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公开(公告)号:US08232629B2
公开(公告)日:2012-07-31
申请号:US11841955
申请日:2007-08-20
申请人: Nobuya Koike , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
发明人: Nobuya Koike , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
IPC分类号: H01L23/495
CPC分类号: H01L21/565 , H01L23/49503 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/04042 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/32257 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要: It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device.A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body 40. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.
摘要翻译: 通过改变半导体器件的结构,安装时的安装布线的布局变得有效。 第一芯片安装在第一芯片焊盘上,第二芯片也安装在第二芯片焊盘上。 第一管芯焊盘和第二管芯焊盘与密封体40的第一侧面和第二侧平行地进行分割结构。结果,用于从第一芯片输出的引脚和用于控制驱动电路的引脚 可以使其能够从反方向投影,并可以将安装时的布线布局设置为最小路线。
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公开(公告)号:US20120261825A1
公开(公告)日:2012-10-18
申请号:US13533391
申请日:2012-06-26
申请人: Nobuya KOIKE , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
发明人: Nobuya KOIKE , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
IPC分类号: H01L23/48
CPC分类号: H01L21/565 , H01L23/49503 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/04042 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/32257 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要: It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device.A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body 40. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.
摘要翻译: 通过改变半导体器件的结构,安装时的安装布线的布局变得有效。 第一芯片安装在第一芯片焊盘上,第二芯片也安装在第二芯片焊盘上。 第一管芯焊盘和第二管芯焊盘与密封体40的第一侧面和第二侧平行地进行分割结构。结果,用于从第一芯片输出的引脚和用于控制驱动电路的引脚 可以使其能够从反方向投影,并可以将安装时的布线布局设置为最小路线。
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公开(公告)号:US09129979B2
公开(公告)日:2015-09-08
申请号:US13533391
申请日:2012-06-26
申请人: Nobuya Koike , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
发明人: Nobuya Koike , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
IPC分类号: H01L23/48 , H01L21/56 , H01L23/495 , H01L23/00
CPC分类号: H01L21/565 , H01L23/49503 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/04042 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/32257 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要: It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device.A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body 40. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.
摘要翻译: 通过改变半导体器件的结构,安装时的安装布线的布局变得有效。 第一芯片安装在第一芯片焊盘上,第二芯片也安装在第二芯片焊盘上。 第一管芯焊盘和第二管芯焊盘与密封体40的第一侧面和第二侧平行地进行分割结构。结果,用于从第一芯片输出的引脚和用于控制驱动电路的引脚 可以使其能够从反方向投影,并可以将安装时的布线布局设置为最小路线。
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公开(公告)号:US20070001273A1
公开(公告)日:2007-01-04
申请号:US11476868
申请日:2006-06-29
申请人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
发明人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L23/485 , H01L23/49568 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/05647 , H01L2224/0603 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/8385 , H01L2224/85447 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要: A semiconductor device having a plurality of chips is reduced in size. In HSOP(semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the PMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced.
摘要翻译: 具有多个芯片的半导体器件的尺寸减小。 在用于驱动三相电机的HSOP(半导体器件)中,包括pMISFET的第一半导体芯片和包括nMISFET的第二半导体芯片安装在第一突片,第二突片和第三突片的每一个上。 每个接头上的PMISFET和nMISFET的漏极彼此电连接。 因此,可以将六个MISFET中的两个放置在与电机的相位数相对应地分开的三个接片中的每一个上,并且它们可以以紧凑的方式封装在一个中。 结果,可以减少具有多个芯片的用于驱动三相电动机的HSOP的尺寸。
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公开(公告)号:US20100140718A1
公开(公告)日:2010-06-10
申请号:US12706295
申请日:2010-02-16
申请人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
发明人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
IPC分类号: H01L27/092
CPC分类号: H01L23/49575 , H01L23/485 , H01L23/49568 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/05647 , H01L2224/0603 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/8385 , H01L2224/85447 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要: A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the pMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced.
摘要翻译: 具有多个芯片的半导体器件的尺寸减小。 在用于驱动三相电机的HSOP(半导体器件)中,包括pMISFET的第一半导体芯片和包括nMISFET的第二半导体芯片安装在第一突片,第二突片和第三突片的每一个上。 pMISFET和nMISFET的漏极在每个接片上彼此电连接。 因此,可以将六个MISFET中的两个放置在与电机的相位数相对应地分开的三个接片中的每一个上,并且它们可以以紧凑的方式封装在一个中。 结果,可以减少具有多个芯片的用于驱动三相电动机的HSOP的尺寸。
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公开(公告)号:US07969000B2
公开(公告)日:2011-06-28
申请号:US12706295
申请日:2010-02-16
申请人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
发明人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
IPC分类号: H01L27/092
CPC分类号: H01L23/49575 , H01L23/485 , H01L23/49568 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/05647 , H01L2224/0603 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/8385 , H01L2224/85447 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要: A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the pMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced.
摘要翻译: 具有多个芯片的半导体器件的尺寸减小。 在用于驱动三相电机的HSOP(半导体器件)中,包括pMISFET的第一半导体芯片和包括nMISFET的第二半导体芯片安装在第一突片,第二突片和第三突片的每一个上。 pMISFET和nMISFET的漏极在每个接片上彼此电连接。 因此,可以将六个MISFET中的两个放置在与电机的相位数相对应地分开的三个接片中的每一个上,并且它们可以以紧凑的方式封装在一个中。 结果,可以减少具有多个芯片的用于驱动三相电动机的HSOP的尺寸。
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公开(公告)号:US07692285B2
公开(公告)日:2010-04-06
申请号:US11476868
申请日:2006-06-29
申请人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
发明人: Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L23/485 , H01L23/49568 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/05647 , H01L2224/0603 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/8385 , H01L2224/85447 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要: A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the pMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced.
摘要翻译: 具有多个芯片的半导体器件的尺寸减小。 在用于驱动三相电机的HSOP(半导体器件)中,包括pMISFET的第一半导体芯片和包括nMISFET的第二半导体芯片安装在第一突片,第二突片和第三突片的每一个上。 pMISFET和nMISFET的漏极在每个接片上彼此电连接。 因此,可以将六个MISFET中的两个放置在与电机的相位数相对应地分开的三个接片中的每一个上,并且它们可以以紧凑的方式封装在一个中。 结果,可以减少具有多个芯片的用于驱动三相电动机的HSOP的尺寸。
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公开(公告)号:US08035222B2
公开(公告)日:2011-10-11
申请号:US12968534
申请日:2010-12-15
申请人: Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人: Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号: H01L23/34
CPC分类号: H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译: 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构,并且第三引线布置成靠近感应导体。
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公开(公告)号:US20110084359A1
公开(公告)日:2011-04-14
申请号:US12968534
申请日:2010-12-15
申请人: Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人: Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号: H01L23/495
CPC分类号: H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译: 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构,并且第三引线布置成靠近感应导体。
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公开(公告)号:US20120012978A1
公开(公告)日:2012-01-19
申请号:US13244133
申请日:2011-09-23
申请人: Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人: Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号: H01L23/48
CPC分类号: H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译: 提供了通过使用半导体封装形成的半导体器件。 半导体器件包括在感应导体上相邻布置的两个半导体封装。 两个半导体封装的端子由第三引线连接。 第三引线被布置成基本上平行于感应导体。 接头部分处的引线例如具有弯曲结构,并且第三引线布置成靠近感应导体。
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