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128 条记录 (耗时 0.024 秒)

    Ceramic circuit board
    5.
    发明授权
    Ceramic circuit board 失效
    陶瓷电路板

    公开(公告)号：US5672848A

    公开(公告)日：1997-09-30

    申请号：US365483

    申请日：1994-12-28

    申请人： Hiroshi Komorita ,  Tadashi Tanaka ,  Takayuki Naba ,  Takashi Hino

    发明人： Hiroshi Komorita ,  Tadashi Tanaka ,  Takayuki Naba ,  Takashi Hino

    IPC分类号： H01L23/12 ,  H01L21/52 ,  H01L23/13 ,  H01L23/373 ,  H01L23/00

    CPC分类号： H01L23/3735 ,  H01L23/13 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351

    摘要： A ceramic circuit board wherein a copper circuit plate is directly bonded at a predetermined position on a ceramic substrate and heat is applied; or the copper circuit plate is integrally bonded through a brazing material containing an active metal, such as Ti, Zr and Hf; and a semiconductor element is bonded onto a semiconductor element mounting portion of the copper circuit plate through a solder layer. The copper plate element is formed with grooves or holes thereon and is bonded on the semiconductor element mounting portion of the copper circuit plate, and the semiconductor element is integrally bonded onto a surface of a grooved or holed side of the copper plate element through a solder layer. By the above structure, the ceramic circuit board prevents solder voids when soldering the semiconductor element onto the copper circuit plate, thereby reducing the dispersion of the thermal resistance values between the semiconductor element and the ceramic substrate, and reducing or mitigating the thermal stress applied or acting on the mounting portion of the semiconductor element.

    摘要翻译： 一种陶瓷电路板，其中铜电路板直接接合在陶瓷基板上的预定位置并施加热量; 或铜电路板通过含有活性金属如Ti，Zr和Hf的钎料整体结合; 并且半导体元件通过焊料层接合到铜电路板的半导体元件安装部分上。 铜板元件在其上形成有凹槽或孔，并且接合在铜电路板的半导体元件安装部分上，并且半导体元件通过焊料一体地结合到铜板元件的带槽或开孔侧的表面上 层。 通过上述结构，当将半导体元件焊接到铜电路板上时，陶瓷电路板防止焊料空隙，从而减小半导体元件和陶瓷基板之间的热阻值的分散，并减少或减轻施加的热应力或 作用在半导体元件的安装部分上。

    Method of manufacturing ceramic circuit board
    6.
    发明授权
    Method of manufacturing ceramic circuit board 失效
    制造陶瓷电路板的方法

    公开(公告)号：US5240551A

    公开(公告)日：1993-08-31

    申请号：US770870

    申请日：1991-10-04

    申请人： Kazuo Matsumura ,  Tadashi Tanaka ,  Shoji Tsurutani

    发明人： Kazuo Matsumura ,  Tadashi Tanaka ,  Shoji Tsurutani

    IPC分类号： H05K1/03 ,  H05K3/06 ,  H05K3/20

    CPC分类号： H05K3/202 ,  H05K1/0306 ,  H05K2203/0369 ,  H05K2203/175 ,  H05K3/061 ,  Y10S428/901 ,  Y10T428/24917

    摘要： A ceramics circuit board is manufactured by preliminarily preparing a circuit pattern base composed of a plurality of circuit pattern elements connected by bridging pieces each having a thickness smaller than that of the circuit pattern element, preferably less than half thickness of the circuit pattern base, applying and bonding the circuit pattern base onto one surface of a ceramics board base and removing the bridging pieces by effecting an etching treatment to thereby form a circuit pattern having a predetermined shape on the one surface of the ceramics board base. The circuit pattern base and the bridging pieces are formed of one metallic plate by partially effecting etching treatment. The bridging pieces are arranged so as to have a gap between a rear surface thereof and the one surface of the ceramics board base when the circuit pattern base is applied on the one surface of the ceramics board base. The bonding step may be carried out by forming, on a surface to be bonded, an eutectic material composed of the same metallic material as that composing the circuit pattern base and oxygen. It is preferred that the method further includes the step of applying and bonding a copper plate to another surface of the ceramics board base before the etching treatment.

    Method for Producing Coated Water-Soluble Particles
    8.
    发明申请
    Method for Producing Coated Water-Soluble Particles 有权
    生产涂层水溶性颗粒的方法

    公开(公告)号：US20120198898A1

    公开(公告)日：2012-08-09

    申请号：US13500267

    申请日：2010-10-05

    申请人： Hiroyuki Fujii ,  Nobuhiro Okada ,  Hideaki Sueta ,  Tadashi Tanaka ,  Kazuyoshi Morita

    发明人： Hiroyuki Fujii ,  Nobuhiro Okada ,  Hideaki Sueta ,  Tadashi Tanaka ,  Kazuyoshi Morita

    IPC分类号： B05D7/00 ,  C05D9/00

    CPC分类号： C05G3/0029 ,  A01N25/26

    摘要： A method for producing coated water-soluble particles in a manner to form two or more coating layers on surfaces of the water-soluble particles, characterized by including: a step A wherein after supplying a first coating material that contains a polyol component and an isocyanate component, a second coating material is additionally supplied to surfaces of first coating bodies that have coating layers formed of the first coating material that has not been sufficiently cured, so that second coating bodies that are provided with coating layers of the second coating material are obtained.

    摘要翻译： 一种在水溶性颗粒表面形成两层或多层涂层的方法，其特征在于包括：步骤A，其中在提供含有多元醇组分和异氰酸酯的第一涂料之后， 另外将第二涂层材料提供给具有由第一涂层材料形成的涂层未被充分固化的第一涂层体的表面，从而获得设置有第二涂层材料涂层的第二涂覆体 。

    Process for stabilizing oxymethylene copolymer
    10.
    发明授权
    Process for stabilizing oxymethylene copolymer 有权
    稳定甲醛共聚物的方法

    公开(公告)号：US06365655B1

    公开(公告)日：2002-04-02

    申请号：US09367288

    申请日：1999-08-16

    申请人： Noritaka Tanimura ,  Hajime Nagahara ,  Tadashi Tanaka ,  Satoru Ohtsuki

    发明人： Noritaka Tanimura ,  Hajime Nagahara ,  Tadashi Tanaka ,  Satoru Ohtsuki

    IPC分类号： C08K517

    CPC分类号： C08G2/28 ,  C08K5/19 ,  C08L59/04

    摘要： Disclosed is a method for stabilizing a crude oxy-methylene copolymer having thermally unstable terminal groups, which comprises subjecting a crude oxymethylene copolymer to heat treatment in the presence of at least one quaternary ammonium compound represented by the following formula (1): [R1R2R3R4N+]nX−n  (1) wherein each of R1, R2, R3 and R4 independently represents an unsubstituted or substituted alkyl group, an aryl group, an aralkyl group which is an unsubstituted or substituted alkyl group substituted with at least one aryl group, or an alkylaryl group which is an aryl group substituted with at least one unsubstituted or substituted alkyl group; n is an integer of from 1 to 3; and X is a hydroxyl group or an acid residue. In this method, even by the addition of a very small amount of the quaternary ammonium compound, the decomposition rate of the unstable terminal groups can be remarkably increased, thereby facilitating the stabilization of the crude copolymer. Therefore, by this method, it has become possible to easily produce an excellent oxymethylene copolymer within a short period of time, which has substantially no unstable terminal groups and, therefore, has excellent thermal stability and color tone.

    摘要翻译： 本发明公开了一种稳定具有热不稳定端基的粗氧亚甲基共聚物的方法，其包括在至少一种由下式（1）表示的季铵化合物存在下使粗甲醛共聚物进行热处理：其中， R1，R2，R3和R4独立地表示未取代或取代的烷基，芳基，被至少一个芳基取代的未取代或取代的烷基的芳烷基或作为被至少一个芳基取代的芳基的烷基芳基 至少一个未取代或取代的烷基; n为1〜3的整数， X为羟基或酸残基。 在该方法中，即使加入极少量的季铵化合物，也能够显着提高不稳定末端基的分解速度，从而有助于粗共聚物的稳定化。 因此，通过该方法，可以在短时间内容易地制造优异的甲醛共聚物，其基本上不具有不稳定的端基，因此具有优异的热稳定性和色调。