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    Device for measuring the average value of pulse signals
    1.
    发明授权
    Device for measuring the average value of pulse signals 失效
    用于测量脉冲信号平均值的装置

    公开(公告)号：US5416798A

    公开(公告)日：1995-05-16

    申请号：US965272

    申请日：1993-08-20

    申请人： Masaaki Hirose ,  Kazuo Katoh ,  Yutaka Ueki ,  Yohei Hirakoso ,  Mitsunori Satoh ,  Takashi Kosuge

    发明人： Masaaki Hirose ,  Kazuo Katoh ,  Yutaka Ueki ,  Yohei Hirakoso ,  Mitsunori Satoh ,  Takashi Kosuge

    IPC分类号： G01R19/00 ,  G01R29/08 ,  G01R29/26 ,  H04B3/46 ,  H04B17/00

    CPC分类号： G01R19/003 ,  G01R29/0892 ,  G01R29/26

    摘要： The device of the present invention is used to measure the intensity of a disturbing wave and measures an average value of impulsive noise. The invention permits accurate and short-time measurements. Impulsive noise, which is input via a variable attenuator, a frequency converter, an intermediate-frequency amplifier and a band-pass filter of a 9 or 120 kHz pass frequency, is provided to a linear detector. The detected output is applied to a low-pass filter which is composed of CR elements and whose cut-off frequency is tens of kilohertz. By the low-pass filter, the peak value of the detected output is lowered and its width is increased. The filter output is converted by an A-D converter to a digital signal. Digital values at respective sample points in the digital signal of one frame are added by an arithmetic circuit, and the added value is divided by the number of samples to obtain an average value, which is displayed.

    摘要翻译： PCT No.PCT / JP92 / 00677 Sec。 371日期：1993年8月20日 102（e）日期1993年8月20日PCT提交1992年5月26日PCT公布。 第WO92 / 21984号公报 日本1992年12月10日。本发明的装置用于测量干扰波的强度并测量脉冲噪声的平均值。 本发明允许精确和短时间的测量。 通过可变衰减器，频率转换器，中频放大器和9或120kHz通过频率的带通滤波器输入的脉冲噪声被提供给线性检测器。 检测到的输出被施加到由CR元件组成并且截止频率为几十赫兹的低通滤波器。 通过低通滤波器，检测输出的峰值降低，其宽度增加。 滤波器输出由A-D转换器转换为数字信号。 通过算术电路将一帧的数字信号中的各采样点的数字值相加，并将该相加值除以采样数，得到显示的平均值。

    Phase difference detector
    2.
    发明授权
    Phase difference detector 失效
    相位差检测器

    公开(公告)号：US4178554A

    公开(公告)日：1979-12-11

    申请号：US844989

    申请日：1977-10-25

    申请人： Takashi Sase ,  Kazuo Katoh ,  Takeshi Hirayama

    发明人： Takashi Sase ,  Kazuo Katoh ,  Takeshi Hirayama

    IPC分类号： G04F10/00 ,  G04F10/04 ,  H03K5/26 ,  H03K5/20 ,  H03K3/86

    CPC分类号： H03K5/26

    摘要： There is provided a pair of flip-flops, each of which is set before appearance of every one of two input signals to be compared. One of the input signals is applied to a reset terminal of the first flip-flop through an inverter, and the other input signal to that of the second flip-flop through another inverter. There is further provided a pair of AND gates. A set output of the first flip-flop is led to one of two input terminals of the first AND gate through a delay element, and a reset output of the second flip-flop is connected to the other input terminal of the first AND gate directly. The set output of the output of the second flip-flop is coupled to one of two input terminals of the second AND gate through another delay element and the reset output of the first flip-flop is connected to the other input terminal second AND gate directly.

    摘要翻译： 提供了一对触发器，每个触发器在出现之前设置为要比较的两个输入信号中的每一个。 输入信号中的一个通过反相器施加到第一触发器的复位端，另一个输入信号通过另一个反相器施加到第二触发器的另一个。 还提供了一对与门。 第一触发器的设定输出通过延迟元件被引导到第一与门的两个输入端之一，第二触发器的复位输出直接连接到第一与门的另一个输入端 。 第二触发器的输出的设定输出通过另一延迟元件耦合到第二与门的两个输入端中的一个，并且第一触发器的复位输出直接连接到另一输入端第二与门 。

    Electronic package encapsulating electronic components therein
    5.
    发明申请
    Electronic package encapsulating electronic components therein 有权
    在其中封装电子元件的电子封装

    公开(公告)号：US20080130246A1

    公开(公告)日：2008-06-05

    申请号：US11826552

    申请日：2007-07-17

    申请人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

    发明人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

    IPC分类号： H05K7/00

    CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

    摘要翻译： 包括金属构件和安装在金属构件上的诸如半导体元件的电子部件的电子部件单元用诸如环氧树脂的模塑树脂封装，从而形成电子封装。 电子部件单元被由诸如树脂的材料制成的底漆覆盖以增加模制树脂对电子部件单元的粘合力。 将模塑树脂和底漆两者的玻璃化转变温度设定为高于200℃的温度，以保持粘合力至少不超过200℃的环境温度，并确保电子的可靠性 包。 连接到电子部件的金属引线可以与电子部件单元一起封装。 电子部件单元的整个表面可以被底漆覆盖，以进一步提高粘合力。

    Electronic package encapsulating electronic components therein
    7.
    发明授权
    Electronic package encapsulating electronic components therein 有权
    在其中封装电子部件的电子封装

    公开(公告)号：US07667978B2

    公开(公告)日：2010-02-23

    申请号：US11826552

    申请日：2007-07-17

    申请人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

    发明人： Shinsuke Nagasaka ,  Kazuo Katoh ,  Akira Shintai ,  Takashi Aoki

    IPC分类号： H01R7/00

    CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An electronic component unit including a metallic member and an electronic component, such as a semiconductor element, mounted on the metallic member is encapsulated with molding resin such as epoxy resin, thereby forming an electronic package. The electronic component unit is covered with primer made of a material such as resin to increase an adhesive force of the molding resin to the electronic component unit. A glass transition temperature of both of the molding resin and the primer is set to a temperature higher than 200° C. to keep the adhesive force unchanged at least up to the ambient temperature of 200° C. and to secure a reliability of the electronic package. A metallic lead wire connected to the electronic component may be encapsulated together with the electronic component unit. An entire surface of the electronic component unit may be covered with the primer to further improve the adhesive force.

    摘要翻译： 包括金属构件和安装在金属构件上的诸如半导体元件的电子部件的电子部件单元用诸如环氧树脂的模塑树脂封装，从而形成电子封装。 电子部件单元被由诸如树脂的材料制成的底漆覆盖以增加模制树脂对电子部件单元的粘合力。 将模塑树脂和底漆两者的玻璃化转变温度设定为高于200℃的温度，以保持粘合力至少不超过200℃的环境温度，并确保电子的可靠性 包。 连接到电子部件的金属引线可以与电子部件单元一起封装。 电子部件单元的整个表面可以被底漆覆盖，以进一步提高粘合力。