摘要:
Read data line pairs, write data line pairs, a spare read data line pair, and a spare write data line pair are provided extending in the column direction over a memory cell array. Spare bit repair is performed by replacing a data line pair. Column redundancy control circuit changes the timing for outputting the result of spare determination for a data write mode and for a data read mode. A semiconductor memory device suitable for merging with a logic and capable of reducing the current consumption and achieving a higher operation frequency is provided.
摘要:
A central row-related control circuit transmits an internal row address signal to each memory sub block in banks of memory mats asynchronously with an external clock signal, and latches a block selection signal for specifying a memory sub block synchronously with an internal clock signal for one clock cycle period for transmission to each memory sub block. A spare determination circuit performs spare determination asynchronously with the clock signal. A semiconductor memory device easily adaptable to bank expansion without increase of the chip area and capable of implementing a high speed access can be provided.
摘要:
A DRAM includes two main column selecting lines provided at each sense amplifier zone, eight sub column selecting lines provided at each sense amplifier zone to correspond to each memory block, two sub decoder column selecting lines provided at each sub decoder zone, a sub column decoder provided at each crossing portion of the sense amplifier zone and the sub decoder zone to select one sub column selecting line from corresponding eight sub column selecting lines in accordance with a signal from the two main column selecting lines and the two sub decoder column selecting lines. The area of the sense amplifier zone can be reduced compared to that of a conventional DRAM in which all signal lines for column selection were provided at a sense amplifier zone.
摘要:
An output buffer receives a voltage from a first power supply pin receiving an external power supply voltage for operation. Delay circuits included in an array control circuit, a read control circuit, a write control circuit and an internal clock generation circuit receive a voltage from a second power supply pin receiving the external power supply voltage for operation. Thus, a timing control is accurately performed for reading/writing a data signal without being affected by the change in power supply voltage due to an operation of the output buffer.
摘要:
A semiconductor integrated circuit device includes test data output nodes arranged in a width of a plurality of bits and an internal data bus, greater in bit width than the test data output nodes, for transferring internal data. A predetermined number of bits of the internal data on the internal data bus are compared with bits of test expected value data equal in bit width to the test data output nodes for each bit. The predetermined number of bits of the internal data are selected in accordance with a test address signal. The bits selected is compared with the respective bits of the test expected valued data. Data indicating respective comparison results are output to the test data output nodes in parallel.
摘要:
A semiconductor integrated circuit device includes an SDRAM module operating in synchronization with a clock signal, a logic circuit transmitting data with the SDRAM module for effecting necessary processing, a direct memory access circuit taking in and transferring an externally applied signal in synchronization with the clock signal corresponding to an operation clock of the SDRAM module, and a selector selecting either the output signal of the logic circuit and the output signal of the direct memory access circuit in accordance with a test mode instructing signal for application to the SDRAM module. A test of a synchronous memory can be performed by externally making fast and direct access to the synchronous memory without an influence of a skew in a signal.
摘要:
A memory includes a built-in testing circuit for determining pass/fail of a memory portion and an identifier register for storing identification value for identifying the memory. The memory performs a testing operation according to a command provided from a controller via a send link and sends the result of that testing to a sync link. Thus, the memory controller can identify a defective memory cell. In this way, erroneous operation of the system due to a defective memory cell in a memory system can be prevented.
摘要:
A memory includes an ROM portion storing information specific to the memory, and transfers the stored information to a memory controller via an output buffer and a sink link. The memory controller manages the characteristics of the memory, so that a memory system can be structured utilizing memories of different characteristics.
摘要:
The DRAM macro includes a memory array having a plurality of memory cells, a read data line pair RDL provided extending in the column direction over the memory array, a read column decoder generating a column selection signal for selectively coupling the read data line pair RDL with a plurality of sense amplifiers, and a preamplifier for amplifying potential difference generated on the read data line pair RDL. The preamplifier and the read column decoder are arranged in areas opposite to each other with the memory array placed therebetween.
摘要:
To provide a technique that can improve the data retention characteristic of an MRAM device by improving the resistance against an external magnetic field in a semiconductor device including the MRAM device.A first magnetic shield material is disposed over a die pad via a first die attach film. Then, a semiconductor chip is mounted over the first magnetic shield material via a second die attach film. Furthermore, a second magnetic shield material is disposed over the semiconductor chip via a third die attach film. That is, the semiconductor chip is disposed so as to be sandwiched by the first magnetic shield material and the second magnetic shield material. At this time, while the planar area of the second magnetic shield material is smaller than that of the first magnetic shield material, the thickness of the second magnetic shield material is thicker than that of the first magnetic shield material.