Multilayer thin-film wiring board
    4.
    发明授权
    Multilayer thin-film wiring board 失效
    多层薄膜接线板

    公开(公告)号:US06303877B2

    公开(公告)日:2001-10-16

    申请号:US09109912

    申请日:1998-07-02

    IPC分类号: H01R909

    摘要: A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.

    摘要翻译: 一种多层薄膜布线板,包括设置有多个布线层的基材和层叠在基材上的绝缘层,并且包括通过层叠布线层而形成的通孔,以便通过绝缘层提供。 通过在形成通孔的布线层之一中形成多个分支来提供多个分支通孔,多个分支通孔沿着基材的延伸方向放置。 多个分支通孔连接到放置在最接近基材的位置的多个布线层中的一个。

    RFID tag with thermal conductive cover
    6.
    发明授权
    RFID tag with thermal conductive cover 有权
    带有导热盖的RFID标签

    公开(公告)号:US07199718B2

    公开(公告)日:2007-04-03

    申请号:US11085491

    申请日:2005-03-22

    IPC分类号: G08B13/14

    摘要: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

    摘要翻译: 本发明提供了热扩散性优异的RFID标签。 RFID标签包括:基座,设置在基座上并形成通信天线的天线图案,与天线图形电连接并通过天线进行无线通信的电路芯片,与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案,以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。