公开(公告)号：US20060057454A1

公开(公告)日：2006-03-16

申请号：US10542618

申请日：2004-01-19

申请人： Megumu Nagasawa ,  Masao Abe

发明人： Megumu Nagasawa ,  Masao Abe

IPC分类号： H01M4/92 ,  H01M8/10

CPC分类号： H01M8/1004 ,  H01M4/8605 ,  H01M4/92

摘要： The invention provides a fuel cell which comprises a cathode and an anode arranged to sandwich a proton-conductive ion exchange electrolytic membrane, oxygen and hydrogen containing carbon monoxide being supplied to the cathode and the anode, respectively, in which the cathode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and the anode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and further at least the anode carries a proton-supplying material thereon.

摘要翻译： 本发明提供了一种燃料电池，其包括阴极和阳极，其分别夹置质子传导离子交换电解膜，供给阴极和阳极的含氧和氢的一氧化碳，其中阴极包括导电多孔 承载铂或铂合金的基板和质子传导离子交换电解聚合物，并且阳极包括承载有铂或铂合金的导电多孔基板和质子传导离子交换电解聚合物，并且还至少 阳极在其上携带质子供应材料。

公开(公告)号：US08142956B2

公开(公告)日：2012-03-27

申请号：US10542618

申请日：2004-01-19

申请人： Megumu Nagasawa ,  Masao Abe

发明人： Megumu Nagasawa ,  Masao Abe

IPC分类号： H01M4/86 ,  H01M8/10

CPC分类号： H01M8/1004 ,  H01M4/8605 ,  H01M4/92

摘要： The invention provides a fuel cell which comprises a cathode and an anode arranged to sandwich a proton-conductive ion exchange electrolytic membrane, oxygen and hydrogen containing carbon monoxide being supplied to the cathode and the anode, respectively, in which the cathode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and the anode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and further at least the anode carries a proton-supplying material thereon.

摘要翻译： 本发明提供了一种燃料电池，其包括阴极和阳极，其分别夹置质子传导离子交换电解膜，供给阴极和阳极的含氧和氢的一氧化碳，其中阴极包括导电多孔 承载铂或铂合金的基板和质子传导离子交换电解聚合物，并且阳极包括承载有铂或铂合金的导电多孔基板和质子传导离子交换电解聚合物，并且还至少 阳极在其上携带质子供应材料。

公开(公告)号：US06373000B1

公开(公告)日：2002-04-16

申请号：US09735893

申请日：2000-12-14

申请人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

发明人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

IPC分类号： H01R2372

摘要： A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

公开(公告)号：US5814894A

公开(公告)日：1998-09-29

申请号：US627996

申请日：1996-04-04

申请人： Kazumasa Igarashi ,  Megumu Nagasawa ,  Satoshi Tanigawa ,  Hideyuki Usui ,  Nobuhiko Yoshio ,  Hisataka Ito ,  Tadao Okawa

发明人： Kazumasa Igarashi ,  Megumu Nagasawa ,  Satoshi Tanigawa ,  Hideyuki Usui ,  Nobuhiko Yoshio ,  Hisataka Ito ,  Tadao Okawa

IPC分类号： C08G73/10 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/3121 ,  H01L21/563 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311

摘要： A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.

摘要翻译： 一种能够防止导电性缺陷发生的半导体器件，其中，在与电极11侧的表面相对的状态下，在辅助布线板2上安装有配备有电极11的半导体芯片1，将导体23设置在 在辅助配线板2的内部，每个引导导体23的一端形成从辅助布线板2的表面在安装半导体芯片1侧突出的内部电极21，引出导体23的另一端形成 从辅助配线板的与安装半导体芯片1的一侧相反的表面突出的外部电极22，并且每个内部电极21连接到半导体芯片1的每个电极11，至少在 半导体芯片1和辅助布线板2用热焊接聚酰亚胺树脂层封装。

公开(公告)号：US20100039591A1

公开(公告)日：2010-02-18

申请号：US12526531

申请日：2008-02-25

申请人： Megumu Nagasawa ,  Michie Sakamoto

发明人： Megumu Nagasawa ,  Michie Sakamoto

IPC分类号： G02F1/1335 ,  C08K5/3432 ,  C08K5/353 ,  C08K5/17 ,  C08K5/3415 ,  C08K5/3437 ,  C08K5/47 ,  G02B5/23 ,  G02B5/22

CPC分类号： G02B5/223 ,  G02F1/133509 ,  G02F1/133609

摘要： A crosslinked product with excellent durability is provided that can remove intermediate colors of light while preventing brightness from deteriorating and thereby can improve color tone representation. The crosslinked product of the present invention includes a J aggregate of a dye and is characterized in that the dye is at least one dye selected from the group consisting of cyanine, merocyanine, squarylium, and porphyrin, the J aggregate of the dye is formed in a matrix resin, and the matrix resin has been crosslinked.

摘要翻译： 提供了具有优异的耐久性的交联产物，其可以在防止亮度劣化的同时去除中间颜色的光，从而可以改善色调表示。 本发明的交联产物包括染料的J骨料，其特征在于染料是选自花青，部花青，方酸ium卟啉和卟啉中的至少一种染料，染料的J骨料形成于 基质树脂，并且基质树脂已经交联。

公开(公告)号：US06462282B1

公开(公告)日：2002-10-08

申请号：US09338659

申请日：1999-06-23

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Kei Nakamura

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Kei Nakamura

IPC分类号： H05K116

CPC分类号： H05K1/0271 ,  H01L23/3164 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2201/10674 ,  H01L2924/00

摘要： A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.

摘要翻译： 用于以倒装芯片的形式安装裸芯片的电路板。 用于保护与绝缘的状态的电路的金属箔布置在裸芯片所在的区域中。

公开(公告)号：US20100307587A1

公开(公告)日：2010-12-09

申请号：US12796129

申请日：2010-06-08

申请人： Michie Sakamoto ,  Megumu Nagasawa

发明人： Michie Sakamoto ,  Megumu Nagasawa

IPC分类号： H01L31/0272 ,  F21K2/00 ,  C09K11/06

CPC分类号： C09K11/06 ,  C09K2211/1011 ,  H01L31/02322 ,  H01L31/055 ,  H01L51/447 ,  Y02E10/52 ,  Y02E10/543 ,  Y02E10/549

摘要： The present invention provides a method for controlling an optical property of a wavelength conversion sheet. The method is a method for controlling an optical property of a wavelength conversion sheet that contains a transparent resin and a phosphor and achieves wavelength conversion by absorbing light in a specific wavelength range other than a target wavelength range and emitting light in a target wavelength range, wherein the phosphor contains a phosphor having a perylene skeleton, and a stokes shift of the wavelength conversion sheet is controlled by adjusting a concentration of the phosphor having a perylene skeleton to the transparent resin in a range of 0.5% to 3.5% by weight.

摘要翻译： 本发明提供了一种用于控制波长转换片的光学特性的方法。 该方法是用于控制包含透明树脂和荧光体的波长转换片的光学特性的方法，并且通过吸收除目标波长范围以外的特定波长范围内的光并发射目标波长范围内的光来实现波长转换， 其中，所述荧光体含有具有苝骨架的荧光体，并且通过将所述透明树脂的具有苝骨架的荧光体的浓度调整为0.5〜3.5重量％的范围来控制所述波长转换片的斯托克斯偏移。

公开(公告)号：US20100103355A1

公开(公告)日：2010-04-29

申请号：US12526594

申请日：2008-02-25

申请人： Michie Sakamoto ,  Megumu Nagasawa

发明人： Michie Sakamoto ,  Megumu Nagasawa

IPC分类号： G02F1/1335 ,  G02B5/22 ,  C09K19/00

CPC分类号： G02B5/223 ,  G02F1/133509 ,  Y10T428/1041

摘要： A color correction filter with excellent durability is provided that can remove intermediate colors of light while preventing brightness of an image display from deteriorating and thereby can improve color tone representation of the image display. A color correction filter 10 of the present invention includes a color correction layer 11 and two protective layers 12. The color correction layer 11 contains a J aggregate of a dye. The dye is at least one dye selected from the group consisting of cyanine, merocyanine, squarylium, and porphyrin. The half bandwidth at a maximum absorption peak of the color correction layer is in the range of 5 to 30 nm. The two protective layers 12 are formed on both surfaces of the color correction layer 11, respectively.

摘要翻译： 提供了具有优异耐久性的颜色校正滤光器，其可以在防止图像显示的亮度劣化的同时去除中间颜色的光，从而可以改善图像显示的色调表示。 本发明的色彩校正滤光器10包括颜色校正层11和两个保护层12.颜色校正层11包含染料的J聚集体。 染料是选自花青，部花青，方酸ium卟啉和卟啉中的至少一种染料。 颜色校正层的最大吸收峰处的半带宽在5〜30nm的范围内。 两个保护层12分别形成在颜色校正层11的两个表面上。

公开(公告)号：US06335076B1

公开(公告)日：2002-01-01

申请号：US09615761

申请日：2000-07-13

申请人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui

发明人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui

IPC分类号： B32B1508

CPC分类号： H05K3/462 ,  H05K3/4038 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/266 ,  Y10T428/31681

摘要： A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.

摘要翻译： 多个双面电路板1，其中电路4设置在包含有合成箔2作为基本物质的有机高分子树脂的绝缘层3的两侧，以及两个电路4通过通孔 其中填充有焊接导体5a通过粘合剂层6层压。粘合层6具有在与两个双面电路板1的电路4直接接触的部分的预定位置处开口的孔。孔部分 设置有焊接导体7.两个双面电路板1的电路4由焊接导体7电连接。

公开(公告)号：US06333469B1

公开(公告)日：2001-12-25

申请号：US09353385

申请日：1999-07-15

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Takuji Okeyui ,  Kei Nakamura

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Takuji Okeyui ,  Kei Nakamura

IPC分类号： H05K116

CPC分类号： H01L24/94 ,  H01L23/3114 ,  H01L23/4985 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.

摘要翻译： 一种晶片级封装结构，其中用于重新排列晶片的电极焊盘的电路板一体地层压在晶片上。 电路板可分为单个芯片尺寸封装（CSPS），其中包含一层聚酰亚胺树脂，晶圆与电路板之间的连接由焊锡凸块进行，而电路板则以 胶粘剂。