摘要:
A surface micromachined electromagnetically radiating antenna includes a coplanar waveguide on a ground plane coated substrate having a conductor path. The conductor path is coupled to a monopole conductor, which has a generally-cylindrical backbone erected vertically from the substrate and a metal layer deposited on the backbone at a predetermined thickness. The antenna may be fabricated by depositing an epoxy on the ground plane coated substrate to a predetermined depth and according to a pattern. The epoxy is exposed to an ultraviolet source that develops one or more columns according to the pattern. A seed layer of metal may be formed on the developed column. A conductive metal is electrodeposited over the column surface to produce the monopole antenna. Other antenna may be created by adding monopoles and/or conductive metal patches and/or strips that are positioned atop the monopoles and elevated from the substrate.
摘要:
A surface micromachined electromagnetically radiating antenna includes a coplanar waveguide on a ground plane coated substrate having a conductor path. The conductor path is coupled to a monopole conductor, which has a generally-cylindrical backbone erected vertically from the substrate and a metal layer deposited on the backbone at a predetermined thickness. The antenna may be fabricated by depositing an epoxy on the ground plane coated substrate to a predetermined depth and according to a pattern. The epoxy is exposed to an ultraviolet source that develops one or more columns according to the pattern. A seed layer of metal may be formed on the developed column. A conductive metal is electrodeposited over the column surface to produce the monopole antenna. Other antenna may be created by adding monopoles and/or conductive metal patches and/or strips that are positioned atop the monopoles and elevated from the substrate.
摘要:
Methods for creating one or more structures in a micromachined device. In one arrangement, the methods include the steps of providing a substrate, forming upstanding nonconductive mold walls on the substrate so that first and second wells are formed, the second well being wider than the first well. The method further includes applying a first material to the surface of the wells so that the first well fills with the first material before the second well, and removing the first material from the second well while leaving a portion in the first well.
摘要:
The present invention comprises methods and devices for thermal treatment of a barrier to increase the permeability of the barrier. One form of increasing the permeability of the barrier comprises forming micropores which may be used for administration of active agents across the barrier, or may be used for sampling or collecting fluids, or may be used for detecting, measuring or determining analytes, or may be used for monitoring of physiological or other conditions. Devices of the present invention may comprise microheaters that are activated by inductive or ohmic heating power supply components.
摘要:
The present invention comprises methods and devices for thermal treatment of a barrier to increase the permeability of the barrier. One form of increasing the permeability of the barrier comprises forming micropores which may be used for administration of active agents across the barrier, or may be used for sampling or collecting fluids, or may be used for detecting, measuring or determining analytes, or may be used for monitoring of physiological or other conditions. Devices of the present invention may comprise microheaters that are activated by inductive or ohmic heating power supply components.
摘要:
A representative method for manufacturing a highly-laminated magnetic inductor core includes: depositing at least a first layer of a ferromagnetic material; depositing at least a first layer of a sacrificial conductive material; depositing a support structure formed of a ferromagnetic material; and removing the sacrificial conductive material, thereby leaving the at least first layer of ferromagnetic material mechanically supported by the support structure.
摘要:
The present invention relates to a hydrogen production module by an integrated reaction/separation process, and a hydrogen production reactor using the same, and more specifically, provides a hydrogen production apparatus which laminates a plurality of layered unit cells, is mounted in a pressure-resistant chamber, and can be operated at a high pressure, wherein the unit cell comprises a first modified catalyst, and a second modified catalyst opposite to a hydrogen separator. The hydrogen production module can produce hydrogen using a hydrocarbon, carbon monoxide and an alcohol as sources. Particularly, all the modified catalysts are formed into a porous metal plate form, thereby maximizing the heat transfer effect necessary for reaction. While a reaction and separation of hydrogen simultaneously occur, separated reactants permeate the first modified catalyst so as to come in contact with the same, and then pass through the gap between the hydrogen separator and the second modified catalyst opposite to each other. Therefore, it is possible to obtain a high efficiency over the equilibrium conversion rate of reaction temperature, and high purity hydrogen can be obtained.
摘要:
The present invention relates to a multilayer module for hydrogen separation using a pressure-resistant chamber so that unit cells using a metal separation membrane through which only hydrogen selectively passes are stacked to improve separation efficiency, and a mixed gas is uniformly supplied into each of the unit cells. In the multilayer module, the unit cells are stacked on each other, and the mixed gas is supplied into the chamber. Also, mixed gas input ports are each disposed in the side surfaces of the unit cells to supply the mixed gas.
摘要:
Semiconductor package devices and methods of forming the semiconductor package devices are provided. The semiconductor package devices may include a lower package including a lower semiconductor chip on a lower substrate, an upper package including an upper semiconductor chip on an upper substrate. The upper substrate may include a protruding part corresponding to the lower semiconductor chip and a connection part that has a bottom surface lower than a bottom surface of the protruding part and is disposed around the protruding part. The semiconductor package devices may also include a heat dissipation part in a space between the lower semiconductor chip and the protruding part on the upper substrate and a package connection pattern electrically connecting the lower package to the upper package.
摘要:
The present invention relates to a multilayer module for hydrogen separation using a pressure-resistant chamber so that unit cells using a metal separation membrane through which only hydrogen selectively passes are stacked to improve separation efficiency, and a mixed gas is uniformly supplied into each of the unit cells. In the multilayer module, the unit cells are stacked on each other, and the mixed gas is supplied into the chamber. Also, mixed gas input ports are each disposed in the side surfaces of the unit cells to supply the mixed gas.