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    Dynamic attitude measurement sensor and method
    1.
    发明授权
    Dynamic attitude measurement sensor and method 失效
    动态姿态测量传感器及方法

    公开(公告)号：US06421622B1

    公开(公告)日：2002-07-16

    申请号：US09326738

    申请日：1999-06-04

    申请人： Michael A. Horton ,  Jose A. Rios ,  Jin Song

    发明人： Michael A. Horton ,  Jose A. Rios ,  Jin Song

    IPC分类号： G01P2100

    CPC分类号： G01C21/16

    摘要： A method and system senses the attitude of an accelerating object. Attitude sensing is accomplished by measuring acceleration in three orthogonal axes and measuring angular rate about each such axis to compute attitude accurately relative to a vertical axis. The system includes accelerometers and angular rate sensors for sensing the acceleration and the angular rate, respectively, of the object. A processor updates a quarternion representation of attitude based upon the angular rate of the object and a corrective rate signal to obtain the attitude of the object. Temperature compensation and frequency compensation may also be performed to update the quarternion.

    摘要翻译： 一种方法和系统感测加速对象的姿态。 姿态感测通过测量三个正交轴中的加速度并测量围绕每个这样的轴的角速度来实现，以相对于垂直轴准确地计算姿态。 该系统包括分别用于感测物体的加速度和角速度的加速度计和角速度传感器。 处理器基于对象的角速率和校正速率信号更新态度的季节表示以获得对象的姿态。 也可以进行温度补偿和频率补偿来更新季度。

    Method of making a circuitized substrate having a plurality of solder connection sites thereon
    2.
    发明授权
    Method of making a circuitized substrate having a plurality of solder connection sites thereon 失效
    制造其上具有多个焊接连接部位的电路化基板的方法

    公开(公告)号：US07087441B2

    公开(公告)日：2006-08-08

    申请号：US10968929

    申请日：2004-10-21

    申请人： John J. Konrad ,  Joseph A. Kotylo ,  Jose A. Rios

    发明人： John J. Konrad ,  Joseph A. Kotylo ,  Jose A. Rios

    IPC分类号： G01R31/26 ,  H01L21/66

    CPC分类号： H01L21/486 ,  H05K3/243 ,  H05K3/3463 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/0391 ,  H05K2203/0542 ,  H05K2203/0723

    摘要： A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs. In an alternative embodiment, the same solder compositions may be deposited on conductor and PTHs of different metal or metal alloy composition. In each embodiment, a single commoning layer (e.g., copper) is used, being partially removed following the first deposition. The solder is deposited using an electroplating process (electroless or electrolytic) and the commoning bar in both depositing steps. An information handling system utilizing the circuitized substrate formed in accordance with the invention is also described.

    摘要翻译： 一种制造电路化基板的方法，其中在至少两种不同的金属或金属合金导体和PTH上形成两个相同或不同的冶金的焊料沉积物。 在替代实施例中，相同的焊料组合物可以沉积在不同金属或金属合金组成的导体和PTH上。 在每个实施例中，使用单个共用层（例如铜），在第一次沉积之后被部分去除。 在两个沉积步骤中，使用电镀工艺（无电解或电解）和共用条来沉积焊料。 还描述了利用根据本发明形成的电路化基板的信息处理系统。