置在载流线下方的陶瓷板上，并与接地导体电接触。

    Container for an analysis chip
    9.
    发明授权
    Container for an analysis chip 有权
    容器用于分析芯片

    公开(公告)号：US07585662B2

    公开(公告)日：2009-09-08

    申请号：US10477160

    申请日：2002-03-27

    申请人： Kurt Weiblen ,  Hubert Benzel

    发明人： Kurt Weiblen ,  Hubert Benzel

    IPC分类号： C12M1/34 ,  C12M3/00 ,  C12Q1/70

    CPC分类号： B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2200/0689 ,  B01L2300/045 ,  B01L2300/0636 ,  B01L2300/0877

    摘要： A receptacle is provided for accommodating an analysis chip, which receptacle has openings in a housing having access to the analysis chip, which openings are protected from external influences by a movable protector, and for carrying out an analysis, a mechanism for moving the protector is provided such that an opening in the protector coincides with the receptacle openings.

    摘要翻译： 提供容纳分析芯片的插座，该插座在具有进入分析芯片的壳体中具有开口，该开口被可移动保护器保护免受外部影响，并且为了进行分析，用于移动保护器的机构是 设置成使得保护器中的开口与容器开口重合。

    Electronic device
    10.
    发明授权
    Electronic device 失效
    电子设备

    公开(公告)号：US06778400B2

    公开(公告)日：2004-08-17

    申请号：US10030994

    申请日：2002-05-13

    申请人： Juergen Kurle ,  Kurt Weiblen ,  Stefan Pinter ,  Frieder Haag

    发明人： Juergen Kurle ,  Kurt Weiblen ,  Stefan Pinter ,  Frieder Haag

    IPC分类号： H05K500

    CPC分类号： H01R12/585 ,  H05K7/1417 ,  H05K7/142

    摘要： An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board. To protect impact-sensitive and vibration-sensitive components, it is proposed to provide the contact elements, on a part of their length not inserted into the contact openings, with elastically deformable segments and to flexibly support the printed circuit board in the housing part by the contact element configured in this way, and, additionally, to connect it via damping elements at least indirectly to the housing part.

    摘要翻译： 一种电子设备，包括具有至少一个可闭合开口和一个插入部分的壳体部分，所述壳体部分容纳布置在其上的至少一个电气和/或电子部件的印刷电路板和电接触元件，其中 电连接到插入部分，并且其在壳体内部中的彼此平行延伸并且沿至少一个开口的方向突出的端部，端部穿过印刷电路板的接触开口，并且是 与印刷电路板导电连接。 为了保护冲击敏感和振动敏感的部件，建议在其长度的一部分长度上未插入接触开口中的可弹性变形的部分提供接触元件，并且通过以下方式灵活地支撑外壳部件中的印刷电路板： 以这种方式构造的接触元件，并且另外通过阻尼元件至少间接地连接到壳体部分。