Photolytic Processing Of Materials With Hydrogen
    3.
    发明申请
    Photolytic Processing Of Materials With Hydrogen 有权
    氢解材料的光解处理

    公开(公告)号:US20110297534A1

    公开(公告)日:2011-12-08

    申请号:US13155947

    申请日:2011-06-08

    IPC分类号: C25B11/00

    摘要: An apparatus and method for hydrogenating a sample, such as a semiconductor wafer. The invention utilizes a top electrode comprising a UV-transparent dielectric and a metal contact to provide an electric field to the sample while the sample is irradiated with UV light and hydrogenated with a hydrogenating gas or gasses. The field may be applied to the sample at a number of different pressures, temperatures and concentrations of gas to manipulate the rate and type of hydrogenation. Further, the method of hydrogenating the sample may be used in conjunction with masking and etching techniques.

    摘要翻译: 用于使样品(例如半导体晶片)氢化的装置和方法。 本发明利用包含UV透明电介质和金属接触的顶部电极在样品被UV光照射并用氢化气体或气体氢化的同时向样品提供电场。 该场可以以多种不同的压力,气体的温度和浓度施加到样品上以操纵氢化的速率和类型。 此外,氢化样品的方法可以与掩模和蚀刻技术结合使用。

    Method for Assessment of Material Defects
    4.
    发明申请
    Method for Assessment of Material Defects 审中-公开
    材料缺陷评估方法

    公开(公告)号:US20090309623A1

    公开(公告)日:2009-12-17

    申请号:US12137151

    申请日:2008-06-11

    IPC分类号: G01R31/26

    摘要: A method is provided for measuring defects in semiconductor materials. In one embodiment the method includes placing deuterium in the material and directing an ion beam onto the material to cause a nuclear reaction with the deuterium. Products of the nuclear reaction are analyzed (NRA) to measure the concentration of defects. In other embodiments, a spectroscopic technique is used to detect the deuterium taggant. Lattice defect or total defect occurrences can be selected by selecting the method of placing deuterium in the sample. Defect concentration vs. depth below the surface of material can be determined by varying the energy of the ion beam or by measuring energy profiles of products of the nuclear reaction. The method may be applied to wafers, pixels or other forms of semiconductor materials and may be combined with X-ray analysis of elements on the material.

    摘要翻译: 提供了一种用于测量半导体材料中的缺陷的方法。 在一个实施方案中,该方法包括将氘放置在材料中并将离子束引导到材料上以引起与氘的核反应。 分析核反应的产物(NRA)以测量缺陷的浓度。 在其他实施例中,使用光谱技术来检测氘标记物。 可以通过选择在样品中放置氘的方法来选择晶格缺陷或全部缺陷发生。 可以通过改变离子束的能量或通过测量核反应产物的能量分布来确定材料表面以下的缺陷浓度与深度。 该方法可以应用于晶片,像素或其他形式的半导体材料,并且可以与材料上的元件的X射线分析结合。

    Method for forming metallic silicide films on silicon substrates by ion
beam deposition
    6.
    发明授权
    Method for forming metallic silicide films on silicon substrates by ion beam deposition 失效
    通过离子束沉积在硅衬底上形成金属硅化物膜的方法

    公开(公告)号:US4908334A

    公开(公告)日:1990-03-13

    申请号:US300863

    申请日:1989-01-24

    IPC分类号: H01L21/285

    CPC分类号: H01L21/28518

    摘要: Metallic silicide films are formed on silicon substrates by contacting the substrates with a low-energy ion beam of metal ions while moderately heating the substrate. The heating of the substrate provides for the diffusion of silicon atoms through the film as it is being formed to the surface of the film for interaction with the metal ions as they contact the diffused silicon. The metallic silicide films provided by the present invention are contaminant free, of uniform stoichiometry, large grain size, and exhibit low resistivity values which are of particular usefulness for integrated circuit production.

    摘要翻译: 金属硅化物膜通过使基板与金属离子的低能量离子束接触而在硅衬底上形成,同时适度加热衬底。 衬底的加热提供了硅原子通过膜的扩散,因为它们被形成在膜的表面上,用于与金属离子接触扩散硅时与金属离子相互作用。 由本发明提供的金属硅化物膜是无污染的,具有均匀的化学计量,较大的晶粒尺寸,并且表现出低电阻率值,这对于集成电路生产是特别有用的。

    N-channel MOS transistors having source/drain regions with germanium
    7.
    发明授权
    N-channel MOS transistors having source/drain regions with germanium 失效
    具有锗源极/漏极区域的N沟道MOS晶体管

    公开(公告)号:US4837173A

    公开(公告)日:1989-06-06

    申请号:US72932

    申请日:1987-07-13

    摘要: Metal-oxide-semiconductor (MOS) transistors with n-type source/drain regions also having germanium-doped regions in or near the source/drains. The presence of germanium near or at the location of phosphorus in graded source drains (GSDs), lightly doped drains (LDDs) and double diffused drains (DDDs) gives a better profile of the drain region with a reduced junction depth than that obtainable with phosphorus or particularly phosphorus and arsenic together. Good grading of the drain junction to avoid hot carrier instability or hot carrier injection problems is obtained along with shallow source junctions, which minimizes lateral dopant diffusion and decreases the distance between n- and n+ regions in GSDs and LDDs.

    摘要翻译: 具有n型源极/漏极区域的金属氧化物半导体(MOS)晶体管在源/漏极中或附近也具有锗掺杂区域。 分级源极漏极(GSD),轻掺杂漏极(LDD)和双扩散漏极(DDD)中磷附近或位置处的锗的存在提供了漏极区的更好的轮廓,其结点深度低于磷获得的结点深度 或特别是磷和砷一起。 获得漏极结的良好分级,以避免热载流子不稳定或热载流子注入问题,同时连接浅源极结,这可以最大限度地减小横向掺杂剂扩散,并减小GSD和LDD中n +和n +区之间的距离。

    Annealing Of Amorphous Layers In Si Formed By Ion-Implantation; A Method To Eliminate Residual Defects
    8.
    发明申请
    Annealing Of Amorphous Layers In Si Formed By Ion-Implantation; A Method To Eliminate Residual Defects 审中-公开
    通过离子注入形成Si的非晶层退火; 消除残留缺陷的方法

    公开(公告)号:US20120009769A1

    公开(公告)日:2012-01-12

    申请号:US13177216

    申请日:2011-07-06

    IPC分类号: H01L21/265

    CPC分类号: H01L21/265 H01L21/3003

    摘要: The invention is directed to ion implantation. Ion implantation is a process whereby energetic ions are used to uniformly irradiate the surface of a material—typically a semiconductor wafer. Either atomic or molecular ions are created in an ion source and then extracted for analysis (e.g. by magnetic separation) to ensure the purity of the ion beam. Post-analysis acceleration and scanning of the beam is done prior to sample irradiation. Each dopant-type acts, in general, to increase the conductivity of the silicon.

    摘要翻译: 本发明涉及离子注入。 离子注入是使用高能离子来均匀地照射材料的表面(通常是半导体晶片)的过程。 在离子源中产生原子或分子离子,然后提取用于分析(例如通过磁分离)以确保离子束的纯度。 在样品照射之前进行光束的后分析加速和扫描。 通常,每种掺杂剂类型的作用是增加硅的导电性。

    N-channel MOS transistors having source/drain regions with germanium
    9.
    发明授权
    N-channel MOS transistors having source/drain regions with germanium 失效
    具有锗源极/漏极区域的N沟道MOS晶体管

    公开(公告)号:US4928156A

    公开(公告)日:1990-05-22

    申请号:US319000

    申请日:1989-03-06

    摘要: Metal-oxide-semiconductor (MOS) transistors with n-type source/drain regions also having germanium-doped regions in or near the source/drains. The presence of germanium near or at the location of phosphorus in graded source drains (GSDs), lightly doped drains (LDDs) and double diffused drains (DDDs) gives a better profile of the drain region with a reduced junction depth than that obtainable with phosphorus or particularly phosphorus and arsenic together. Good grading of the drain junction to avoid hot carrier instability or hot carrier injection problems is obtained along with shallow source junctions, which minimizes lateral dopant diffusion and decreases the distance between n.sup.- and n.sup.+ regions in GSDs and LDDs.

    摘要翻译: 具有n型源极/漏极区域的金属氧化物半导体(MOS)晶体管在源/漏极中或附近也具有锗掺杂区域。 分级源极漏极(GSD),轻掺杂漏极(LDD)和双扩散漏极(DDD)中磷附近或位置处的锗的存在提供了漏极区的更好的轮廓,其结点深度低于磷获得的结点深度 或特别是磷和砷一起。 获得漏极结的良好分级,以避免热载流子不稳定或热载流子注入问题,同时连接浅源极结,这可以最大限度地减小横向掺杂剂扩散,并减小GSD和LDD中n +和n +区之间的距离。

    Suppression of hillock growth through multiple thermal cycles by argon
implantation
    10.
    发明授权
    Suppression of hillock growth through multiple thermal cycles by argon implantation 失效
    通过氩植入,通过多个热循环抑制小丘生长

    公开(公告)号:US4704367A

    公开(公告)日:1987-11-03

    申请号:US853840

    申请日:1986-04-21

    IPC分类号: H01L21/3215 H01L21/265

    摘要: A technique for suppressing hillock growth in metal films on integrated circuits through multiple thermal cycles by argon implantation. Although it was known that ion implantation of many species such as arsenic suppressed the growth of hillocks in metal films through one thermal cycle, it was discovered that only one of the proposed ions, argon, would suppress hillock formation for multiple subsequent thermal cycles. For the other species, hillock formation would reoccur after multiple cycles. This characteristic is important for double layer metal (DLM) processes to prevent interlayer shorting.

    摘要翻译: 通过氩气注入通过多个热循环来抑制集成电路上的金属膜的小丘生长的技术。 虽然众所周知,许多物质如砷的离子注入通过一个热循环抑制金属膜中的小丘的生长,但是发现只有一个所提出的离子氩就可以抑制多个后续热循环的小丘形成。 对于其他物种,小丘形成将在多个周期后再次发生。 这种特性对于防止层间短路的双层金属(DLM)工艺很重要。