High mobility tri-gate devices and methods of fabrication
    1.
    发明授权
    High mobility tri-gate devices and methods of fabrication 失效
    高移动性三栅极器件和制造方法

    公开(公告)号:US07042009B2

    公开(公告)日:2006-05-09

    申请号:US10883183

    申请日:2004-06-30

    IPC分类号: H01L27/01 H01L29/04

    摘要: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

    摘要翻译: 高迁移率半导体组件。 在一个示例性方面,高迁移率半导体组件包括具有位于第一衬底上的<110>晶面位置处的第一参考取向的第一衬底和形成在第一衬底顶部上的第二衬底。 第二衬底具有位于第二衬底上的<100>晶面位置处的第二参考取向,其中第一参考取向与第二参考取向对准。 在另一示例性方面,第二衬底具有位于第二衬底上的<110>晶面位置处的第二参考取向,其中第二衬底形成在第一衬底上,第二参考取向通过 约45度。

    High mobility tri-gate devices and methods of fabrication
    2.
    发明授权
    High mobility tri-gate devices and methods of fabrication 有权
    高移动性三栅极器件和制造方法

    公开(公告)号:US08084818B2

    公开(公告)日:2011-12-27

    申请号:US11332189

    申请日:2006-01-12

    IPC分类号: H01L27/12

    摘要: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

    摘要翻译: 高迁移率半导体组件。 在一个示例性方面,高迁移率半导体组件包括具有位于第一衬底上的<110>晶面位置处的第一参考取向的第一衬底和形成在第一衬底顶部上的第二衬底。 第二衬底具有位于第二衬底上的<100>晶面位置处的第二参考取向,其中第一参考取向与第二参考取向对准。 在另一示例性方面,第二衬底具有位于第二衬底上的<110>晶面位置处的第二参考取向,其中第二衬底形成在第一衬底上,第二参考取向通过 约45度。

    High mobility tri-gate devices and methods of fabrication
    3.
    发明申请
    High mobility tri-gate devices and methods of fabrication 有权
    高移动性三栅极器件和制造方法

    公开(公告)号:US20100065888A1

    公开(公告)日:2010-03-18

    申请号:US11332189

    申请日:2006-01-12

    IPC分类号: H01L29/778

    摘要: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

    摘要翻译: 高迁移率半导体组件。 在一个示例性方面,高迁移率半导体组件包括具有位于第一衬底上的<110>晶面位置处的第一参考取向的第一衬底和形成在第一衬底顶部上的第二衬底。 第二衬底具有位于第二衬底上的<100>晶面位置处的第二参考取向,其中第一参考取向与第二参考取向对准。 在另一示例性方面,第二衬底具有位于第二衬底上的<110>晶面位置处的第二参考取向,其中第二衬底形成在第一衬底上,第二参考取向通过 约45度。

    Trigate static random-access memory with independent source and drain engineering, and devices made therefrom
    10.
    发明授权
    Trigate static random-access memory with independent source and drain engineering, and devices made therefrom 有权
    调整静态随机存取存储器,具有独立的源和漏极工程,以及由此制造的器件

    公开(公告)号:US08361871B2

    公开(公告)日:2013-01-29

    申请号:US12317536

    申请日:2008-12-24

    IPC分类号: H01L21/336

    摘要: A static random-access memory circuit includes at least one access device including source and drain sections for a pass region, at least one pull-up device and at least one pull-down device including source-and-drain sections for a pull-down region. The static random-access memory circuit is configured with external resistivity (Rext) for the pull-down region to be lower than Rext for the pass region. Processes of achieving the static random-access memory circuit include source-and-drain epitaxy.

    摘要翻译: 静态随机存取存储器电路包括至少一个访问装置,其包括用于通过区域的源极和漏极部分,至少一个上拉装置和至少一个下拉装置,其包括用于下拉的源极和漏极部分 地区。 静态随机存取存储器电路被配置为用于下拉区域的外部电阻率(Rext)低于用于通过区域的Rext。 实现静态随机存取存储器电路的过程包括源极和漏极外延。