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公开(公告)号：US20160225960A1
公开(公告)日：2016-08-04
申请号：US15096548
申请日：2016-04-12
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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2.发明授权公开(公告)号：US09343444B2
公开(公告)日：2016-05-17
申请号：US14661742
申请日：2015-03-18
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
摘要翻译： 根据某些实施例，电子设备具有聚合物粘合剂，限定穿过其中的孔的框架以及悬挂在粘合剂中并在框架的孔内的半导体管芯（例如，发光或光检测元件）。
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3.发明申请公开(公告)号：US20110057165A1
公开(公告)日：2011-03-10
申请号：US12878815
申请日：2010-09-09
申请人： Thomas Pinnington
发明人： Thomas Pinnington
CPC分类号： H01L33/04 , H01L21/76254 , H01L33/007 , H01L33/0079 , H01L33/12
摘要： Epitaxial formation structures and associated methods of manufacturing solid state lighting (“SSL”) devices with target thermal expansion characteristics are disclosed herein. In one embodiment, an SSL device includes a composite structure having a composite CTE temperature dependency, a formation structure on the composite structure, and an SSL structure on the formation structure. The SSL structure has an SSL temperature dependency, and a difference between the composite CTE and SSL temperature dependencies is below 3 ppm/° C. over the temperature range.
摘要翻译： 本文公开了外延形成结构和制造具有目标热膨胀特性的固态照明（“SSL”）器件的相关方法。 在一个实施例中，SSL设备包括具有复合CTE温度依赖性的复合结构，复合结构上的形成结构以及地层结构上的SSL结构。 SSL结构具有SSL温度依赖性，并且在温度范围内，复合CTE和SSL温度依赖性之间的差异低于3ppm /℃。
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公开(公告)号：US20180240945A1
公开(公告)日：2018-08-23
申请号：US15898348
申请日：2018-02-16
IPC分类号： H01L33/50 , H01L25/16 , H01L33/48 , H01L33/62 , H01L33/58 , H01L33/56 , H01L33/60 , H01L33/00 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US20170309792A1
公开(公告)日：2017-10-26
申请号：US15647928
申请日：2017-07-12
IPC分类号： H01L33/50 , H01L33/00 , H01L33/48 , H01L33/56 , H01L33/58 , H01L33/60 , H01L25/16 , H01L33/62 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US20060255341A1
公开(公告)日：2006-11-16
申请号：US11408239
申请日：2006-04-21
申请人： Thomas Pinnington , James Zahler , Young-Bae Park , Charles Tsai , Corinne Ladous , Harry Atwater , Sean Olson
发明人： Thomas Pinnington , James Zahler , Young-Bae Park , Charles Tsai , Corinne Ladous , Harry Atwater , Sean Olson
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , B82Y20/00 , H01L21/2007 , H01L33/145 , H01L33/32 , H01L33/405 , H01L2924/0002 , H01L2924/00
摘要： An intermediate substrate includes a handle substrate bonded to a thin layer suitable for epitaxial growth of a compound semiconductor layer, such as a III-nitride semiconductor layer. The handle substrate may be a metal or metal alloy substrate, such as a molybdenum or molybdenum alloy substrate, while the thin layer may be a sapphire layer. A method of making the intermediate substrate includes forming a weak interface in the source substrate, bonding the source substrate to the handle substrate, and exfoliating the thin layer from the source substrate such that the thin layer remains bonded to the handle substrate.
摘要翻译： 中间基板包括结合到适合于诸如III族氮化物半导体层的化合物半导体层的外延生长的薄层的手柄基板。 手柄基板可以是金属或金属合金基板，例如钼或钼合金基板，而薄层可以是蓝宝石层。 制造中间基板的方法包括在源极基板中形成弱界面，将源极基板接合到手柄基板，以及将薄层从源极基板剥离，使得薄层保持结合到手柄基板上。
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公开(公告)号：US09741906B2
公开(公告)日：2017-08-22
申请号：US15096548
申请日：2016-04-12
IPC分类号： H01L33/50 , H01L25/16 , H01L33/00 , H01L33/48 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US20150221623A1
公开(公告)日：2015-08-06
申请号：US14661742
申请日：2015-03-18
IPC分类号： H01L25/16 , H01L33/50 , H01L25/075 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/48 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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公开(公告)号：US20070243703A1
公开(公告)日：2007-10-18
申请号：US11785038
申请日：2007-04-13
申请人： Thomas Pinnington , Sean Olson , James M. Zahler , Charles Tsai
发明人： Thomas Pinnington , Sean Olson , James M. Zahler , Charles Tsai
IPC分类号： H01L21/3205 , H01L21/28 , H01L21/4763
CPC分类号： H01L21/2007 , H01L21/0237 , H01L21/02381 , H01L21/02458 , H01L21/02461 , H01L21/02463 , H01L21/02507 , H01L21/0251 , H01L21/02658
摘要： A method of making a semiconductor device includes providing a laminate substrate made by bonding a II-VI or III-V semiconductor laminate film to a support substrate, and preparing the laminate film to enable growth of a II-VI or III-V semiconductor device layer on the laminate substrate.
摘要翻译： 制造半导体器件的方法包括提供通过将II-VI或III-V半导体层压膜结合到支撑衬底而制成的层压衬底，以及制备层压膜以使II-VI或III-V半导体器件能够生长 层。
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公开(公告)号：US09941448B2
公开(公告)日：2018-04-10
申请号：US15647928
申请日：2017-07-12
IPC分类号： H01L33/50 , H01L25/16 , H01L33/00 , H01L33/60 , H01L33/56 , H01L33/48 , H01L33/62 , H01L33/58 , H01L33/54
CPC分类号： H01L33/502 , H01L21/568 , H01L25/165 , H01L33/0095 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/11 , H01L2224/19 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
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