High mobility tri-gate devices and methods of fabrication
    1.
    发明授权
    High mobility tri-gate devices and methods of fabrication 有权
    高移动性三栅极器件和制造方法

    公开(公告)号:US08084818B2

    公开(公告)日:2011-12-27

    申请号:US11332189

    申请日:2006-01-12

    IPC分类号: H01L27/12

    摘要: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

    摘要翻译: 高迁移率半导体组件。 在一个示例性方面,高迁移率半导体组件包括具有位于第一衬底上的<110>晶面位置处的第一参考取向的第一衬底和形成在第一衬底顶部上的第二衬底。 第二衬底具有位于第二衬底上的<100>晶面位置处的第二参考取向,其中第一参考取向与第二参考取向对准。 在另一示例性方面,第二衬底具有位于第二衬底上的<110>晶面位置处的第二参考取向,其中第二衬底形成在第一衬底上,第二参考取向通过 约45度。

    High mobility tri-gate devices and methods of fabrication
    2.
    发明申请
    High mobility tri-gate devices and methods of fabrication 有权
    高移动性三栅极器件和制造方法

    公开(公告)号:US20100065888A1

    公开(公告)日:2010-03-18

    申请号:US11332189

    申请日:2006-01-12

    IPC分类号: H01L29/778

    摘要: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

    摘要翻译: 高迁移率半导体组件。 在一个示例性方面,高迁移率半导体组件包括具有位于第一衬底上的<110>晶面位置处的第一参考取向的第一衬底和形成在第一衬底顶部上的第二衬底。 第二衬底具有位于第二衬底上的<100>晶面位置处的第二参考取向,其中第一参考取向与第二参考取向对准。 在另一示例性方面,第二衬底具有位于第二衬底上的<110>晶面位置处的第二参考取向,其中第二衬底形成在第一衬底上,第二参考取向通过 约45度。

    High mobility tri-gate devices and methods of fabrication
    3.
    发明授权
    High mobility tri-gate devices and methods of fabrication 失效
    高移动性三栅极器件和制造方法

    公开(公告)号:US07042009B2

    公开(公告)日:2006-05-09

    申请号:US10883183

    申请日:2004-06-30

    IPC分类号: H01L27/01 H01L29/04

    摘要: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

    摘要翻译: 高迁移率半导体组件。 在一个示例性方面,高迁移率半导体组件包括具有位于第一衬底上的<110>晶面位置处的第一参考取向的第一衬底和形成在第一衬底顶部上的第二衬底。 第二衬底具有位于第二衬底上的<100>晶面位置处的第二参考取向,其中第一参考取向与第二参考取向对准。 在另一示例性方面,第二衬底具有位于第二衬底上的<110>晶面位置处的第二参考取向,其中第二衬底形成在第一衬底上,第二参考取向通过 约45度。