摘要:
A method and system for transferring data in a wireless USB system having a first USB enabled device and a second USB enabled device are provided. The method includes providing a first data having a first data transfer type, converting the first data to a second data having a second data transfer type, wirelessly transferring the second data from the first USB enabled device to the second USB enabled device using the second data transfer type, and converting the wirelessly transferred second data to a third data having the first data transfer type.
摘要:
A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.
摘要:
A display strip for packages includes an elongated backing member and transverse adhesive strips that extend completely across the backing member for adheringly holding individual packages. A plurality of the display strips are adhered transversely to a roll of release paper in a side-by-side arrangement. This allows the adhesive strips to form a substantially continuous strip of adhesive running parallel the length of the roll, and also allows the display strips to be presented one by one as the roll is unwound a short distance equal to a width of the display strips. Due to the short distance of the roll as it is unwound, the display strips are easily removed one at a time off an end of the roll.
摘要:
The present application discloses a method for preparing a homogeneous ternary or quaternary alloy from a quaternary melt. The method includes providing a family of phase diagrams for the quaternary melt which shows (i) composition/temperature data, (ii) tie lines connecting equilibrium liquid and solid compositions, and (iii) isotherms representing boundaries of a miscibility gap. Based on the family of phase diagrams, a quaternary melt composition and an alloy growth temperature is selected. A quaternary melt having the selected quaternary melt composition is provided and a ternary or quaternary alloy is grown from the quaternary melt at the selected alloy growth temperature. A method for making homogeneous ternary or quaternary alloy from a ternary or quaternary melt is also disclosed, as are homogeneous quaternary single-crystal alloys which are substantially free from crystal defects and which have the formula AxB1−xCyD1−y, x and y being the same or different and in the range of 0.001 to 0.999.
摘要:
A laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the subassemblies and wherein the subassemblies and joining layer are bonded together with a cured dielectric from a bondable, curable dielectric. The subassemblies and joining layer are electrically interconnected with bondable electrically conductive material. The joining layer comprises dielectric layers disposed about an internal electrically conductive layer. The electrically conductive layer has a via and the dielectric layers each have a via of smaller diameter than the vias in the electrically conductive layer and are aligned with the vias in the electrically conductive layer. The vias are filled with electrically bondable electrically conductive material for providing electrical contact between the subassemblies.
摘要:
A network controller system including a plurality of network ports and a driver system that operates the network ports as a team. The team is operated to simulate a single logical device in one of several team modes, such as fault tolerance or load balancing modes, to enhance performance of communication of the computer in a network. The driver system periodically determines and updates the status of each of the network ports, where the status of each is based at least on whether at least one directed packet has been received and transferred to the driver system by a respective network port. If any one of the network ports has not received a directed packet within a predetermined time period, the driver system commands another network port to transmit a directed heartbeat packet to the network port that has not received a directed packet. The team may include a primary and one or more secondary ports. The primary port sends a directed packet to any secondary port that has not received a directed packet within the predetermined time period. One or more of the secondary ports may each send a directed heartbeat packet to the primary port if the primary port has not received a directed packet within the predetermined time period.
摘要:
An electronic structure, and associated method of formation, in which a plated metallic layer such as a copper layer, of a plated through hole (PTH) is adhesively coupled to holefill material distributed within the PTH. The holefill material includes a resin such as an epoxy and optionally includes a particulate component such as a copper powder. The adhesive coupling is accomplished by forming an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as layer containing cupric oxide and cuprous oxide, which could be formed from bathing the PTH in a solution of sodium chlorite. Application of a reducing solution of dimethylamine borane to the cuprous oxide layer would convert some of the cuprous oxide to cupric oxide in the metallic oxide layer. Another possibility for an adhesion promoter film is an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. Useful organic corrosion inhibitors for this purpose include triazoles, tetrazoles, and imidazoles. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and an organic corrosion inhibitor.