Sample processing apparatus and method for removing charge on sample through light irradiation
    1.
    发明授权
    Sample processing apparatus and method for removing charge on sample through light irradiation 有权
    用于通过光照射去除样品上的电荷的样品处理装置和方法

    公开(公告)号:US06507029B1

    公开(公告)日:2003-01-14

    申请号:US09255700

    申请日:1999-02-23

    IPC分类号: H01J3730

    摘要: In an electron particle machine for observing, inspecting, processing or analyzing a semiconductor wafer as a substrate or a sample, a light source is installed in a preparation chamber. A chucking stage for chucking the semiconductor wafer with a chuck using static electricity is provided with parts for connecting to earth such that they are in contact with the chucked semiconductor wafer. After the chuck using static electricity is released after observation, inspection, process or analysis, a surface of the semiconductor wafer and the parts for connecting to earth are irradiated with light from the light source. This provides conductivity to the surface of the semiconductor wafer, so that charge accumulated on the semiconductor wafer is removed from the surface through the parts for connecting to earth.

    摘要翻译: 在用于观察,检查,处理或分析作为基板或样品的半导体晶片的电子粒子机中,将光源安装在准备室中。 使用静电用卡盘夹住半导体晶片的夹持台设置有用于连接到地面的部件,使得它们与夹持的半导体晶片接触。 在观察,检查,处理或分析之后释放使用静电的卡盘后,用来自光源的光照射半导体晶片的表面和用于连接到地球的部分。 这为半导体晶片的表面提供导电性,从而通过用于连接到地球的部件从表面去除积聚在半导体晶片上的电荷。

    Method and apparatus for detecting defect in circuit pattern of a mask
for X-ray exposure
    3.
    发明授权
    Method and apparatus for detecting defect in circuit pattern of a mask for X-ray exposure 失效
    用于检测用于X射线曝光的掩模的电路图案中的缺陷的方法和装置

    公开(公告)号:US4814615A

    公开(公告)日:1989-03-21

    申请号:US45538

    申请日:1987-05-04

    摘要: In accordance with the present invention, there is provided a pattern defect detecting apparatus using a scanning and transmission electron microscope, comprising an electron gun for accelerating an electron beam with high energy enough to transmit it through a sample and for radiating the accelerated electron beam, a condenser lens for focusing the electron beam generated by said electron gun, a beam deflection coil for deflecting the electron beam focused by said condenser lens, an objective lens for further focusing the electron beam deflected by said beam deflection coil onto a fixed spot, an XY stage for disposing the sample so as to be opposed to said objective lens, said XY stage being movable in X and Y directions in a step and repeat manner, a sample chamber for housing the XY stage in vacuum, said sample chamber including at least the outlet of the electron beam of said objective lens, an electron beam detector for detecting electron beams transmitted through said sample, said electron beam detector being fixed to a stationary member such as said chamber or a lens barrel, and defect detecting means for scanning the electron beam by using said beam deflection coil for each step and repeat operation of said XY stage, for comparing a video signal obtained from said electron beam detector with a reference pattern read out from memory means, and for thereby detecting a defect of the sample.

    摘要翻译: 根据本发明,提供了一种使用扫描和透射电子显微镜的图案缺陷检测装置,其包括用于加速具有足够高能量的电子束以通过样品透射并用于辐射加速电子束的电子枪的电子枪, 用于聚焦由所述电子枪产生的电子束的聚光透镜,用于偏转由所述聚光透镜聚焦的电子束的光束偏转线圈,用于将由所述光束偏转线圈偏转的电子束进一步聚焦到固定点上的物镜, XY台,用于将样品设置为与所述物镜相对,所述XY台可以在X和Y方向上以一个步骤和重复的方式移动,用于在XY真空中容纳XY台的样品室,所述样品室至少包括 所述物镜的电子束的出口,用于检测透过所述样品的电子束的电子束检测器 d电子束检测器固定到诸如所述腔室或透镜镜筒之类的静止构件上,以及缺陷检测装置,用于通过每个步骤使用所述光束偏转线圈扫描电子束,并重复所述XY平台的操作,用于比较视频信号 从所述电子束检测器获得从存储装置读出的参考图案,从而检测样品的缺陷。

    Visual inspection method and apparatus therefor
    4.
    发明授权
    Visual inspection method and apparatus therefor 失效
    目视检查方法及其设备

    公开(公告)号:US06587581B1

    公开(公告)日:2003-07-01

    申请号:US09006371

    申请日:1998-01-12

    IPC分类号: G06K900

    摘要: The present invention provides a scanning electron microscope (SEM) or optical inspection method and apparatus which correct differences in brightness between comparison images and thus which is capable of detecting a fine defect with a high degree of reliability without causing any false defect detection. According to the present invention, the brightness values of a pattern, which should be essentially the same, contained in two detected images to be compared are corrected in such a manner that, even if there may be a brightness difference in a portion free from defects, the brightness difference is reduced to such a degree so that it can be recognized as a normal portion. Also, a limit for the amount of correction is furnished in advance, and correction exceeding such limit value is not performed. Such correction prevents the difference in brightness that should be permitted as non-defective from being falsely recognized as a defect without overlooking great differences in brightness due to a defect.

    摘要翻译: 本发明提供了一种扫描电子显微镜(SEM)或光学检查方法和装置,其校正比较图像之间的亮度差异,从而能够以高可靠性检测精细缺陷而不引起任何假缺陷检测。 根据本发明,将要被比较的两个检测图像中包含的基本上相同的图案的亮度值以这样的方式进行校正:即使在没有缺陷的部分中可能存在亮度差 ,亮度差降低到这样的程度,从而可以将其识别为正常部分。 此外,预先提供校正量的限制,并且不执行超过该限制值的校正。 这样的校正可以防止由于缺陷而将不允许的亮度差错误地识别为缺陷,而不会因为缺陷而忽略亮度的很大差异。

    Pattern inspection method and system therefor
    6.
    发明申请
    Pattern inspection method and system therefor 审中-公开
    图案检验方法及系统

    公开(公告)号:US20070131877A9

    公开(公告)日:2007-06-14

    申请号:US10062666

    申请日:2002-02-05

    IPC分类号: G01N23/00

    摘要: Conventionally, defect data outputted by an inspection system comprised only characteristic quantitative data, such as coordinate data, area, and projected length, and only the coordinate data for moving to a defect location could be utilized effectively. By contrast, the present invention, by using image data in addition to characteristic quantitative data as the defect data for an inspection system, enables the retrieval of image data via an outside results confirmation system. Further, in the case of defect data of a plurality of substrates, it is enabled to display a defect image during inspection by the fact that similar defects are retrieved via images and retrieval results are displayed as trends makes it possible to display a defect image during inspection by searching similar defects on images and displaying them as a trend, designating a substrate on the trend, thereby displaying the defect map thereof and designating a defect on the defect map.

    摘要翻译: 通常,由检查系统输出的缺陷数据仅包括诸如坐标数据,面积和投影长度的特征定量数据,并且仅有用于移动到缺陷位置的坐标数据可以被有效地利用。 相比之下,本发明通过使用除了特征定量数据之外的图像数据作为检查系统的缺陷数据,能够经由外部结果确认系统检索图像数据。 此外,在多个基板的缺陷数据的情况下,能够通过图像检索相似缺陷的事实在检查期间显示缺陷图像,并且检索结果被显示为趋势,使得可以在显示缺陷图像期间显示缺陷图像 通过搜索图像上的类似缺陷并将其显示为趋势,指定趋势上的基板,从而显示其缺陷图并指定缺陷图上的缺陷来进行检查。

    Business process diagnostic method and business process diagnostic system
    8.
    发明申请
    Business process diagnostic method and business process diagnostic system 审中-公开
    业务流程诊断方法和业务流程诊断系统

    公开(公告)号:US20050080647A1

    公开(公告)日:2005-04-14

    申请号:US10929418

    申请日:2004-08-31

    CPC分类号: G06Q10/06 G06Q30/0203

    摘要: In business process diagnosis, answers to questions is improved in their accuracy, and an accurate result of diagnosis is obtained. A computer diagnoses a business process of an organization based on answers to questions. The diagnosis includes a first answer reception step in which a first question sheet containing common questions is displayed to receive answers to said common questions and to receive questions proper to the organization, and then a second question sheet containing said common questions, said answers to the common questions, and said questions proper to the organization is generated; a second answer reception step in which said second question sheet is displayed to receive answers to said questions proper to the organization, and then a third question sheet containing said common questions, said answers to the common questions, said questions proper to the organization, and said answers to the questions proper to the organization is generated; and a diagnosis step in which the business process of said organization is diagnosed based on the answers to said common questions and the answers to said questions proper to the organization, with said answers to said common questions and said answers to said questions proper to the organization being filled in said third question sheet.

    摘要翻译: 在业务流程诊断中,问题的答案在准确性方面得到改进,得到了准确的诊断结果。 计算机根据问题的答案诊断组织的业务流程。 诊断包括第一答案接收步骤,其中显示包含常见问题的第一问题单以接收对所述常见问题的答案并且接收适合于该组织的问题,然后包含包含所述常见问题的第二个问题单,对 共同的问题,并提出了适合组织的问题; 第二回答接收步骤,其中显示所述第二问题单以接收对组织适当的所述问题的答案,然后包含第三个问题单,其中包含所述常见问题,常见问题的答案,对组织适用的所述问题,以及 表示对组织适用的问题的答案是产生的; 以及诊断步骤,其中基于所述常见问题的答案和对组织适当的所述问题的答案来诊断所述组织的业务流程,所述答案涉及对所述组织适合的所述常见问题和所述问题的答案 填写在第三个问题单中。

    Pattern inspection method and apparatus using electron beam
    9.
    发明授权
    Pattern inspection method and apparatus using electron beam 失效
    使用电子束的图案检查方法和装置

    公开(公告)号:US06614022B2

    公开(公告)日:2003-09-02

    申请号:US09908713

    申请日:2001-07-20

    IPC分类号: H01J37244

    摘要: In the detecting system for irradiating the electron beam and detecting the secondary electron thereof, an area of the detector is an important factor for high-speed detection. For the technique of the current electron optical system and detector, a detector of the area larger than a constant area is necessary and detection of 200 Msps or more by receiving limitation on the frequency inversely proportional to the area is substantially difficult. For example, for detection at 400 Msps under the condition that the required area is 4 mm square and the rate for 4 mm square is defined as 150 Msps, four discrete high-speed detectors of 2 mm square are arranged to amplify and then add the signals for A/D conversion. Otherwise, the secondary electron is sequentially inputted to the detector of 8 mm square with the secondary electron deflector, the secondary electron is detected at 100 Msps and arranged after the A/D conversion. In any case, the area of 4 mm square and rate of 400 Msps can be attained.

    摘要翻译: 在用于照射电子束并检测其二次电子的检测系统中,检测器的面积是高速检测的重要因素。 对于当前电子光学系统和检测器的技术,需要一个大于恒定面积的区域的检测器,并且通过接收与该区域成反比的频率的限制来检测200 Msps以上是非常困难的。例如,对于 在所需面积为4平方毫米,4平方毫米的速率定义为150 Msps的条件下,以400 Msps进行检测,放置4个离散高速2 mm的高速检测器,放大,然后将A / D转换。 否则,二次电子依次输入到具有二次电子偏转器的8mm正方形的检测器,二次电子以100Msps检测并且在A / D转换之后排列。 在任何情况下,可以获得4平方毫米的面积和400 Msps的面积。