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公开(公告)号：US20080197369A1
公开(公告)日：2008-08-21
申请号：US11708990
申请日：2007-02-20
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/405 , H01L33/44
摘要： A double flip-chip semiconductor device formed by a double flip fabrication process. Epitaxial layers are grown on a substrate in the normal fashion with the n-type layers grown first and the p-type layers grown subsequently. The chip is flipped a first time and mounted to a sacrificial layer. The original substrate is removed, exposing the n-type layer, and various additional layers and treatments are added to the device. Because the n-type layer is exposed during fabrication, the layer may be processed in various ways including adding a reflective element, texturing the surface or adding microstructures to the layer to improve light extraction. The chip is flipped a second time and mounted to a support element. The sacrificial layer is then removed and additional layers and treatment are added to the device. The finished device features a configuration in which the layers maintain the same orientation with respect to the support element that they had with the original substrate on which they were grown. Processing the n-type layers, rather than the p-type layers as in a single flip process, provides greater design flexibility when selecting features to add to the device. Thus, previously unavailable processes and reflective elements may be utilized, enhancing the external quantum efficiency of the device.
摘要翻译： 通过双层翻转制造工艺形成的双倒装芯片半导体器件。 以正常方式在衬底上生长外延层，其中首先生长n型层，随后生长p型层。 芯片首次翻转并安装到牺牲层。 去除原始基底，暴露n型层，并将各种附加层和处理添加到该装置中。 因为n型层在制造过程中被曝光，所以该层可以以各种方式加工，包括添加反射元件，使表面纹理化或者向层中添加微结构以改善光提取。 芯片第二次翻转并安装在支撑元件上。 然后去除牺牲层，并向设备添加附加层和处理。 完成的装置具有这样的构造，其中层相对于它们与其生长在其上的原始基底所具有的支撑元件保持相同的取向。 在单次翻转过程中处理n型层而不是p型层，在选择要添加到设备中的特征时，提供更大的设计灵活性。 因此，可以利用先前不可用的处理和反射元件，增强器件的外部量子效率。
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2.发明申请Packaged light emitting devices including multiple index lenses and methods of fabricating the same 有权包括多个折射率透镜的封装发光器件及其制造方法公开(公告)号：US20070278512A1
公开(公告)日：2007-12-06
申请号：US11443741
申请日：2006-05-31
申请人： Ban P. Loh , Nicholas W. Medendorp , Bernd Keller
发明人： Ban P. Loh , Nicholas W. Medendorp , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , G02B19/0028 , G02B19/0052 , G02B19/0071 , H01L33/54 , Y10T156/10
摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.
摘要翻译： 封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二 透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。 第二折射率可能高于第一折射率。 透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。
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3.发明申请公开(公告)号：US20080198572A1
公开(公告)日：2008-08-21
申请号：US11708818
申请日：2007-02-21
IPC分类号： F21V9/16
CPC分类号： F21V7/0008 , F21S8/086 , F21V7/22 , F21V9/30 , F21W2131/103 , F21Y2115/10
摘要： A lighting system may include a substrate and a light emitting device (LED) on the substrate, and the light emitting device may be configured to transmit light having a first wavelength along a path away from the substrate. A remote reflector may be spaced apart from the light emitting device, and the light emitting device may be between the substrate and the remote reflector. The remote reflector may also be in the path of the light having the first wavelength transmitted by light emitting device. A luminescent layer may be on a surface of the remote reflector, and the luminescent layer may be configured to convert a portion of the light having the first wavelength to light having a second wavelength different than the first wavelength. Moreover, the remote reflector may be configured to reflect light having the first and second wavelengths.
摘要翻译： 照明系统可以在衬底上包括衬底和发光器件（LED），并且发光器件可以被配置为透射远离衬底的路径具有第一波长的光。 远程反射器可以与发光器件间隔开，并且发光器件可以在衬底和远程反射器之间。 远程反射器也可以在具有由发光器件传输的第一波长的光的路径中。 发光层可以在远端反射体的表面上，并且发光层可以被配置为将具有第一波长的光的一部分转换成具有不同于第一波长的第二波长的光。 此外，远程反射器可以被配置为反射具有第一和第二波长的光。
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4.发明申请Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法公开(公告)号：US20080121921A1
公开(公告)日：2008-05-29
申请号：US11486244
申请日：2006-07-13
申请人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp
发明人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp
IPC分类号： H01L23/495 , H01L21/70
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。
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公开(公告)号：US20080062691A1
公开(公告)日：2008-03-13
申请号：US11519058
申请日：2006-09-12
IPC分类号： F21S13/14
CPC分类号： F21V14/02 , F21S4/20 , F21S8/08 , F21V19/02 , F21W2131/103 , F21Y2105/10 , F21Y2115/10
摘要： A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.
摘要翻译： 用于实现期望的照明图案的发光二极管（LED）照明器具包括面板和附接到面板表面的一个或多个LED。 一个或多个LED可以以一定角度安装在表面上。
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6.发明申请Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding 有权通过压缩成型形成具有前触点的封装的半导体发光器件的方法公开(公告)号：US20080191225A1
公开(公告)日：2008-08-14
申请号：US11705233
申请日：2007-02-12
CPC分类号： B29C43/021 , B29C33/0022 , B29C33/02 , B29C43/18 , B29L2011/0016 , H01L33/52 , H01L2224/48091 , H01L2224/48227 , H01L2924/01068 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof and a contact on a front face thereof, wherein the light emitting device is electrically connected to the contact on the front face of the substrate. The substrate is compression molded to form an optical element on the front face of the substrate over the semiconductor light emitting device and a residual coating over a region of the front face of the substrate including the contact. The residual coating over the contact may be removed without damaging the contact. Packaged semiconductor light emitting devices are also provided.
摘要翻译： 封装半导体发光器件的方法包括在其前面提供具有半导体发光器件的衬底和其正面上的接触件，其中发光器件电连接到衬底的正面上的接触件 。 基板被压缩模制以在半导体发光器件上的基板的正面上形成光学元件，并且在包括该触点的基板的前表面的区域上形成残留的涂层。 触点上的残留涂层可以被去除而不损坏接触。 还提供了封装的半导体发光器件。
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公开(公告)号：US20070273058A1
公开(公告)日：2007-11-29
申请号：US11440166
申请日：2006-05-24
申请人： Ban P. Loh , Nicholas W. Medendorp
发明人： Ban P. Loh , Nicholas W. Medendorp
IPC分类号： B29D11/00
CPC分类号： B29D11/00432 , B29C33/0022 , B29C43/021 , B29C43/184 , B29C2043/5076 , B29K2105/0002 , B29L2011/0016
摘要： Method of forming a plastic element include dispensing a quantity of a liquid precursor material into a first die mold, positioning a carrier tape on the first die mold above the dispensed liquid precursor material, bringing a second die mold into contact with the carrier tape and the first die mold, and applying pressure to the first die mold and the second die mold. The liquid precursor material may include a liquid silicone.
摘要翻译： 形成塑料元件的方法包括将一定量的液体前体材料分配到第一模具模具中，将载带定位在分配的液体前体材料上方的第一模具模具上，使第二模具模具与载带接触，并且 第一模具，并向第一模具模具和第二模具模具施加压力。 液体前体材料可以包括液体硅酮。
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公开(公告)号：US5189417A
公开(公告)日：1993-02-23
申请号：US598129
申请日：1990-10-16
IPC分类号： H03K17/96
CPC分类号： H03K17/9622 , H03K2017/9613
摘要： A circuit for detecting user contact of one of a plurality of touch pads includes a plurality of drive lines and a plurality of sense lines coupled with the touch pads. A sense circuit responsive to the signals on the sense lines produces a pulse having a width that is proportional to the amplitude of each of the sense signals. A control circuit measures the width of the pulses produced by the sense circuit and compares each measured pulse width to a reference pulse width to distinguish between a touch and no-touch condition for each touch pad. The sense circuit is illustrated in the form of a comparator having a threshold input that is always exceeded by the sense signal to produce the variable width pulse. Separate amplifiers may be provided for each sense line.
摘要翻译： 用于检测多个触摸板之一的用户接触的电路包括多个驱动线和与触摸板耦合的多条感测线。 响应于感测线上的信号的感测电路产生具有与每个感测信号的幅度成比例的宽度的脉冲。 控制电路测量由感测电路产生的脉冲的宽度，并将每个测量的脉冲宽度与参考脉冲宽度进行比较，以区分每个触摸板的触摸和无触摸状态。 感测电路以具有阈值输入的比较器的形式示出，该阈值输入总是被感测信号超出以产生可变宽度脉冲。 可以为每个感测线提供单独的放大器。
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9.发明申请Methods of forming packaged semiconductor light emitting devices having multiple optical elements by compression molding 有权通过压缩成型形成具有多个光学元件的封装的半导体发光器件的方法公开(公告)号：US20080194061A1
公开(公告)日：2008-08-14
申请号：US11705305
申请日：2007-02-12
CPC分类号： B29C43/18 , B29C33/0022 , B29C43/021 , B29L2011/0016 , H01L33/52 , H01L2224/48091 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： Methods of packaging semiconductor light emitting devices include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device. A second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. The first optical element and/or the second optical element are formed by compression molding the respective optical element.
摘要翻译： 封装半导体发光器件的方法包括在其正面上提供具有半导体发光器件的衬底。 第一光学元件由靠近半导体发光器件的正面上的第一材料形成。 第二光学元件由半导体发光器件和第一光学元件上的与第一材料不同的第二材料形成。 第一光学元件和/或第二光学元件通过压缩成型各个光学元件而形成。
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10.发明申请Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips 有权通过液体注射成型形成半导体发光器件封装的方法和模制的半导体发光器件条公开(公告)号：US20080044934A1
公开(公告)日：2008-02-21
申请号：US11507191
申请日：2006-08-21
申请人： Ban P. Loh , Nicholas W. Medendorp
发明人： Ban P. Loh , Nicholas W. Medendorp
IPC分类号： H01L21/00
CPC分类号： B29C45/14655 , B29C45/14836 , B29C45/34 , B29C2045/14844 , B29K2083/00 , B29K2995/0018 , B29L2011/0016 , H01L24/97 , H01L33/52 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.
摘要翻译： 半导体发光器件封装方法包括制造在其上安装半导体发光器件的衬底。 衬底可以包括被配置为将半导体发光器件安装在其中的空腔。 半导体发光器件安装在基板上并电连接到基板的接触部分。 衬底被液体注射成型以形成在半导体发光器件上结合到衬底的光学元件。 之前可以在空腔中的电连接的半导体发光器件上施加软树脂。 还提供了半导体发光器件衬底条。
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