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1.发明授权公开(公告)号：US09343444B2
公开(公告)日：2016-05-17
申请号：US14661742
申请日：2015-03-18
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
摘要翻译： 根据某些实施例，电子设备具有聚合物粘合剂，限定穿过其中的孔的框架以及悬挂在粘合剂中并在框架的孔内的半导体管芯（例如，发光或光检测元件）。
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公开(公告)号：US20180240945A1
公开(公告)日：2018-08-23
申请号：US15898348
申请日：2018-02-16
IPC分类号： H01L33/50 , H01L25/16 , H01L33/48 , H01L33/62 , H01L33/58 , H01L33/56 , H01L33/60 , H01L33/00 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US09741906B2
公开(公告)日：2017-08-22
申请号：US15096548
申请日：2016-04-12
IPC分类号： H01L33/50 , H01L25/16 , H01L33/00 , H01L33/48 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US20150221623A1
公开(公告)日：2015-08-06
申请号：US14661742
申请日：2015-03-18
IPC分类号： H01L25/16 , H01L33/50 , H01L25/075 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/48 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US09941448B2
公开(公告)日：2018-04-10
申请号：US15647928
申请日：2017-07-12
IPC分类号： H01L33/50 , H01L25/16 , H01L33/00 , H01L33/60 , H01L33/56 , H01L33/48 , H01L33/62 , H01L33/58 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US09343443B2
公开(公告)日：2016-05-17
申请号：US14610324
申请日：2015-01-30
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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7.发明申请公开(公告)号：US20150221835A1
公开(公告)日：2015-08-06
申请号：US14610324
申请日：2015-01-30
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
摘要翻译： 根据某些实施例，电子设备具有聚合物粘合剂，限定穿过其中的孔的框架以及悬挂在粘合剂中并在框架的孔内的半导体管芯（例如，发光或光检测元件）。
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公开(公告)号：US10319890B2
公开(公告)日：2019-06-11
申请号：US15006242
申请日：2016-01-26
申请人： Michael A. Tischler , Alborz Amini
发明人： Michael A. Tischler , Alborz Amini
摘要： In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.
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公开(公告)号：US20160218264A1
公开(公告)日：2016-07-28
申请号：US15006232
申请日：2016-01-26
申请人： Michael A. Tischler , Alborz Amini
发明人： Michael A. Tischler , Alborz Amini
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/7598 , H01L2224/83851 , H01L2924/07811 , H01L2924/07812 , H01L2924/181 , H01L2933/0066 , H01L2924/00012
摘要： In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.
摘要翻译： 根据某些实施例，诸如发光元件的电子部件通过经由膜施加的压力和压力激活的粘合剂的固化而结合到基板上的连接点。
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公开(公告)号：US09647189B2
公开(公告)日：2017-05-09
申请号：US15006232
申请日：2016-01-26
申请人： Michael A. Tischler , Alborz Amini
发明人： Michael A. Tischler , Alborz Amini
CPC分类号： H01L33/62 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/7598 , H01L2224/83851 , H01L2924/07811 , H01L2924/07812 , H01L2924/181 , H01L2933/0066 , H01L2924/00012
摘要： In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.
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