公开(公告)号：US5437558A

公开(公告)日：1995-08-01

申请号：US109264

申请日：1993-08-20

申请人： Masahiko Sakuraoka ,  Kouichi Hara ,  Kiyoshi Kuwabara ,  Misao Umematsu

发明人： Masahiko Sakuraoka ,  Kouichi Hara ,  Kiyoshi Kuwabara ,  Misao Umematsu

IPC分类号： H01R13/447 ,  H01R13/631 ,  H01R13/44

CPC分类号： H01R12/7005 ,  H01R13/631

摘要： A connector comprising a plug member having pin-like male contacts and a jack member having female contacts, the jack member being coupled with the plug member by a plug-in connection. A skirt having a plurality of holes is arranged to hold the pin-like male contacts in position. The skirt is supported in the plug member by the locating groove-pin engagement. The locating groove-pin engagement is released by the jack member when the jack member is inserted into the plug member and reestablished by the jack member when the jack member is withdrawn from the plug member. The skirt also has an alignment pin which is received in a locating hole of the jack member when the jack member is inserted into the plug member. Therefore, it is possible to insert the jack member in the plug member without the pin-like male contacts being bent, as well as to easily withdraw the jack member from the plug member.

摘要翻译： 一种连接器，包括具有销状阳触头的插头构件和具有阴触头的插座构件，插座构件通过插入式连接与插头构件联接。 具有多个孔的裙部被布置成将销状阳接触件保持在适当位置。 裙部通过定位槽销接合支撑在插头构件中。 当插座构件从插头构件拔出时，插座构件插入到插头构件中并由插座构件重新设置时，定位槽 - 销接合被插座构件释放。 裙部还具有定位销，当定位销插入到插头部件中时，该定位销被容纳在插座部件的定位孔中。 因此，可以将插座构件插入插头构件中，而不会使针状阳接触件弯曲，并且能够容易地从插头构件中拔出插座构件。

公开(公告)号：US20060063303A1

公开(公告)日：2006-03-23

申请号：US11265107

申请日：2005-11-03

申请人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/50 ,  H01L21/48

CPC分类号： H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

摘要： A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

摘要翻译： 包装方法，包装结构和包装是能够抑制薄膜基板翘曲的基板，提高产品收率，并且在安装具有高放热量的LSI的情况下建立足够的冷却能力的基板。 本发明的封装基板1使得在第一基板12中形成开口11，在第一基板12上层叠薄膜基板（第二基板）13，开口11被薄膜基板13覆盖 。 接下来，将电容器（第一电子部件）14插入到开口11中并且结合到薄膜基板上，树脂15将开口11的内部填充到固定或更大的厚度并被硬化，薄膜基板13 并且电容器14由树脂15维持，应该连接到电容器14的LSI 16（第二电子部件）被接合到薄膜基板13的暴露侧的表面上，并且电容器 14连接到LSI 16。

公开(公告)号：US06399897B1

公开(公告)日：2002-06-04

申请号：US09631683

申请日：2000-08-02

申请人： Misao Umematsu ,  Shunichi Kikuchi ,  Kiyokazu Moriizumi ,  Kazuaki Satoh ,  Norikazu Ozaki

发明人： Misao Umematsu ,  Shunichi Kikuchi ,  Kiyokazu Moriizumi ,  Kazuaki Satoh ,  Norikazu Ozaki

IPC分类号： H01R909

CPC分类号： H05K1/0271 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H05K3/4647 ,  H05K2201/09781 ,  H01L2224/0401

摘要： A multi-layer wiring substrate includes a main substrate and a plurality of insulating films stacked on the main substrate. The plurality of insulating films have wiring patterns formed on wiring regions thereof and dummy wiring patterns formed on peripheral regions of the wiring regions. The wiring patterns include signal wiring patterns, power supply wiring patterns, and vias. The dummy wiring patterns correspond to the wiring patterns, respectively.

摘要翻译： 多层布线基板包括主基板和堆叠在主基板上的多个绝缘膜。 多个绝缘膜具有在其布线区域上形成的布线图案和形成在布线区域的周边区域上的虚拟布线图案。 布线图案包括信号布线图案，电源布线图形和通孔。 虚设布线图案分别对应于布线图案。

公开(公告)号：US08780554B2

公开(公告)日：2014-07-15

申请号：US13447855

申请日：2012-04-16

申请人： Misao Umematsu

发明人： Misao Umematsu

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  G06F1/185 ,  H05K7/20727

摘要： An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

摘要翻译： 包括在电子设备中的IO系统板除了包括第一通风孔的第一部分板和包括第二通风孔的第二部分板之外，还包括包括第三通气孔的第三部分板。 因此，通过电子设备的机架的进气表面吸入较大量的冷却空气，流入IO系统板的壳体，然后流过第一子电路板，从而冷却第一热交换器， 生成组件。

公开(公告)号：US06891247B2

公开(公告)日：2005-05-10

申请号：US10177672

申请日：2002-06-24

申请人： Shunichi Kikuchi ,  Misao Umematsu

发明人： Shunichi Kikuchi ,  Misao Umematsu

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L23/64 ,  H01L29/00

CPC分类号： H01L23/642 ,  H01L23/481 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  Y10S257/924 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.

摘要翻译： 半导体器件包括半导体裸芯片和具有薄膜结构电容器的电绝缘板部件。 半导体裸芯片的背面具有电源端子和接地端子。 半导体裸芯片通过倒装芯片接合安装在电路板上。 板构件包括板和设置在板上的薄膜结构电容器。 电容器具有对应于其上的半导体裸芯片的电源端子和接地端子的端子。 提供电容器的电路板部件的一侧与半导体裸芯片的背面接合。 电容器的端子电连接到半导体裸芯片的电源端子和接地端子。

公开(公告)号：US06465085B1

公开(公告)日：2002-10-15

申请号：US09699569

申请日：2000-10-31

申请人： Zhiyi Song ,  Kiyokazu Moriizumi ,  Takami Sasahara ,  Norikazu Ozaki ,  Manabu Watanabe ,  Misao Umematsu ,  Shunichi Kikuchi

发明人： Zhiyi Song ,  Kiyokazu Moriizumi ,  Takami Sasahara ,  Norikazu Ozaki ,  Manabu Watanabe ,  Misao Umematsu ,  Shunichi Kikuchi

IPC分类号： B32B300

CPC分类号： H05K3/4605 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/11 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K3/225 ,  H05K3/243 ,  H05K3/388 ,  H05K3/4647 ,  H05K3/467 ,  H05K2201/09781 ,  H05K2203/025 ,  H05K2203/072 ,  H05K2203/0733 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00 ,  H01L2224/0401

摘要： A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.

摘要翻译： 通过聚酰亚胺绝缘层形成虚拟焊盘，以与形成在陶瓷基板的表面上的通孔连接焊盘相对设置。 当形成虚拟焊盘时，在通孔连接焊盘中出现的缺陷被填充有突起。 因此，防止缺陷对虚拟垫上方的层的影响。 此外，在通过在具有允许层间导电的通孔的基底基板上形成薄膜层而获得的薄膜布线基板的制造方法中，存在于通孔中的空隙缺陷填充有耐腐蚀性的导电材料 蚀刻剂，然后在基底基板上形成薄膜层。

公开(公告)号：US20100226102A1

公开(公告)日：2010-09-09

申请号：US12706962

申请日：2010-02-17

申请人： Tsuyoshi SO ,  Hideo Kubo ,  Misao Umematsu

发明人： Tsuyoshi SO ,  Hideo Kubo ,  Misao Umematsu

IPC分类号： H05K1/00

CPC分类号： H05K1/0204 ,  H01L23/4006 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401

摘要： A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

摘要翻译： 印刷电路板单元包括印刷线路板，安装在印刷线路板的前表面上的电子部件封装，放置在电子部件封装的上表面上的散热板，具有头部和 从印刷电路板的后表面突出并且穿过散热板和印刷电路板，加强板与印刷电路板的背面隔开预定的间隙;螺柱，其设置在印刷电路板的前表面上 所述加强板与所述螺栓的前端连接，以及设置在所述加强板与所述印刷电路板的背面之间的减震板。

公开(公告)号：US07291901B2

公开(公告)日：2007-11-06

申请号：US10803879

申请日：2004-03-19

申请人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L23/02 ,  H01L23/48

CPC分类号： H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

摘要： A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

摘要翻译： 包装方法，包装结构和包装是能够抑制薄膜基板翘曲的基板，提高产品收率，并且在安装具有高放热量的LSI的情况下建立足够的冷却能力的基板。 本发明的封装基板1使得在第一基板12中形成开口11，在第一基板12上层叠薄膜基板（第二基板）13，开口11被薄膜基板13覆盖 。 接下来，将电容器（第一电子部件）14插入到开口11中并且结合到薄膜基板上，树脂15将开口11的内部填充到固定或更大的厚度并被硬化，薄膜基板13 并且电容器14由树脂15维持，应该连接到电容器14的LSI 16（第二电子部件）被接合到薄膜基板13的暴露侧的表面上，并且电容器 14连接到LSI 16。

公开(公告)号：US07268002B2

公开(公告)日：2007-09-11

申请号：US11265107

申请日：2005-11-03

申请人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/66 ,  H01L21/44

CPC分类号： H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

摘要： A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.