公开(公告)号：US09608184B2

公开(公告)日：2017-03-28

申请号：US13160680

申请日：2011-06-15

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L23/44 ,  H01L33/60 ,  H01L33/48 ,  H01L33/38 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L23/00

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

公开(公告)号：US20110241055A1

公开(公告)日：2011-10-06

申请号：US13160680

申请日：2011-06-15

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

摘要翻译： 提供了一种光学半导体元件安装封装，其具有树脂模制品和引线电极之间良好的粘合性并且具有优异的可靠性，并且还提供了使用该封装的光学半导体器件。 所述光半导体元件安装封装具有作为光半导体元件安装区域的凹部，其特征在于，所述封装通过以下方式形成：将由热固性光反射树脂组合物构成的树脂成形体形成为至少形成所述 凹陷部分 以及至少一对彼此相对设置的正极和负极引线电极，以形成凹部的底面的一部分，并且在树脂模制品和引线电极之间的接合面处没有间隙。

公开(公告)号：US09387608B2

公开(公告)日：2016-07-12

申请号：US12515182

申请日：2007-11-14

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

IPC分类号： C08K3/22 ,  C08K7/24 ,  C08K7/28 ,  C08L63/02 ,  C08L63/06 ,  B29C45/02 ,  C08K3/00 ,  C08L63/00 ,  B29C45/00 ,  C08G59/40 ,  C08G59/42 ,  B29L11/00 ,  H01L33/48 ,  H01L33/60

CPC分类号： H01L33/60 ,  B29C45/0001 ,  B29C45/02 ,  B29L2011/00 ,  C08G59/4014 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/2279 ,  C08K7/24 ,  C08K7/28 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2244 ,  C08L63/00 ,  C08L63/06 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

摘要翻译： 本发明提供了一种用于光反射的热固性树脂组合物，其在固化后可在可见光到近紫外光的范围内实现高反射率，具有优异的耐热劣化性和片剂成型性，并且在转印期间不太可能引起毛刺 成型，以及树脂组合物的制造方法以及使用该树脂组合物的光半导体元件安装基板和光半导体装置。 用于光反射的热固化树脂组合物包括热固化组分和白色颜料，其特征在于在成型温度为100℃至200℃的条件下在传递模塑时引起的毛刺长度，成型压力不大于 20MPa，成型时间60〜120秒不大于5mm，并且在350nm至800nm的波长下热固化后的光反射率不小于80％。 该树脂组合物可用于构造光学半导体元件安装基板和光学半导体器件。

公开(公告)号：US20100140638A1

公开(公告)日：2010-06-10

申请号：US12515182

申请日：2007-11-14

申请人： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

发明人： Hayato Kotani ,  Naoyuki Urasaki ,  Kanako Yuasa ,  Akira Nagai ,  Mitsuyoshi Hamada

IPC分类号： H01L33/00 ,  C08L63/00 ,  C08K3/36 ,  C08K3/22 ,  C08K3/26

CPC分类号： H01L33/60 ,  B29C45/0001 ,  B29C45/02 ,  B29L2011/00 ,  C08G59/4014 ,  C08G59/4215 ,  C08K3/013 ,  C08K3/2279 ,  C08K7/24 ,  C08K7/28 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2244 ,  C08L63/00 ,  C08L63/06 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

摘要翻译： 本发明提供了一种用于光反射的热固性树脂组合物，其在固化后可在可见光到近紫外光的范围内实现高反射率，具有优异的耐热劣化性和片剂成型性，并且在转印期间不太可能引起毛刺 成型，以及树脂组合物的制造方法以及使用该树脂组合物的光半导体元件安装基板和光半导体装置。 用于光反射的热固化树脂组合物包括热固化组分和白色颜料，其特征在于在成型温度为100℃至200℃的条件下在传递模塑时引起的毛刺长度，成型压力不大于 20MPa，成型时间60〜120秒不大于5mm，并且在350nm至800nm的波长下热固化后的光反射率不小于80％。 该树脂组合物可用于构造光学半导体元件安装基板和光学半导体器件。

公开(公告)号：US20090315049A1

公开(公告)日：2009-12-24

申请号：US12303188

申请日：2007-05-21

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

摘要翻译： 提供了一种光学半导体元件安装封装，其具有树脂模制品和引线电极之间良好的粘合性并且具有优异的可靠性，并且还提供了使用该封装的光学半导体器件。 所述光半导体元件安装封装具有作为光半导体元件安装区域的凹部，其特征在于，所述封装通过以下方式形成：将由热固性光反射树脂组合物构成的树脂成形体形成为至少形成所述 凹陷部分 以及至少一对彼此相对设置的正极和负极引线电极，以形成凹部的底面的一部分，并且在树脂模制品和引线电极之间的接合面处没有间隙。