公开(公告)号：US06396967B1

公开(公告)日：2002-05-28

申请号：US09528297

申请日：2000-03-17

申请人： Osamu Suzuki ,  Takayuki Watanabe

发明人： Osamu Suzuki ,  Takayuki Watanabe

IPC分类号： G02B612

CPC分类号： H01L25/167 ,  H01L31/16 ,  H01L2224/16225 ,  H01L2924/3011

摘要： An optoelectronic integrated circuit device which has less signal damping and signal transmission loss is provided. The optoelectronic integrated circuit device of the present invention includes a first optoelectronic integrated circuit and a second optoelectronic integrated circuit. Each of the first optoelectronic integrated circuit and the second optoelectronic integrated circuit includes an electric circuit unit, an optical output terminal unit, and an optical input terminal unit. The first optoelectronic integrated circuit and the second optoelectronic integrated circuit are arranged so that each optical output terminal unit faces each corresponding optical input terminal unit. In this arrangement, light signal transmission can be carried out between a plurality of optoelectronic integrated circuit devices. Thus, signal damping and transmission loss can be reduced, and signal transmission delay time can be shortened.

摘要翻译： 提供了具有较少信号阻尼和信号传输损耗的光电集成电路器件。 本发明的光电集成电路器件包括第一光电集成电路和第二光电集成电路。 第一光电集成电路和第二光电集成电路中的每一个包括电路单元，光输出端单元和光输入端单元。 第一光电集成电路和第二光电集成电路被布置成使得每个光输出端子单元面对每个对应的光输入端单元。 在这种布置中，可以在多个光电子集成电路器件之间执行光信号传输。 因此，可以减少信号阻尼和传输损耗，并且可以缩短信号传输延迟时间。

公开(公告)号：US06220762B1

公开(公告)日：2001-04-24

申请号：US09481532

申请日：2000-01-12

申请人： Ken Kanai ,  Masata Shiino ,  Takayuki Watanabe ,  Osamu Suzuki

发明人： Ken Kanai ,  Masata Shiino ,  Takayuki Watanabe ,  Osamu Suzuki

IPC分类号： G02B600

CPC分类号： G02B6/3825 ,  G02B6/3879

摘要： The prevent invention relates to a collective connection structure, optical connector arraying member, and adapter, which are suitable for application in the field of optical transmission, and which are able to collectively, easily and accurately connect a plurality of optical connectors with fewer number of parts. Optical connectors (3a) through (3f) and (4a) through (4f) corresponding to the first and second plugs (5) and (6) are arrayed and accommodated in a float-like state. The tip ends of the respective optical connectors protrude from the tip end of the first and second plugs (5) and (6) corresponding thereto. The connection end face (45) side of the respective optical connector groups (3) and (4) is inserted from both sides of the adapter (8) along guides (31) and (33) at both sides of the adapter (8). The optical connectors of the respective connection pairs are position-regulated in the X direction orthogonal to the optical axis and Y direction, thereby causing the axes to be matched, wherein the optical connector groups (3) and (4) are collectively connected via the adapter (8).

摘要翻译： 本发明涉及适用于光传输领域的集体连接结构，光连接器排列构件和适配器，并且能够以更少的数量容易且准确地连接多个光连接器 部分。 对应于第一和第二插头（5）和（6）的光学连接器（3a）至（3f）和（4a）至（4f）以浮子状态排列并容纳。 各个光学连接器的前端从对应于其的第一和第二插头（5）和（6）的末端突出。 各个光连接器组（3）和（4）的连接端面（45）侧沿适配器（8）两侧的引导件（31）和（33）从适配器（8）的两侧插入， 。 各连接对的光连接器在与光轴和Y方向正交的X方向上进行位置调节，从而使轴匹配，其中光连接器组（3）和（4）经由 适配器（8）。

公开(公告)号：US6079035A

公开(公告)日：2000-06-20

申请号：US35924

申请日：1998-03-06

申请人： Osamu Suzuki ,  Takayuki Watanabe

发明人： Osamu Suzuki ,  Takayuki Watanabe

IPC分类号： G06F13/42 ,  G06F13/00 ,  H04L7/00 ,  H04L7/02 ,  H04L7/033 ,  H04L25/14 ,  H04L29/00 ,  G11B20/20

CPC分类号： H04L25/14 ,  H04L7/02 ,  H04L7/0338

摘要： A sample signal is sequentially transported through a plurality of serial shift registers in respective data channels. The sample signal varies between a pair of levels, namely a first level and a second level, to resemble a step with respect to time. The shift registers are monitored by a skew detection circuit to identify the shift register that receives the sample signal at the time of a generated timing signal. Data signals are then passed through the recorded shift register while compensating for detected skew in parallel transmission data.

摘要翻译： 采样信号通过相应数据信道中的多个串行移位寄存器顺序传送。 采样信号在一对电平（即第一电平和第二电平）之间变化，以类似于相对于时间的步骤。 移位寄存器由偏斜检测电路监视，以识别在产生的定时信号时接收采样信号的移位寄存器。 然后，数据信号通过记录的移位寄存器，同时补偿并行传输数据中检测到的偏斜。

公开(公告)号：US08815142B2

公开(公告)日：2014-08-26

申请号：US13493154

申请日：2012-06-11

申请人： Gaku Iijima ,  Osamu Suzuki

发明人： Gaku Iijima ,  Osamu Suzuki

IPC分类号： B29C45/73 ,  B29C45/72 ,  B29L15/00

CPC分类号： B29C45/7207 ,  B29L2015/003

摘要： Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.

摘要翻译： 提供一种通过注射成型一体形成的树脂模制齿轮的制造方法，包括：沿着轮辋的外周面形成的齿部; 沿所述边缘的内周表面延伸的腹板; 以及设置在凸台的浇口部，该凸台与所述腹板的至少一部分接合并形成在位于中心轴线的芯部，所述方法使用熔融温度为Tm℃的合成树脂，所述方法包括 ：将熔融温度为Tm℃的合成树脂注入和装载到用于形成树脂成形齿轮的模具的空腔中; 并且当所述浇口部分固化时，将所述网的厚度中心温度T1设定为（Tm-20）℃以上至（Tm + 20）℃以下，将所述牙齿部的表面温度T2设定为 （T1-50）℃以下。

公开(公告)号：US08470936B2

公开(公告)日：2013-06-25

申请号：US13193848

申请日：2011-07-29

申请人： Pawel Czubarow ,  Osamu Suzuki ,  Toshiyuki Sato ,  Kazuyoshi Yamada ,  Kaori Matsumura

发明人： Pawel Czubarow ,  Osamu Suzuki ,  Toshiyuki Sato ,  Kazuyoshi Yamada ,  Kaori Matsumura

IPC分类号： C08K7/18 ,  C08K3/36 ,  C08K9/10 ,  C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  H01L23/29 ,  H05K1/03

CPC分类号： H01L23/293 ,  C08G59/4246 ,  C08K5/0025 ,  C08K5/3445 ,  C08L63/00 ,  C08L79/08 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/0401

摘要： A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

摘要翻译： 一种用于半导体封装的液体环氧树脂组合物，包括：（A）至少一种环氧树脂，（B）至少一种固化促进剂和（C）至少一种酸酐封端的聚酰胺酸。 液体环氧树脂组合物提供了对半导体芯片表面具有优异粘合性并具有优异的耐湿性的固化材料。

公开(公告)号：US20130009345A1

公开(公告)日：2013-01-10

申请号：US13493154

申请日：2012-06-11

申请人： Gaku Iijima ,  Osamu Suzuki

发明人： Gaku Iijima ,  Osamu Suzuki

IPC分类号： B29C45/73

CPC分类号： B29C45/7207 ,  B29L2015/003

摘要： Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.

摘要翻译： 提供一种通过注射成型一体形成的树脂模制齿轮的制造方法，包括：沿着轮辋的外周面形成的齿部; 沿所述边缘的内周表面延伸的腹板; 以及设置在凸台的浇口部，该凸台与所述腹板的至少一部分接合并形成在位于中心轴线的芯部，所述方法使用熔融温度为Tm℃的合成树脂，所述方法包括 ：将熔融温度为Tm℃的合成树脂注入和装载到用于形成树脂成形齿轮的模具的空腔中; 并且当所述浇口部分固化时，将所述网的厚度中心温度T1设定为（Tm-20）℃以上至（Tm + 20）℃以下，将所述牙齿部的表面温度T2设定为 （T1-50）℃以下。

公开(公告)号：US08318388B2

公开(公告)日：2012-11-27

申请号：US13174397

申请日：2011-06-30

申请人： Osamu Suzuki ,  Hiroyuki Akagawa ,  Masaru Tanabe ,  Atsushi Kawaguchi ,  Naozumi Ishibashi

发明人： Osamu Suzuki ,  Hiroyuki Akagawa ,  Masaru Tanabe ,  Atsushi Kawaguchi ,  Naozumi Ishibashi

IPC分类号： G03F1/00

CPC分类号： G03F1/60 ,  G03F1/50 ,  Y10T428/31616

摘要： A mask blank manufacturing department manufactures a mask blank by forming a thin film to be a mask pattern on a mask blank transparent substrate. When providing the mask blank to a mask manufacturing department, the mask blank manufacturing department provides optical characteristic information (transmittance variation) of the mask blank transparent substrate and optical characteristic information (transmittance variation and/or phase difference variation) of the mask blank to the mask manufacturing department. The optical characteristic information of the mask blank transparent substrate is provided to the mask blank manufacturing department from a materials processing department that manufactures mask blank transparent substrates.

摘要翻译： 掩模制造部门通过在掩模板透明基板上形成作为掩模图案的薄膜来制造掩模坯料。 当掩模制造部门提供掩模坯料时，掩模制造部门提供掩模毛坯透明基板的光学特性信息（透射率变化）和掩模毛坯的光学特性信息（透射率变化和/或相位差变化） 面具制造部门。 掩模坯料透明基板的光学特性信息由制造掩模板透明基板的材料加工部门提供给掩模坯料制造部。

公开(公告)号：US08115950B2

公开(公告)日：2012-02-14

申请号：US11785388

申请日：2007-04-17

申请人： Xiaojun Du ,  Osamu Suzuki ,  Eijiro Inoue ,  Akira Yokoyama

发明人： Xiaojun Du ,  Osamu Suzuki ,  Eijiro Inoue ,  Akira Yokoyama

IPC分类号： G06F3/12 ,  H04N1/04

CPC分类号： H04N1/00222 ,  H04N1/00225 ,  H04N1/0044 ,  H04N1/00448 ,  H04N1/00453 ,  H04N1/00458 ,  H04N1/00464 ,  H04N2201/0065 ,  H04N2201/0081

摘要： An image reading system includes an information processing apparatus and a scanner connected to the information processing apparatus via a network. Upon receiving input of information that specifies the number of pages to be included in a file through an input unit and a web browser, the information processing apparatus transmits the information through a first communication unit to the scanner. The scanner reads image data through a reading unit, and divides the image data into files based on the information through a data management unit. The scanner transmits the files to the information processing apparatus through a second communication unit. The information processing apparatus displays images of the files on a monitor.

摘要翻译： 图像读取系统包括经由网络与信息处理装置连接的信息处理装置和扫描仪。 在通过输入单元和网络浏览器接收到指定要包括在文件中的页数的信息的输入时，信息处理设备通过第一通信单元将信息发送到扫描仪。 扫描仪通过读取单元读取图像数据，并且通过数据管理单元基于该信息将图像数据分割成文件。 扫描仪通过第二通信单元将文件发送到信息处理设备。 信息处理装置在监视器上显示文件的图像。

公开(公告)号：US20110316149A1

公开(公告)日：2011-12-29

申请号：US13138582

申请日：2010-02-25

申请人： Osamu Suzuki ,  Seiichi Ishikawa ,  Haruyuki Yoshii

发明人： Osamu Suzuki ,  Seiichi Ishikawa ,  Haruyuki Yoshii

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： C08G59/42 ,  C08G59/50 ,  C08G59/68 ,  C08K3/36 ,  C08L63/00 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.

摘要翻译： 在电子部件的倒装芯片连接中，底部填充物填充在部件和基板之间以减轻例如热应力。 在使用迄今为止进行的铜柱的电子部件安装中，填充物中包含的填料可能在加热和固化树脂的过程中引起分离。 公开了用焊料电镀铜柱的表面。 由于异种金属之间的接触而产生的由局部电池产生的电场，充填在底部填充物中的填料的动员被抑制，并且避免了连接部分处的裂纹的发生。 因此，连接可靠性提高。

公开(公告)号：US07834955B2

公开(公告)日：2010-11-16

申请号：US10585418

申请日：2005-01-07

申请人： Osamu Suzuki ,  Yoshiyuki Nousou ,  Nobuyuki Morita ,  Kazuya Nagashima

发明人： Osamu Suzuki ,  Yoshiyuki Nousou ,  Nobuyuki Morita ,  Kazuya Nagashima

IPC分类号： G02F1/1335

CPC分类号： G02B6/0031

摘要： A technology for effectively preventing deformation of a light reflector plate fabricated by forming a synthetic resin reflector plate into a three-dimensional shape enabling a thinner light reflector plate, and additionally, reducing processing costs is provided. An adhesive tape for shape-retention is adhered onto a reflector plate which is fabricated by forming predetermined areas of a light-reflecting plastic film or sheet into a three-dimensional shape.

摘要翻译： 提供一种技术，用于有效地防止通过将合成树脂反射板形成三维形状而制成的光反射板的变形，从而能够实现更薄的光反射板，并且另外降低加工成本。 用于保持形状的胶带粘附到通过将光反射塑料膜或片的预定区域形成为三维形状而制造的反射板上。