-
1.发明授权公开(公告)号：US08638542B2
公开(公告)日：2014-01-28
申请号：US12833185
申请日：2010-07-09
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
CPC分类号： H05K1/162 , H01G4/012 , H01G4/232 , H01G4/302 , H05K1/0287 , H05K1/0306 , H05K2201/09263 , H05K2201/09563 , H05K2201/09609 , H05K2201/097 , H05K2201/09945
摘要： A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.
摘要翻译： 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。
-
公开(公告)号：US20120327626A1
公开(公告)日：2012-12-27
申请号：US13528987
申请日：2012-06-21
CPC分类号： H01L21/486 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K3/4602 , H05K2201/10378 , Y10T29/49124 , H01L2924/00
摘要： One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.
摘要翻译： 一个实施例提供一种布线基板，包括：具有绝缘基底构件的芯基板，所述绝缘基底构件具有第一表面和第二表面;多个线状导体，从所述第一表面穿过所述绝缘基底构件到所述第二表面; 连接到所述绝缘基体的第一表面和所述第二表面中的至少一个的无机材料层; 以及穿透无机材料层的穿透线，其中穿透线的一端电连接到线性导体的相应部分，而不会发生凹凸。
-
公开(公告)号：US08138609B2
公开(公告)日：2012-03-20
申请号：US12832177
申请日：2010-07-08
IPC分类号： H01L23/48
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/09701 , H05K1/0306 , H05K1/185 , H05K3/4605 , H05K2201/0116 , H05K2201/09609 , H05K2201/09945 , H05K2201/10674 , H05K2203/0315 , H05K2203/1142 , H01L2924/00
摘要： In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.
摘要翻译： 在半导体器件中，衬底包括从衬底的顶表面到底表面穿透衬底的多个线导体。 半导体芯片固定在基板的孔中。 在衬底和半导体芯片的顶表面上形成第一绝缘层。 第一布线层形成在第一绝缘层上，并且经由第一绝缘层的通孔与半导体芯片电连接，一些线导体暴露于一个通孔。 在基板和半导体芯片的底面上形成第二绝缘层。 第二布线层形成在第二绝缘层上，并且经由第二绝缘层的通孔与暴露于通孔的一些线导体电连接。
-
公开(公告)号：US09006586B2
公开(公告)日：2015-04-14
申请号：US13528987
申请日：2012-06-21
IPC分类号： H05K1/11 , H01L21/48 , H01L23/498 , H05K3/46
CPC分类号： H01L21/486 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K3/4602 , H05K2201/10378 , Y10T29/49124 , H01L2924/00
摘要： One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.
摘要翻译： 一个实施例提供一种布线基板，包括：具有绝缘基底构件的芯基板，所述绝缘基底构件具有第一表面和第二表面;多个线状导体，从所述第一表面穿过所述绝缘基底构件到所述第二表面; 连接到所述绝缘基体的第一表面和所述第二表面中的至少一个的无机材料层; 以及穿透无机材料层的穿透线，其中穿透线的一端电连接到线性导体的相应部分，而不会发生凹凸。
-
5.发明授权Wiring board having piercing linear conductors and semiconductor device using the same 有权具有穿孔线性导体的接线板和使用其的半导体器件公开(公告)号：US08242612B2
公开(公告)日：2012-08-14
申请号：US12813692
申请日：2010-06-11
CPC分类号： H01L23/49827 , H01L23/49838 , H01L23/50 , H01L24/16 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/0227 , H05K1/162 , H05K3/4605 , H05K2201/09236 , H05K2201/093 , H05K2201/09309 , H05K2201/09345 , H05K2201/09609
摘要： A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
摘要翻译： 布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线 线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线 线性导体。
-
公开(公告)号：US20110018144A1
公开(公告)日：2011-01-27
申请号：US12813692
申请日：2010-06-11
CPC分类号： H01L23/49827 , H01L23/49838 , H01L23/50 , H01L24/16 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/0227 , H05K1/162 , H05K3/4605 , H05K2201/09236 , H05K2201/093 , H05K2201/09309 , H05K2201/09345 , H05K2201/09609
摘要： A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
摘要翻译： 布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线 线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线 线性导体。
-
公开(公告)号：US20110013340A1
公开(公告)日：2011-01-20
申请号：US12833185
申请日：2010-07-09
申请人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
CPC分类号： H05K1/162 , H01G4/012 , H01G4/232 , H01G4/302 , H05K1/0287 , H05K1/0306 , H05K2201/09263 , H05K2201/09563 , H05K2201/09609 , H05K2201/097 , H05K2201/09945
摘要： A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.
摘要翻译： 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。
-
公开(公告)号：US20110012266A1
公开(公告)日：2011-01-20
申请号：US12832177
申请日：2010-07-08
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/09701 , H05K1/0306 , H05K1/185 , H05K3/4605 , H05K2201/0116 , H05K2201/09609 , H05K2201/09945 , H05K2201/10674 , H05K2203/0315 , H05K2203/1142 , H01L2924/00
摘要： In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.
摘要翻译： 在半导体器件中，衬底包括从衬底的顶表面到底表面穿透衬底的多个线导体。 半导体芯片固定在基板的孔中。 在衬底和半导体芯片的顶表面上形成第一绝缘层。 第一布线层形成在第一绝缘层上，并且经由第一绝缘层的通孔与半导体芯片电连接，一些线导体暴露于一个通孔。 在基板和半导体芯片的底面上形成第二绝缘层。 第二布线层形成在第二绝缘层上，并且经由第二绝缘层的通孔与暴露于通孔的一些线导体电连接。
-
9.发明申请公开(公告)号：US20130081796A1
公开(公告)日：2013-04-04
申请号：US13613720
申请日：2012-09-13
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
CPC分类号： H01L23/3677 , H01L21/4882 , H01L21/50 , H01L23/3733 , H01L23/3735 , H01L23/433 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H05K7/2039 , H05K7/20509 , H01L2924/00
摘要： A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.
摘要翻译： 热界面材料包括金属箔，其具有第一表面和相对的第二表面，以及多个棒状导体，每个棒状导体的侧表面在金属箔的厚度方向上延伸。 棒状导体沿垂直于厚度方向的平面方向布置在金属箔的第一表面和第二表面中的至少一个上。 树脂层至少覆盖金属箔的第一表面和第二表面以及棒状导体的侧表面。
-
10.发明授权公开(公告)号：US08324513B2
公开(公告)日：2012-12-04
申请号：US13009987
申请日：2011-01-20
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
IPC分类号： H05K1/11
CPC分类号： H01L23/552 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L25/0657 , H01L25/105 , H01L2223/6622 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/3025 , H01L2924/00
摘要： A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole.
摘要翻译： 布线基板包括：芯基板，包括具有第一表面和第二表面的无机介电绝缘基材，以及贯穿绝缘基体的线状导体; 第一表面上的第一布线层，电连接到一部分直线导体; 在所述第二表面上的与所述线状导体的所述部分电连接的第二布线层; 在所述第一表面上覆盖所述第一布线层并包括第一通孔的第一绝缘层; 所述第一绝缘层上的第三布线层经由所述第一通孔与所述第一布线层电连接; 覆盖所述第二布线层并且包括第二通孔的所述第二表面上的第二绝缘层; 以及通过第二通孔与第二布线层电连接的第二绝缘层上的第四布线层。
-
-
-
-
-
-
-
-
-
搜索结果
37 条记录 (耗时 0.02 秒)