公开(公告)号：US06285164B1

公开(公告)日：2001-09-04

申请号：US09709431

申请日：2000-11-13

申请人： Masaru Noda ,  Takashi Takeuchi ,  Shinji Tanaka ,  Mitsunori Tsuchiya ,  Takeshi Yamaguchi

发明人： Masaru Noda ,  Takashi Takeuchi ,  Shinji Tanaka ,  Mitsunori Tsuchiya ,  Takeshi Yamaguchi

IPC分类号： H02J700

CPC分类号： G01R31/361 ,  G01R31/3648

摘要： An apparatus for detecting an integrated value of current flow. The apparatus includes an integrator having an integration capacitor, to which a current sensor voltage is inputted, for outputting an output voltage corresponding to an integrated value of the current sensor voltage, and a resetting circuit for clearing integration electric charges accumulated in the integration capacitor to reset the integrator when the output voltage has reached an upper threshold value or a lower threshold value. The apparatus also includes a counter for counting the number of resets of the integrator in an upper direction or in a lower direction, and a connection-polarity inverting circuit for inverting a polarity of inputting of the current sensor voltage to the integrator, a polarity of connecting of the integration capacitor to the integrator and a counting direction of the counter, alternatively, at a regular time interval and synchronously. An integrated value of current flow is obtained on the basis of a count value of the counter.

摘要翻译： 一种用于检测电流的积分值的装置。 该装置包括具有积分电容器的积分器，输入电流传感器电压，用于输出对应于当前传感器电压的积分值的输出电压，以及复位电路，用于将积分电容器中累积的积分电荷清除为 当输出电压达到上限阈值或下限阈值时，复位积分器。 该装置还包括用于对积分器在上方向或下方的复位次数进行计数的计数器和用于将输入当前传感器电压的极性反转到积分器的连接极性反转电路，极性 积分电容器与积分器的连接以及计数器的计数方向，或者以规则的时间间隔并且同步地进行。 基于计数器的计数值获得电流的积分值。

公开(公告)号：US6157170A

公开(公告)日：2000-12-05

申请号：US275027

申请日：1999-03-24

申请人： Masaru Noda ,  Takashi Takeuchi ,  Shinji Tanaka ,  Mitsunori Tsuchiya ,  Takeshi Yamaguchi

发明人： Masaru Noda ,  Takashi Takeuchi ,  Shinji Tanaka ,  Mitsunori Tsuchiya ,  Takeshi Yamaguchi

IPC分类号： G01R31/36 ,  H02J7/00

CPC分类号： G01R31/361 ,  G01R31/3648

摘要： The present invention provides apparatus for detecting the integrated value of current flow, apparatus for detecting the value of current flow and a battery pack employing those apparatus each of which becomes insensitive to the offset in an operational amplifier. Each apparatus and the battery pack includes: a current sensor resistor inserted in series with a current path; an integrator; an input status selector; an integration capacitor connected to the integrator; and a connection-polarity inverter of the integration capacitor provided between the integrator and the integration capacitor. The input status selector switches alternately so as to provide two statuses of a status a and a status b at intervals of a predetermined time which are equal to one another, and in the status a, introduces therethrough the voltage which corresponds to the battery current value and which is developed across terminals of the current sensor resistor into an input of the integrator, while in the status b, inverts the polarity of the current sensor voltage developed across the terminals of the current sensor resistor to introduce therethrough the resultant voltage into the input of the integrator, or to introduce therethrough the voltage of zero to the input of the integrator.

摘要翻译： 本发明提供了用于检测电流的积分值的装置，用于检测电流值的装置和使用对运算放大器的偏移不敏感的那些装置的电池组的装置。 每个装置和电池组包括：与电流路径串联插入的电流传感器电阻器; 集成商 输入状态选择器; 连接到积分器的积分电容器; 以及设置在积分器和积分电容器之间的积分电容器的连接极性反相器。 输入状态选择器交替地切换，以便以相互相等的预定时间的间隔提供状态a和状态b的两种状态，并且在状态a中引入对应于电池电流值的电压 并且其在电流传感器电阻器的端子上被开发成积分器的输入，而在状态b中，反转在电流传感器电阻器的端子两端产生的电流传感器电压的极性，从而将所得到的电压引入到输入端 或者将零电压引入积分器的输入端。

公开(公告)号：US06191492B1

公开(公告)日：2001-02-20

申请号：US08161859

申请日：1993-12-06

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2328

CPC分类号： H01L24/48 ,  H01L23/3135 ,  H01L23/49586 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US4987004A

公开(公告)日：1991-01-22

申请号：US522129

申请日：1990-05-11

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

公开(公告)号：US5041201A

公开(公告)日：1991-08-20

申请号：US403821

申请日：1989-09-07

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Shigenori Hayashi ,  Naoki Hirose ,  Noriya Ishida ,  Mari Sasaki ,  Atsushi Kawano

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Shigenori Hayashi ,  Naoki Hirose ,  Noriya Ishida ,  Mari Sasaki ,  Atsushi Kawano

IPC分类号： C23C16/26 ,  C23C16/517

CPC分类号： C23C16/517 ,  C23C16/26

摘要： Plasma CVD method and apparatus are described. The apparatus comprises a vacuum chamber in which two pairs of electrodes are provided. A high frequency voltage is applied to one of the pairs in order to produce a plasma from a reactive gas in the chamber. A substrate to be coated is located between the other of the pairs. A relatively low frequency voltage is applied to the other pair of electrodes. By virtue of the low frequency voltage, the substrate is exposed to the bombardment of ions of the plasma during deposition. The bombardment functions to remove relatively soft portions of the depositing material.

公开(公告)号：US06756670B1

公开(公告)日：2004-06-29

申请号：US09698055

申请日：2000-10-30

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2306

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/8592 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US5283087A

公开(公告)日：1994-02-01

申请号：US863543

申请日：1992-04-06

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34 ,  B05D3/06 ,  C23C16/00 ,  C25F3/00

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

摘要翻译： 对等离子体处理及其装置进行说明。 多个基板设置在一对电极之间，施加高频电力以产生辉光放电并诱导等离子体。 等离子体中的衬底被施加交变电场。 由于交变电场，基板受到溅射作用。

公开(公告)号：US5256483A

公开(公告)日：1993-10-26

申请号：US606185

申请日：1990-10-31

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34 ,  B32B9/00

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321 ,  Y10S428/906 ,  Y10T428/30

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

摘要翻译： 对等离子体处理及其装置进行说明。 多个基板设置在一对电极之间，施加高频电力以产生辉光放电并诱导等离子体。 等离子体中的衬底被施加交变电场。 由于交变电场，基板受到溅射作用。

公开(公告)号：US5147822A

公开(公告)日：1992-09-15

申请号：US667231

申请日：1991-02-25

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181

摘要： An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制品，其中所述有机树脂的表面设置有硬化的耐水或含碳的 电影。

公开(公告)号：US5079031A

公开(公告)日：1992-01-07

申请号：US324669

申请日：1989-03-17

申请人： Shunpei Yamazaki ,  Shinji Imatou ,  Noriya Ishida ,  Mari Sasaki ,  Mitsunori Sakama ,  Takeshi Fukada ,  Naoki Hirose ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Kazuhisa Nakashita ,  Junichi Takeyama ,  Toshiji Hamatani

发明人： Shunpei Yamazaki ,  Shinji Imatou ,  Noriya Ishida ,  Mari Sasaki ,  Mitsunori Sakama ,  Takeshi Fukada ,  Naoki Hirose ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Kazuhisa Nakashita ,  Junichi Takeyama ,  Toshiji Hamatani

IPC分类号： C23C16/517 ,  H01J37/32

CPC分类号： H01J37/3244 ,  C23C16/517 ,  H01J37/32082 ,  H01J37/32568 ,  H01J2237/3321

摘要： An improved apparatus and method for depositing thin films on a substrate. The apparatus utilizes two types of energy input. A pair of electrodes are provided in a reaction chamber and supplied with first AC electric energy at 1 to 100 MHz for generating a plasma gas in a reaction chamber therebetween. The substrate is mounted on a substrate holder to which second electric energy is supplied.