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公开(公告)号：US20100155940A1
公开(公告)日：2010-06-24
申请号：US12640766
申请日：2009-12-17
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L23/5226 , H01L23/528 , H01L23/5386 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/81 , H01L24/94 , H01L25/074 , H01L25/50 , H01L2221/68372 , H01L2224/0401 , H01L2224/05557 , H01L2224/0557 , H01L2224/05572 , H01L2224/06181 , H01L2224/1147 , H01L2224/11472 , H01L2224/13009 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13021 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/16058 , H01L2224/16112 , H01L2224/16146 , H01L2224/274 , H01L2224/81136 , H01L2224/81345 , H01L2224/81365 , H01L2224/81801 , H01L2224/81898 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1205 , H01L2924/1306 , H01L2924/14 , H01L2924/1451 , H01L2924/19041 , H01L2924/30107 , H01L2924/35121 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface-electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.
摘要翻译： 在层叠多个半导体芯片的半导体装置中，不会降低生产率而提高性能。 半导体器件具有多个元件，层间绝缘膜，焊盘和与依次形成在硅基板的主表面上的焊盘电连接的凸块电极，并且具有形成在硅衬底的背面上的背面电极 硅基板并与凸块电极电连接。 凸块电极具有贯穿焊盘并朝向硅衬底侧突出的突出部分。 背面电极形成为从硅衬底的背面侧朝向主面侧到达突起电极的突出部，并覆盖未到达的背面电极孔部的内部 垫，使得背面电极与凸块电极电连接。
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公开(公告)号：US20090309218A1
公开(公告)日：2009-12-17
申请号：US12483751
申请日：2009-06-12
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05025 , H01L2224/05144 , H01L2224/05155 , H01L2224/05553 , H01L2224/0557 , H01L2224/05572 , H01L2224/1134 , H01L2224/13025 , H01L2224/13099 , H01L2224/81136 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/19043 , H01L2924/30107 , H01L2924/00014 , H01L2224/05552
摘要： When a through-hole electrode and a rear-surface wire are formed on a rear surface of a chip, a convex portion is formed on the rear surface of the chip due to a rear-surface wiring pad which is a part of the through-hole electrode and the rear-surface wire. This causes the air leakage when the chip is sucked, and therefore, the reduction of the sucking force of the chip occurs. A concave portion is formed in advance in a region where a rear-surface wiring pad and a rear-surface wire are formed. The rear-surface wiring pad and the rear-surface wire are provided inside the concave portion. Thus, a flatness of the rear surface of the chip is ensured by a convex portion caused by thicknesses of the rear-surface wiring pad and the rear-surface wire, so that the reduction of the sucking force does not occur when the chip is handled.
摘要翻译： 当在芯片的后表面上形成通孔电极和后表面线时，由于作为通孔的一部分的后表面布线板，在芯片的后表面上形成凸部， 孔电极和后表面电线。 这导致当芯片被吸入时的空气泄漏，因此发生芯片的吸力的降低。 预先在形成背面布线衬垫和背面导线的区域中形成凹部。 后表面布线板和后表面布线设置在凹部内。 因此，通过由背面布线衬垫和后表面线的厚度引起的凸部来确保芯片的后表面的平坦度，使得当处理芯片时不会发生吸力的降低 。
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3.发明申请公开(公告)号：US20120108055A1
公开(公告)日：2012-05-03
申请号：US13345235
申请日：2012-01-06
IPC分类号： H01L21/768
CPC分类号： H01L24/16 , H01L21/6835 , H01L21/7682 , H01L21/76898 , H01L23/481 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05571 , H01L2224/05572 , H01L2224/1134 , H01L2224/13025 , H01L2224/13099 , H01L2224/16145 , H01L2224/16147 , H01L2224/16225 , H01L2224/16237 , H01L2224/73204 , H01L2224/81141 , H01L2224/81191 , H01L2224/838 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/00012 , H01L2224/05552
摘要： After forming a ring-shaped trench penetrating through a semiconductor substrate from a rear surface side thereof and forming an insulating film inside the trench and on the rear surface of the semiconductor substrate, a through hole is formed in the insulating film and semiconductor substrate on an inner side of the ring-shaped trench from the rear surface side, thereby exposing a surface protection insulating film formed on a front surface of the semiconductor substrate at a bottom of the through hole. After removing the surface protection insulating film at the bottom of the through hole to form an opening to expose an element surface electrode, a contact electrode connected to the element surface electrode is formed on inner walls of the through hole and opening, and a pad electrode made of the same layer as the contact electrode is formed on the rear surface of the semiconductor substrate.
摘要翻译： 在形成从其后表面侧穿过半导体衬底的环形沟槽形成并在沟槽内部和半导体衬底的后表面上形成绝缘膜之后，在绝缘膜和半导体衬底上形成通孔 从后表面侧的环形沟槽的内侧，露出在通孔的底部形成在半导体衬底的前表面上的表面保护绝缘膜。 在去除通孔底部的表面保护绝缘膜以形成露出元件表面电极的开口之后，在通孔和开口的内壁上形成连接到元件表面电极的接触电极，并且焊盘电极 由与所述接触电极相同的层形成在所述半导体衬底的后表面上。
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公开(公告)号：US20120136553A1
公开(公告)日：2012-05-31
申请号：US13307687
申请日：2011-11-30
IPC分类号： F02D17/04
CPC分类号： F02N11/0814 , B60W20/00 , F02D17/04 , F02N11/0818 , F02N11/0822 , F02N11/0833 , F02N11/0837 , Y02T10/48
摘要： A control apparatus controls an automatic stop of an engine mounted on a vehicle so as to automatically stop the engine if a predetermined stop condition is satisfied, the stop condition including a condition that a running speed of the vehicle is a prescribed speed or less. The control apparatus includes a prediction unit and a prohibition unit. The prediction unit predicts whether or not the next automatic stop time of the engine is less than a prescribed time capable of obtaining a fuel saving benefit based on a history of a vehicle stop time or an automatic stop time of the engine. The prohibition unit prohibits the next automatic stop of the engine if the prediction unit predicts that the next automatic stop time of the engine is less than the prescribed time.
摘要翻译： 控制装置控制安装在车辆上的发动机的自动停止，以便如果满足预定的停止条件则自动停止发动机，停止条件包括车辆行驶速度等于或小于规定速度的条件。 控制装置包括预测单元和禁止单元。 预测单元预测发动机的下一自动停止时间是否小于能够基于发动机的停车时间或自动停止时间的历史来获得省燃料收益的规定时间。 如果预测单元预测发动机的下一个自动停止时间小于规定时间，则禁止单元禁止发动机的下一个自动停止。
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公开(公告)号：US20080315500A1
公开(公告)日：2008-12-25
申请号：US12140690
申请日：2008-06-17
申请人： Daisuke TAKASAKA , Takahiro NAITO
发明人： Daisuke TAKASAKA , Takahiro NAITO
CPC分类号： B65H3/0623 , B65H1/266 , B65H2301/331 , B65H2405/1117 , B65H2405/1142 , B65H2801/06 , Y10S271/902
摘要： This paper feed mechanism includes a paper feed cassette integrally having a paper contact portion on a position deviating from the center of a rear-side inner wall surface in the cross direction by a prescribed distance in the cross direction and an apparatus body mountable with the paper feed cassette, and the apparatus body includes a driving portion rotating a paper feed roller in a paper feed direction and a paper discharge direction and a control portion bringing the rear end of the paper into contact with the paper contact portion for generating torque for the paper and thereafter transporting the paper to the apparatus body in paper feeding.
摘要翻译： 该送纸机构包括：进纸盒，其一体地具有纸张接触部分，该纸张接触部分在横向方向上从背面内壁表面的中心偏离预定距离的位置，以及可安装在纸张上的装置主体 进给盒，装置主体包括驱动部，其沿供纸方向和排纸方向旋转供纸辊，使控制部使纸的后端与纸张接触部接触，以产生纸张的扭矩 然后在送纸中将纸张输送到装置主体。
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公开(公告)号：US20220242346A1
公开(公告)日：2022-08-04
申请号：US17589894
申请日：2022-02-01
IPC分类号： B60R19/18
摘要： A bumper reinforcement includes a front wall, a rear wall disposed behind the front wall, at least one horizontal wall connecting the front wall and the rear wall, and a cutout in the at least one horizontal wall. The cutout extends laterally inward from a lateral end of the at least one horizontal wall. The cutout divides a lateral end portion of the bumper reinforcement between a front end portion located in front of the cutout and a rear end portion located behind the cutout. The front end portion includes a protruded portion which is bent rearward to be tilted with respect to the rear wall and protrudes laterally outward further than a lateral end of the rear end portion.
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