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公开(公告)号：US20060285275A1
公开(公告)日：2006-12-21
申请号：US11234161
申请日：2005-09-26
IPC分类号： H01G9/08
摘要： The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.
摘要翻译： 本发明提供了一种低成本的电解电容器，其中防止由于回流期间的热膨胀引起的壳体的变形。 具有由电介质膜和电极箔构成的电容器元件的表面安装型电解电容器，保持电容器元件的金属壳体和浸渍在壳体内的电容器元件浸渍的电解液， 壳体配备有吸收壳体中产生的气体的气体吸收构件。
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公开(公告)号：US07298605B2
公开(公告)日：2007-11-20
申请号：US11234161
申请日：2005-09-26
摘要： The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.
摘要翻译： 本发明提供了一种低成本的电解电容器，其中防止由于回流期间的热膨胀引起的壳体的变形。 具有由电介质膜和电极箔构成的电容器元件的表面安装型电解电容器，保持电容器元件的金属壳体和浸渍在壳体内的电容器元件浸渍的电解液， 壳体配备有吸收壳体中产生的气体的气体吸收构件。
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公开(公告)号：US20100246149A1
公开(公告)日：2010-09-30
申请号：US12718348
申请日：2010-03-05
CPC分类号： H01L23/50 , H01L23/49816 , H01L23/49827 , H01L23/642 , H01L23/645 , H01L24/16 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/023 , H05K1/145 , H05K2201/10378 , H05K2201/1053 , H05K2201/10636 , H05K2201/10719 , Y02P70/611
摘要： A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads.
摘要翻译： 连接构件设置在半导体封装和印刷线路板之间。 连接构件包括：由绝缘材料形成的基底构件; 多个通孔，其设置在所述基底构件中，在所述半导体封装的多个第一端子焊盘与所述印刷电路板的多个第二端子焊盘之间的对应位置处; 以及插入到所述多个通孔中的电子部件，所述电子部件在其端部具有第一电极和第二电极，所述第一电极与所述第一端子焊盘中的一个连接，所述第二电极连接到所述第二端子 垫
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公开(公告)号：US08196278B2
公开(公告)日：2012-06-12
申请号：US12654116
申请日：2009-12-10
IPC分类号： H05K13/04
CPC分类号： H05K13/0417 , Y10T29/4913 , Y10T29/49815 , Y10T29/49824 , Y10T29/5313 , Y10T29/53174 , Y10T29/53191
摘要： A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.
摘要翻译： 一种用于将电子部件从用于将电子部件容纳在由侧壁和底部表面限定的凹部中的载体带的方法，通过将侧壁拉伸到外部将电子部件施加的粘合力减小到电子部件附近 穿孔，其形成有与所述侧壁相邻的所述侧壁和所述底面的一部分中的至少一个。
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公开(公告)号：US20100132189A1
公开(公告)日：2010-06-03
申请号：US12654116
申请日：2009-12-10
CPC分类号： H05K13/0417 , Y10T29/4913 , Y10T29/49815 , Y10T29/49824 , Y10T29/5313 , Y10T29/53174 , Y10T29/53191
摘要： A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.
摘要翻译： 一种用于将电子部件从用于将电子部件容纳在由侧壁和底部表面限定的凹部中的载体带的方法，通过将侧壁拉伸到外部将电子部件施加的粘合力减小到电子部件附近 穿孔，其形成有与所述侧壁相邻的所述侧壁和所述底面的一部分中的至少一个。
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公开(公告)号：US08440481B2
公开(公告)日：2013-05-14
申请号：US13313908
申请日：2011-12-07
IPC分类号： H01L21/00
CPC分类号： H05K1/182 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2924/0002 , H05K2201/10106 , H05K2201/10651 , H01L2924/00
摘要： Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.
摘要翻译： 一种电子部件的制造方法，包括将一对引线的一个引线连接到与pn连接层与p型层和n型层连接的电子元件的pn连接层平行的表面 设置在p型层和n型层之间，将另一引线连接到与pn连接层平行的另一表面; 并且通过将一对引线弯曲到外部，形成连接并支撑电子元件的一对引线的支撑部分和用作电极的电极部分。
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7.发明授权公开(公告)号：US08093616B2
公开(公告)日：2012-01-10
申请号：US11892139
申请日：2007-08-20
IPC分类号： H01L33/00
CPC分类号： H05K1/182 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2924/0002 , H05K2201/10106 , H05K2201/10651 , H01L2924/00
摘要： An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.
摘要翻译： 电子部件包括插入形成在基板上的开口部的主体部; 以及一对引线，每个所述引线的一端连接到所述主体部分，另一端连接到形成在所述板上的焊盘; 其中主体部分设置有引线，使得主体部分的功能表面位于连接到板的焊盘的一侧。
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8.发明申请公开(公告)号：US20080122120A1
公开(公告)日：2008-05-29
申请号：US11892139
申请日：2007-08-20
IPC分类号： H01L23/52
CPC分类号： H05K1/182 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2924/0002 , H05K2201/10106 , H05K2201/10651 , H01L2924/00
摘要： An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.
摘要翻译： 电子部件包括插入形成在基板上的开口部的主体部; 以及一对引线，每个所述引线的一端连接到所述主体部分，另一端连接到形成在所述板上的焊盘; 其中主体部分设置有引线，使得主体部分的功能表面位于连接到板的焊盘的一侧。
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公开(公告)号：US09307686B2
公开(公告)日：2016-04-05
申请号：US13420131
申请日：2012-03-14
CPC分类号： H05K1/0212 , H01L23/345 , H01L23/3735 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29111 , H01L2224/29116 , H01L2224/29144 , H01L2224/32238 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/81444 , H01L2224/83444 , H01L2924/0001 , H01L2924/01015 , H01L2924/01047 , H01L2924/12041 , H01L2924/1517 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H05K3/22 , H05K3/3494 , H05K2201/09263 , H05K2203/1115 , H05K2203/176 , H01L2924/00014 , H01L2924/0105 , H01L2924/01029 , H01L2924/00012 , H01L2224/29099 , H01L2924/00
摘要： An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.
摘要翻译： 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。
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公开(公告)号：US08446708B2
公开(公告)日：2013-05-21
申请号：US13151448
申请日：2011-06-02
申请人： Tomokazu Nakashima , Masayuki Itoh
发明人： Tomokazu Nakashima , Masayuki Itoh
IPC分类号： H01G9/00
摘要： A solid electrolytic capacitor includes a capacitor element having two opposite cathode surfaces, a cathode terminal metal plate having a first cathode connecting portion electrically connected to one of the two opposite cathode surfaces, and an auxiliary cathode metal plate having a second cathode connecting portion electrically connected to the other one of the two opposite cathode surfaces of the capacitor element. The cathode terminal metal plate includes a groove electrically connected to the first cathode connecting portion. The auxiliary cathode metal plate includes an end portion that is electrically connected to the second cathode connecting portion and engages with the groove. The cathode terminal metal plate further includes an outer terminal portion.
摘要翻译： 固体电解电容器包括具有两个相对的阴极表面的电容器元件，阴极端子金属板，具有电连接到两个相对的阴极表面之一的第一阴极连接部分和辅助阴极金属板，其具有电连接的第二阴极连接部分 到电容器元件的两个相对的阴极表面中的另一个。 阴极端子金属板包括电连接到第一阴极连接部分的沟槽。 辅助阴极金属板包括电连接到第二阴极连接部分并与凹槽接合的端部。 阴极端子金属板还包括外部端子部分。
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