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公开(公告)号：US12278062B2
公开(公告)日：2025-04-15
申请号：US18029379
申请日：2021-09-22
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD
Inventor： Huisheng Han , Yang Ding , Lu Chen , Hongmei Zhang , Linyu Ye , Xiaosheng Wu , Guoqiang Wu , Cheng Huang
Abstract: A rubber and metal composite electric contact and a preparation process therefor. The rubber and metal composite electric contact is a circular layered complex which is formed by tightly combining a metal sheet layer having a plurality of through holes and a rubber layer by means of thermal vulcanization molding and which has a thickness of 0.1 to 5 mm and a diameter of 1 to 15 mm. There is no isolation layer between the rubber layer and the metal layer of the electric contact, so no rubber overflows the outer surface of the metal layer. In the rubber and metal composite electric contact, the rubber and metal are combined firmly and the overall strength of the electric contact is adjustable; the electric contact also has good dust resistance; and the electric contact thus has stable and reliable electrical conductivity.
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公开(公告)号：US10224156B2
公开(公告)日：2019-03-05
申请号：US15318074
申请日：2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang , Zhihao Dong , Jie Shi
IPC: H01H13/10 , H01H1/021 , C25D3/56 , C25D3/60 , C25D5/02 , H01H1/025 , H01H11/06 , C25D5/34 , C25D5/36 , C25D5/40 , C25D7/00 , C23C18/16 , C23C18/32 , C23C18/52 , H01H13/785
Abstract: The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.
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公开(公告)号：US10026565B2
公开(公告)日：2018-07-17
申请号：US14896405
申请日：2014-11-12
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Hongmei Zhang , Yuan Chen , Yang Ding , Guoqiang Wu
IPC: H01H1/02 , H01H1/021 , H01H1/06 , H01H11/04 , C23C18/31 , C23F1/16 , C23F1/32 , C25D3/12 , C25D3/48 , C25D7/00 , C08J5/12 , B32B15/06 , B32B15/18 , B32B15/20 , B32B25/20
Abstract: A switch contact element, having a layered structure comprising three layers: the bottom layer is silicone rubber, the middle layer is a continuous base metal sheet layer, and the upper layer is a discontinuous (stripe-shaped, raised-point-shaped or lattice-shaped) precious metal plated layer or a double-metal composite layer of a discontinuous base metal plated layer and a precious metal plated layer. The thickness of the bottom layer is greater than that of the middle layer, the thickness of the middle layer is greater than that of the upper layer, and the thickness of the upper layer meets the conditions that the conductive current is greater than safe current of conductive contacts on a circuit board, and the service life of a switch for the design is ensured.
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公开(公告)号：US09905376B2
公开(公告)日：2018-02-27
申请号：US15318042
申请日：2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang
IPC: H01H1/021 , H01H11/04 , H01H11/06 , C23C18/16 , C23C18/18 , C23C18/36 , C23C18/50 , C23C18/52 , C23C18/48 , C25D3/14 , C25D3/56 , C25D7/00
CPC classification number: H01H1/021 , C23C18/1633 , C23C18/1692 , C23C18/1806 , C23C18/1844 , C23C18/36 , C23C18/48 , C23C18/50 , C23C18/52 , C25D3/14 , C25D3/562 , C25D7/00 , H01H11/041 , H01H11/06 , H01H2011/046
Abstract: An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.
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Patent Agency Ranking
公开(公告)号：US20170125180A1
公开(公告)日：2017-05-04
申请号：US15318144
申请日：2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang
CPC classification number: H01H1/021 , C23C18/1633 , C23C18/1692 , C23C18/1806 , C23C18/1844 , C23C18/32 , C23C18/48 , C23C18/50 , C23C18/52 , C25D3/12 , C25D3/562 , C25D7/00 , H01H11/041 , H01H11/042 , H01H11/06 , H01H2011/046 , H01H2011/067
Abstract: An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.
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公开(公告)号：US10026564B2
公开(公告)日：2018-07-17
申请号：US14896403
申请日：2014-09-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD
Inventor： Huisheng Han , Hongmei Zhang , Yang Ding , Zhihong Dong , Cheng Huang
IPC: H01B13/00 , H01H1/02 , H01H11/04 , C23C18/16 , C25D3/46 , C25D5/02 , C25D5/48 , H01H1/023 , C25D5/12 , C23C18/42 , C25D3/48 , H01H1/06 , C25D3/54
Abstract: This invention discloses a preparation method for precious metal switching contact components by means of plating masking, plating and etching processes. The plating masking process is performed by using a plating mask ink with or without a photo exposure machine. Plating of precious metals is performed by electroless plating or electro plating methods. Etching is carried out with etching solutions containing weak organic acids, weak inorganic acids or acidic buffering agents. Improvement of the etched surface gloss and prevention of the side etching are realized with the sulfur-contained compounds. The dust- and oil stain-resistances of the switch contacts are improved by increasing the etching depth. The switch contacts made by this invention are featured with the advantages of good reliability, good resistance to dust and oil stain, short contact bounce time, long service life, low cost of raw materials and so on.
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公开(公告)号：US20170133174A1
公开(公告)日：2017-05-11
申请号：US15318074
申请日：2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang , Zhihao Dong , Jie Shi
CPC classification number: H01H13/10 , C23C18/1689 , C23C18/1692 , C23C18/32 , C23C18/52 , C25D3/56 , C25D3/60 , C25D5/02 , C25D5/34 , C25D5/36 , C25D5/40 , C25D7/00 , H01H1/021 , H01H1/025 , H01H11/06 , H01H13/785 , H01H2011/065 , H01H2201/002 , H01H2201/022 , H01H2229/014
Abstract: The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.
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公开(公告)号：US10079119B2
公开(公告)日：2018-09-18
申请号：US15318144
申请日：2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang
IPC: H01H1/021 , H01H11/04 , H01H11/06 , C23C18/48 , C25D3/12 , C25D3/56 , C23C18/16 , C23C18/18 , C23C18/32 , C23C18/50 , C23C18/52 , C25D7/06 , C25D7/00
CPC classification number: H01H1/021 , C23C18/1633 , C23C18/1692 , C23C18/1806 , C23C18/1844 , C23C18/32 , C23C18/48 , C23C18/50 , C23C18/52 , C25D3/12 , C25D3/562 , C25D7/00 , H01H11/041 , H01H11/042 , H01H11/06 , H01H2011/046 , H01H2011/067
Abstract: An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.
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公开(公告)号：US20170125179A1
公开(公告)日：2017-05-04
申请号：US15318042
申请日：2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor： Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang
CPC classification number: H01H1/021 , C23C18/1633 , C23C18/1692 , C23C18/1806 , C23C18/1844 , C23C18/36 , C23C18/48 , C23C18/50 , C23C18/52 , C25D3/14 , C25D3/562 , C25D7/00 , H01H11/041 , H01H11/06 , H01H2011/046
Abstract: An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.
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