-
公开(公告)号:US20060183348A1
公开(公告)日:2006-08-17
申请号:US11060843
申请日:2005-02-17
申请人: Robert Meagley , Michael Leeson , Michael Goodner , Bob Leet , Michael McSwiney , Shan Clark
发明人: Robert Meagley , Michael Leeson , Michael Goodner , Bob Leet , Michael McSwiney , Shan Clark
IPC分类号: H01L21/31
CPC分类号: H01L21/76808 , G03F7/091 , H01L21/0276 , H01L21/31144 , H01L21/76822 , H01L21/76829 , H01L21/76834 , H01L21/76835
摘要: Multiple-layer films in integrated circuit processing may be formed by the phase segregation of a single composition formed above a semiconductor substrate. The composition is then induced to phase segregate into at least a first continuous phase and a second continuous phase. The composition may be formed of two or more components that phase segregate into different continuous layers. The composition may also be a single component that breaks down upon activation into two or more components that phase segregate into different continuous layers. Phase segregation may be used to form, for example, a sacrificial light absorbing material (SLAM) and a developer resistant skin, a dielectric layer and a hard mask, a photoresist and an anti-reflective coating (ARC), a stress buffer coating and a protective layer on a substrate package, and light interference layers.
摘要翻译: 集成电路处理中的多层膜可以通过在半导体衬底上形成的单一组合物的相分离来形成。 然后将组合物诱导相分离成至少第一连续相和第二连续相。 组合物可以由相分离成不同连续层的两种或多种组分形成。 组合物还可以是单一组分,其在活化时分解成两个或多个相分离成不同连续层的组分。 相分离可用于形成例如牺牲光吸收材料(SLAM)和显影剂抗性皮肤,介电层和硬掩模,光致抗蚀剂和抗反射涂层(ARC),应力缓冲涂层和 衬底封装上的保护层,以及光干涉层。
-
公开(公告)号:US20060057506A1
公开(公告)日:2006-03-16
申请号:US11272316
申请日:2005-11-10
申请人: Michael Goodner , Robert Meagley , Michael Leeson
发明人: Michael Goodner , Robert Meagley , Michael Leeson
IPC分类号: G03C5/00
摘要: Photoresists may be formed over a structure that has been modified so as to poison a lower layer of the photoresist. Then, when the photoresist is patterned, it is only patterned down to the poisoned layer. The poisoned layer may be removed subsequently. However, because of the use of the modification process, the critical dimensions of the photoresist may be improved in some embodiments.
-
公开(公告)号:US20070032675A1
公开(公告)日:2007-02-08
申请号:US11580399
申请日:2006-10-13
申请人: Robert Meagley , Michael Goodner , Andrew Ott , Grant Kloster , Michael McSwiney , Bob Leet
发明人: Robert Meagley , Michael Goodner , Andrew Ott , Grant Kloster , Michael McSwiney , Bob Leet
CPC分类号: H01L21/02126 , C23C16/401 , H01L21/02216 , H01L21/02274 , H01L21/3122 , H01L21/31633
摘要: In one embodiment, the present invention includes introducing a precursor containing hydrocarbon substituents and optionally a second conventional or hydrocarbon-containing precursor into a vapor deposition apparatus; and forming a dielectric layer having the hydrocarbon substituents on a substrate within the vapor deposition apparatus from the precursor(s). In certain embodiments, at least a portion of the hydrocarbon substituents may be later removed from the dielectric layer to reduce density thereof.
摘要翻译: 在一个实施方案中,本发明包括将含有烃取代基的前体和任选的第二常规或含烃前体引入气相沉积设备中; 以及在所述气相沉积设备内的所述前体上形成具有所述烃取代基的介电层。 在某些实施方案中,至少一部分烃取代基可以稍后从介电层去除以降低其密度。
-
公开(公告)号:US20060205221A1
公开(公告)日:2006-09-14
申请号:US11417615
申请日:2006-05-03
申请人: Michael Goodner , Robert Meagley , Kevin O'Brien
发明人: Michael Goodner , Robert Meagley , Kevin O'Brien
IPC分类号: H01L21/465
CPC分类号: H01L21/76808 , H01L21/31144 , H01L21/76802
摘要: Several techniques are described for modulating the etch rate of a sacrificial light absorbing material (SLAM) by altering its composition so that it matches the etch rate of a surrounding dielectric. This particularly useful in a dual damascene process where the SLAM fills a via opening and is etched along with a surrounding dielectric material to form trenches overlying the via opening.
-
公开(公告)号:US20060255432A1
公开(公告)日:2006-11-16
申请号:US11485078
申请日:2006-07-12
申请人: Robert Meagley , Kevin O'Brien , Tian-An Chen , Michael Goodner , James Powers , Huey-Chiang Liou
发明人: Robert Meagley , Kevin O'Brien , Tian-An Chen , Michael Goodner , James Powers , Huey-Chiang Liou
IPC分类号: H01L23/58
CPC分类号: H01L23/5222 , H01L21/02118 , H01L21/02134 , H01L21/02137 , H01L21/02164 , H01L21/0234 , H01L21/02351 , H01L21/312 , H01L21/76224 , H01L21/7682 , H01L21/76825 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor structure may be covered with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity.
-
公开(公告)号:US20060068318A1
公开(公告)日:2006-03-30
申请号:US10956284
申请日:2004-09-30
申请人: Robert Meagley , Michael Goodner , Bob Leet , Michael McSwiney
发明人: Robert Meagley , Michael Goodner , Bob Leet , Michael McSwiney
IPC分类号: G03C1/76
CPC分类号: G03F7/0382 , G03F7/0392 , Y10S430/114 , Y10S430/115
摘要: A deliberately engineered placement and size constraint (molecular weight distribution) of photoacid generators, solubility switches, photoimageable species, and quenchers forms individual pixels within a photoresist. Upon irradiation, a self-contained reaction occurs within each of the individual pixels that were irradiated to pattern the photoresist. These pixels may take on a variety of forms including a polymer chain, a bulky cluster, a micelle, or a micelle formed of several polymer chains. Furthermore, these pixels may be designed to self-assemble onto the substrate on which the photoresist is applied.
摘要翻译: 光致酸产生剂,溶解度开关,可光成象物质和猝灭剂的故意设计的放置和尺寸约束(分子量分布)在光致抗蚀剂内形成各个像素。 在照射时,在被照射以对光致抗蚀剂进行图案化的各个像素内发生独立的反应。 这些像素可以具有各种形式,包括由几个聚合物链形成的聚合物链,大体积聚集体,胶束或胶束。 此外,这些像素可以被设计为自组装到其上施加光致抗蚀剂的基板上。
-
公开(公告)号:US20060003253A1
公开(公告)日:2006-01-05
申请号:US10881475
申请日:2004-06-30
申请人: Robert Meagley , Michael Goodner , Robert Leet , Michael McSwiney
发明人: Robert Meagley , Michael Goodner , Robert Leet , Michael McSwiney
IPC分类号: G03C1/492
CPC分类号: G03F7/0045 , Y10S430/106 , Y10S430/108 , Y10S430/115 , Y10S430/122 , Y10S430/126
摘要: A composition including a first moiety; and a different second moiety capable of harvesting energy from an external source, wherein the second moiety is positioned such that energy harvested at the second moiety may be transferred to the first moiety. An article of manufacture including a film including a first moiety and a different second moiety capable of harvesting energy from an external source, wherein the second moiety is positioned such that collectively the first and second moieties have an electron capture cross-section greater than the electron capture cross-section of the first moiety alone. A method including forming a film on a substrate including a first moiety and a different second moiety; exposing the film to photonic or charged particle radiation; and patterning the film.
摘要翻译: 包含第一部分的组合物; 以及能够从外部源收获能量的不同的第二部分,其中第二部分被定位成使得在第二部分收获的能量可以转移到第一部分。 包括包括第一部分和能够从外部源收集能量的不同第二部分的膜的制品,其中所述第二部分被定位成使得所述第一部分和所述第二部分的电子捕获截面大于所述电子 仅捕获第一部分的横截面。 一种方法,包括在包括第一部分和不同的第二部分的基底上形成膜; 将膜暴露于光子或带电粒子辐射; 并构图。
-
公开(公告)号:US20050129926A1
公开(公告)日:2005-06-16
申请号:US10735122
申请日:2003-12-12
申请人: Grant Kloster , Robert Meagley , Michael Goodner , Kevin O'brien
发明人: Grant Kloster , Robert Meagley , Michael Goodner , Kevin O'brien
CPC分类号: B32B3/26 , B32B2310/12 , B32B2457/00 , H01L21/76814 , Y10T428/249953 , Y10T428/249978 , Y10T428/249993 , Y10T428/31663
摘要: Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may be sealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
摘要翻译: 公开了用于最小化与邻近多孔电介质材料的微电子器件处理有关的缺点的方法和结构。 特别地,公开了化学方案,其中可以通过将偶联剂附着到孔的表面来密封多孔介电材料。 偶联剂可以在电介质表面中的反应性基团上形成全部或部分盖,或者可以交联以密封电介质中的孔。
-
公开(公告)号:US20050106886A1
公开(公告)日:2005-05-19
申请号:US10715956
申请日:2003-11-17
申请人: Michael Goodner , Robert Meagley , Kevin O'Brien
发明人: Michael Goodner , Robert Meagley , Kevin O'Brien
IPC分类号: H01L21/311 , H01L21/768 , H01L21/4763 , H01L21/302 , H01L21/461
CPC分类号: H01L21/76808 , H01L21/31144 , H01L21/76802
摘要: Several techniques are described for modulating the etch rate of a sacrificial light absorbing material (SLAM) by altering its composition so that it matches the etch rate of a surrounding dielectric. This is particularly useful in a dual damascene process where the SLAM fills a via opening and is etched along with a surrounding dielectric material to form trenches overlying the via opening.
摘要翻译: 描述了几种用于通过改变其组成以使其与周围电介质的蚀刻速率相匹配来调节牺牲光吸收材料(SLAM)的蚀刻速率的技术。 这在双镶嵌工艺中特别有用,其中SLAM填充通孔开口并与周围的电介质材料一起蚀刻以形成覆盖通孔开口的沟槽。
-
公开(公告)号:US20060046206A1
公开(公告)日:2006-03-02
申请号:US10927885
申请日:2004-08-27
IPC分类号: G03F7/00
CPC分类号: G03F7/40
摘要: A cap may be formed anisotropically over a photoresist feature. For example, a material, such as a polymer, may be coated over the photoresist feature. If the coated material is photoactive, the cap may be grown preferentially in the vertical direction, creating high aspect ratio structures in some embodiments of the present invention.
-
-
-
-
-
-
-
-
-