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    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
    5.
    发明申请
    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices 失效
    叠层型半导体器件用载体及叠层型半导体器件的制造方法

    公开(公告)号：US20060245908A1

    公开(公告)日：2006-11-02

    申请号：US11341984

    申请日：2006-01-27

    申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Achari

    发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Achari

    IPC分类号： B65H1/00

    CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

    摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。

    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
    9.
    发明授权
    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices 有权
    叠层型半导体器件用载体及叠层型半导体器件的制造方法

    公开(公告)号：US07846771B2

    公开(公告)日：2010-12-07

    申请号：US12166293

    申请日：2008-07-01

    申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

    发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

    摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。