公开(公告)号：US06367903B1

公开(公告)日：2002-04-09

申请号：US09199882

申请日：1998-11-24

申请人： Paul D. Gast ,  James L. McCullough ,  Albert Serra ,  Xavier Gros ,  Jose J Doval ,  Stefano Schiaffino ,  Ronald A. Askeland ,  Clayton L. Holstun ,  Scott Norum

发明人： Paul D. Gast ,  James L. McCullough ,  Albert Serra ,  Xavier Gros ,  Jose J Doval ,  Stefano Schiaffino ,  Ronald A. Askeland ,  Clayton L. Holstun ,  Scott Norum

IPC分类号： B41J2938

CPC分类号： B41J2/2135 ,  B41J2/04505 ,  B41J2/04543 ,  B41J2/0458 ,  B41J2202/17 ,  G06K15/102 ,  G06K2215/006

摘要： A misalignment compensation technique for a dot printer is disclosed. This technique first supplies printing instructions to a printhead for energizing printing elements in various groups (primitives) to print a pattern on a medium. The printed pattern is then detected by optical sensors in the printer. Based on the detection, a position offset error for each primitive is determined. These errors are used to generate a separate time correction for each of the primitives such that, when the printer is used normally, the time period for printing a dot will be advanced or delayed for each primitive so as to align the dots printed by the primitives. In another embodiment, alignment data taken by a manufacturing line sensor is stored in a memory on the print cartridge. After the print cartridge is installed in the printer, a second optical test completes the data needed to create timing correction values.

摘要翻译： 公开了一种点打印机的对准补偿技术。 该技术首先将打印指令提供给打印头，用于激励各种组（原始图案）中的打印元件以在介质上打印图案。 然后通过打印机中的光学传感器检测印刷图案。 基于检测，确定每个图元的位置偏移误差。 这些错误用于为每个图元生成单独的时间校正，使得当正常使用打印机时，对于每个图元，打印点的时间段将被提前或延迟，以便对准由图元打印的点 。 在另一个实施例中，由生产线传感器获取的对准数据被存储在打印盒上的存储器中。 打印墨盒安装在打印机中后，第二次光学测试完成创建定时校正值所需的数据。

公开(公告)号：US06364447B1

公开(公告)日：2002-04-02

申请号：US09506736

申请日：2000-02-18

申请人： Miguel Boleda ,  Stefano Schiaffino ,  Albert Serra

发明人： Miguel Boleda ,  Stefano Schiaffino ,  Albert Serra

IPC分类号： B41J201

CPC分类号： B41J19/145

摘要： A method and apparatus for correcting for drop placement errors due to relative rotation between an inkjet printhead mounted in a printer carriage and the print media to be printed on comprises first determining the relative contribution to the drop placement error due to rotation of the printhead about the scan axis (Y axis error), then, with respect to any determined Y axis error, applying the same magnitude and sense of correction for drop placement errors while printing in both a first scanning direction of the carriage and while printing in a second scanning direction of the carriage. Errors due to rotation about the Z axis are also corrected for. Preferably the errors are determined by printing and scanning a test pattern.

摘要翻译： 用于校正由于安装在打印机托架中的喷墨打印头和要打印的打印介质之间的相对旋转引起的墨滴放置误差的方法和装置包括首先确定由于打印头围绕着打印头的旋转而引起的落放位置误差的相对贡献 扫描轴（Y轴误差），然后相对于任何确定的Y轴误差，在打印在滑架的第一扫描方向上并且在第二扫描方向上打印时施加相同的幅度和校正误差感 的马车。 由于绕Z轴旋转的错误也会被修正。 优选地，通过打印和扫描测试图案来确定错误。

公开(公告)号：US08384118B2

公开(公告)日：2013-02-26

申请号：US12767845

申请日：2010-04-27

申请人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

发明人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC分类号： H01L33/00

CPC分类号： H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

摘要： Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

摘要翻译： 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US08202741B2

公开(公告)日：2012-06-19

申请号：US12397367

申请日：2009-03-04

申请人： James G. Neff ,  John E. Epler ,  Stefano Schiaffino

发明人： James G. Neff ,  John E. Epler ,  Stefano Schiaffino

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/38 ,  H01L2224/8112 ,  H01L2224/81801

摘要： A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.

摘要翻译： 柔性接合结构设置在半导体器件和安装件之间。 在一些实施例中，该装置是发光装置。 当半导体发光器件例如通过向半导体发光器件提供超声能量而将半导体发光器件附接到安装件时，柔性结合结构塌陷以部分地填充半导体发光器件和安装件之间的空间。 在一些实施例中，柔性接合结构是在接合期间经历塑性变形的多个金属凸块。 在一些实施例中，柔性结合结构是多孔金属层。

公开(公告)号：US07736945B2

公开(公告)日：2010-06-15

申请号：US11611775

申请日：2006-12-15

申请人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

发明人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC分类号： H01L21/00

CPC分类号： H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

摘要： Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

摘要翻译： 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US20080096297A1

公开(公告)日：2008-04-24

申请号：US11550488

申请日：2006-10-18

申请人： Stefano Schiaffino ,  John Julian Uebbing

发明人： Stefano Schiaffino ,  John Julian Uebbing

IPC分类号： H01L21/00

CPC分类号： H01L33/382 ,  H01L33/20

摘要： A process for forming electrical contacts for a semiconductor light emitting apparatus is disclosed. The light emitting apparatus has a first layer of first conductivity type, an active layer for generating light overlying the first layer, and a second layer of second conductivity type overlying the active layer. The process involves forming at least a first and a second elongate electrical contact through the second layer and the active layer to provide electrical connection to the first layer, the first and second contacts oriented at an angle to each other, the first contact having a first end in proximity with the second contact, the first end being sufficiently spaced apart from the second contact such that when current is supplied to the first layer through the contacts, current contributions from the first end of the first contact and the second contact in an area generally between the first end and the second contact cause a current density in the area that is approximately equal to a current density elsewhere along the first and second contacts

摘要翻译： 公开了一种用于形成用于半导体发光装置的电触头的工艺。 发光装置具有第一导电类型的第一层，用于产生覆盖第一层的光的有源层和覆盖有源层的第二导电类型的第二层。 该方法包括通过第二层和有源层至少形成第一和第二细长电接触以提供与第一层的电连接，第一和第二接触彼此成一定角度，第一接触具有第一 在第二触点附近端部，第一端与第二触点充分隔开，使得当电流通过触点供应到第一层时，来自第一触点的第一端和第一触点的区域中的电流贡献 通常在第一端和第二接触之间引起区域中的电流密度近似等于沿着第一和第二触点的其他地方的电流密度

公开(公告)号：US06062681A

公开(公告)日：2000-05-16

申请号：US114978

申请日：1998-07-14

申请人： Leslie A. Field ,  Stefano Schiaffino ,  Phillip W. Barth ,  Storrs T. Hoen ,  Naoto A. Kawamura ,  David K. Donald ,  Channing R. Robertson ,  Jonathan D. Servaites

发明人： Leslie A. Field ,  Stefano Schiaffino ,  Phillip W. Barth ,  Storrs T. Hoen ,  Naoto A. Kawamura ,  David K. Donald ,  Channing R. Robertson ,  Jonathan D. Servaites

IPC分类号： B41J2/175 ,  B41J2/05

CPC分类号： B41J2/17596 ,  B41J2/19 ,  Y10S366/03

摘要： A bubble valve that comprises a liquid delivery channel and a localized heating arrangement. The liquid delivery channel includes an upstream portion and a constriction downstream of the upstream portion. The constriction has a smaller cross-sectional area than the upstream portion. The localized heating arrangement is located in the liquid delivery channel and generates heat to nucleate and enlarge a bubble in the liquid. The constriction is shaped to form a seal with the bubble. The localized heating arrangement additionally generates heat to move the bubble relative to the constriction to control the flow of the liquid. A pressure regulator that comprises a liquid delivery channel connected to a liquid outlet, a sensor located adjacent the liquid outlet, a controller that operates in response to the sensor and a localized heating arrangement. The liquid delivery channel includes an upstream portion, and a constriction located between the upstream portion and the liquid outlet. The constriction has a smaller cross-sectional area than the upstream portion. The localized heating arrangement is located in the liquid delivery channel and generates heat in response to the controller to nucleate and enlarge a bubble in the liquid. The constriction is shaped to form a seal with the bubble. The localized heating arrangement additionally generates heat to move the bubble relative to the constriction to control the flow of the liquid to the liquid outlet.

摘要翻译： 气泡阀，其包括液体输送通道和局部加热装置。 液体输送通道包括上游部分的下游部分和收缩部分。 缩颈具有比上游部分更小的横截面面积。 局部加热装置位于液体输送通道中并产生热量以成核并扩大液体中的气泡。 缩颈被成形为与气泡形成密封。 局部加热装置另外产生热量以相对于收缩部移动气泡以控制液体的流动。 一种压力调节器，包括连接到液体出口的液体输送通道，位于液体出口附近的传感器，响应于传感器操作的控制器和局部加热装置。 液体输送通道包括上游部分和位于上游部分和液体出口之间的收缩部。 缩颈具有比上游部分更小的横截面面积。 局部加热装置位于液体输送通道中，响应于控制器产生热量以成核并扩大液体中的气泡。 缩颈被成形为与气泡形成密封。 局部加热装置另外产生热量以相对于收缩部移动气泡以控制液体流到液体出口的流动。

公开(公告)号：US09076944B2

公开(公告)日：2015-07-07

申请号：US13470784

申请日：2012-05-14

申请人： James G. Neff ,  John E. Epler ,  Stefano Schiaffino

发明人： James G. Neff ,  John E. Epler ,  Stefano Schiaffino

IPC分类号： H01L21/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/38 ,  H01L2224/8112 ,  H01L2224/81801

摘要： A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.

摘要翻译： 柔性接合结构设置在半导体器件和安装件之间。 在一些实施例中，该装置是发光装置。 当半导体发光器件例如通过向半导体发光器件提供超声能量而将半导体发光器件附接到安装件时，柔性结合结构塌陷以部分地填充半导体发光器件和安装件之间的空间。 在一些实施例中，柔性接合结构是在接合期间经历塑性变形的多个金属凸块。 在一些实施例中，柔性结合结构是多孔金属层。

公开(公告)号：US07439449B1

公开(公告)日：2008-10-21

申请号：US10409837

申请日：2003-04-09

申请人： Dev E. Kumar ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Donald A. Ice

发明人： Dev E. Kumar ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Donald A. Ice

IPC分类号： H05K1/00

CPC分类号： H05K1/0253 ,  G02B6/4292 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01S5/02212 ,  H01S5/02415 ,  H05K1/0203 ,  H05K1/0219 ,  H05K1/0393 ,  H05K1/141 ,  H05K1/147 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10446 ,  H01L2924/00

摘要： Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.

摘要翻译： 柔性印刷电路板通过高速数据，低速数据，高电流和接地线和焊盘中的一个或多个互连到相邻电子器件。 高速数据焊盘和迹线以及相邻接地焊盘和迹线的设计在柔性电路中保持所需的阻抗，并且在柔性电路到印刷电路板，陶瓷集管或其他器件的过渡期间保持高速运行 。 垫优选地布置成二维几何形状，使得柔性电路的连接区域比优选地如果衬垫线性排列的那样较窄。 二维阵列还允许使用大电流热电冷却器垫，其需要大的表面积，否则其不适合常规线性阵列。

公开(公告)号：US20050196173A1

公开(公告)日：2005-09-08

申请号：US10954091

申请日：2004-09-28

申请人： Stefano Schiaffino ,  Alex Klajic ,  Subra Nagarajan ,  Dincer Birincioglu ,  Mina Farr

发明人： Stefano Schiaffino ,  Alex Klajic ,  Subra Nagarajan ,  Dincer Birincioglu ,  Mina Farr

IPC分类号： H04B10/12

CPC分类号： H04B10/66 ,  G02B6/4207 ,  G02B6/4257 ,  G02B6/4263

摘要： A receive optical subassembly comprises a header assembly positioned inside an outer shell that interfaces with a receive optical fiber. The header assembly comprises an upper surface upon which one or more optical components can be mounted, the upper surface defined at least in party by a standard plane. The header assembly further comprises an angled surface that is angled with respect to the standard plane. The angled surface can comprise, for example, a sloped cavity stamped inside the header assembly, or an angled shim positioned on top of the header assembly upper surface. An optical receiver mounted on the angled surface receives an incoming optical signal but reflects at least a portion of stray optical signals away from the incoming optical signal.

摘要翻译： 接收光学子组件包括定位在与接收光纤接口的外壳内部的头部组件。 头部组件包括上表面，一个或多个光学部件可以安装在上表面上，上表面至少由标准平面限定。 头部组件还包括相对于标准平面成角度的成角度的表面。 成角度的表面可以包括例如冲压在集管组件内部的倾斜空腔，或者位于集管组件上表面顶部的成角度的垫片。 安装在倾斜表面上的光学接收器接收输入光信号，但是将至少一部分杂散光信号反射离开入射光信号。