Electrochemical device
    2.
    发明授权
    Electrochemical device 失效
    电化学装置

    公开(公告)号:US08619409B2

    公开(公告)日:2013-12-31

    申请号:US13122139

    申请日:2009-09-30

    摘要: An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.

    摘要翻译: 诸如双电层电容器的电化学装置适用于使用无铅焊料的高温回流焊接,并且设置有蓄电元件,其中密封有蓄电元件的封装和 正极端子和负极端子,每个从蓄电元件引出,并且设置有封装在封装中的部分,其中蓄电元件和其它部分被引出到封装外部。 在正极端子的一部分和负极端子的一部分上,增加了用于抑制从正极端子的其他部分和负极端子的其他部分经由端子对蓄电元件的热传递的热阻部分 分别布置。

    Electrochemical device
    3.
    发明授权
    Electrochemical device 有权
    电化学装置

    公开(公告)号:US09023510B2

    公开(公告)日:2015-05-05

    申请号:US13635288

    申请日:2011-03-11

    摘要: [Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card.[Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.

    摘要翻译: 本发明提供允许薄封装的电化学装置,并且即使在电化学装置回流焊接到电化学装置期间在电化学装置中发生温度上升时,也可以可靠地防止内部空间中的电解质或气体泄漏到外部 电路板或封装在IC卡中。 [解决方案]在电化学装置RB1中,封装PA的主体包括依次层叠的第一盖板15,第一端子板12,框架板14,第二端子板13和第二盖板16, 表面。 蓄电元件SD被封装在通过端子板12,13的框架部分12a,13a中的通孔12a1,13a1和框架中的通孔14a之间形成在盖板15,16之间的内部空间IS中 板14。

    ELECTROCHEMICAL DEVICE
    4.
    发明申请
    ELECTROCHEMICAL DEVICE 失效
    电化学装置

    公开(公告)号:US20110176254A1

    公开(公告)日:2011-07-21

    申请号:US13122139

    申请日:2009-09-30

    IPC分类号: H01G9/00

    摘要: Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.

    摘要翻译: 提供了适用于使用无铅焊料的高温回流焊接的电化学装置。 双电层电容器(10)具有电容器元件(11),密封有电容器元件(11)的封装(14)和正极端子(12)和负极端子(13), 其中的每一个从电容器元件引出并且设置有密封在封装(14)中的部分,电容器元件和其它部分被引出到封装的外部。 在正极端子(12)的一部分和负极端子(13)的一部分上,经由端子(12,13)抑制向电容器元件(11)的热传递的增加的热阻部(HR1) 从正极端子(12)的其他部分和负极端子(13)的其他部分分别配置。

    Electrochemical device
    6.
    发明授权
    Electrochemical device 有权
    电化学装置

    公开(公告)号:US08804310B2

    公开(公告)日:2014-08-12

    申请号:US13383411

    申请日:2010-06-03

    摘要: Provided is an electrochemical device which is capable of suppressing problems affecting the capacitor element as a whole, such as a drop in its voltage resistance characteristics and shortening of its life. The capacitor element (10) is constituted of a laminate formed by superposition of a first electrode sheet (11), a separation sheet (14), a second electrode sheet (12), a separation sheet (14), and a third electrode sheet (13) in the named order from the bottom, and folding the laminate along a reference line VSL to double the laminate. In the resulting folded laminate, a collector electrode layer (11a) and polarizable electrode layer (11b) of the first electrode sheet (11), the collector electrode layer (12a) and polarizable electrode layer (12b) of the second electrode sheet (12), the collector electrode (13a) and polarizable electrode layer (13b) of the third electrode sheet (13), and the two separation sheets (14) are connected to each other at the respective folded locations.

    摘要翻译: 提供一种电化学装置,其能够抑制影响电容器元件整体的问题,例如其耐电压特性的降低和其使用寿命的缩短。 电容器元件(10)由通过第一电极片(11),分离片(14),第二电极片(12),分离片(14)和第三电极片 (13)以从底部起命名的顺序,并且沿着参考线VSL折叠层压体以使层压体翻倍。 在得到的折叠层叠体中,第一电极片(11)的集电极层(11a)和极化电极层(11b),第二电极片(12)的集电极层(12a)和极化电极层(12b) ),第三电极片(13)的集电极(13a)和极化电极层(13b)和两个分离片(14)在各个折叠位置彼此连接。

    Electrochemical device
    7.
    发明授权
    Electrochemical device 失效
    电化学装置

    公开(公告)号:US08455136B2

    公开(公告)日:2013-06-04

    申请号:US12538498

    申请日:2009-08-10

    IPC分类号: H01M2/00

    摘要: An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.

    摘要翻译: 能够通过焊接安装的电化学装置包括由薄膜制成的薄膜包装; 在所述膜包装中与电解质一起封装的电极部分; 一对端子,每个端子的一端连接到所述电极部分,并且每个端子的另一端暴露于所述胶片包装件的外部; 以及与所述薄膜包装的基本上整个表面接触并分别与所述一对端子的暴露端部的部分表面接触的装甲,以封装所述薄膜包装,所述装甲将所述一对端子的剩余部分暴露于 外套的装甲。

    ELECTROCHEMICAL DEVICE
    8.
    发明申请
    ELECTROCHEMICAL DEVICE 失效
    电化学装置

    公开(公告)号:US20110033745A1

    公开(公告)日:2011-02-10

    申请号:US12538498

    申请日:2009-08-10

    IPC分类号: H01M2/02 H01G9/155

    摘要: An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.

    摘要翻译: 能够通过焊接安装的电化学装置包括由薄膜制成的薄膜包装; 在所述膜包装中与电解质一起封装的电极部分; 一对端子,每个端子的一端连接到所述电极部分,并且每个端子的另一端暴露于所述胶片包装件的外部; 以及与所述薄膜包装的基本上整个表面接触并分别与所述一对端子的暴露端部的部分表面接触的装甲,以封装所述薄膜包装,所述铠装将所述一对端子的剩余部分暴露于 外套的装甲。