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81 条记录 (耗时 0.024 秒)

    Micro-scale part positioning by surface interlocking
    2.
    发明授权
    Micro-scale part positioning by surface interlocking 失效
    通过表面互锁的微尺寸部件定位

    公开(公告)号：US6029881A

    公开(公告)日：2000-02-29

    申请号：US796405

    申请日：1997-02-06

    申请人： Pedro A. Chalco ,  Bruce Kenneth Furman ,  Raymond Robert Horton ,  Chandrasekhar Narayan

    发明人： Pedro A. Chalco ,  Bruce Kenneth Furman ,  Raymond Robert Horton ,  Chandrasekhar Narayan

    IPC分类号： B23K20/10 ,  H01L21/00

    CPC分类号： H01L21/67138 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/38 ,  B23K2201/40

    摘要： A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.

    摘要翻译： 表面互锁的原理，其中两个平行表面的缺陷在压力下变形和互锁。 表面互锁使得桥接元件和扩散接合装置的接合尖端的组合能够在独特的位置拾取，传输，定位，并将桥接元件固定到导体或焊盘上。 在本发明中，作为接合装置的一部分的单点接合尖端用于拾取桥接金属物体将其传送到接合位置，并且以一系列步骤完成整个桥接接合操作。

    Controlled temperature bonding
    7.
    发明授权
    Controlled temperature bonding 失效
    受控温度键合

    公开(公告)号：US5641114A

    公开(公告)日：1997-06-24

    申请号：US475255

    申请日：1995-06-07

    申请人： Raymond Robert Horton ,  Chandrasekhar Narayan ,  Michael Jon Palmer

    发明人： Raymond Robert Horton ,  Chandrasekhar Narayan ,  Michael Jon Palmer

    IPC分类号： B23K1/00 ,  B23K31/02 ,  B23K37/00

    CPC分类号： B23K1/0016 ,  B23K2201/40

    摘要： In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.

    摘要翻译： 在接合站中，要被接合的设备的部件被保持在允许的水平的热偏压温度，并且在用作传导散热器的接合位置和站的部分之间提供热止回阀接口， 从而将结构的其它未掺杂部分进行绝热并且将结合热限制到接合区域。 这种限制减少了粘合在粘合温度下必须保持的停留时间。 粘合台具有许多特征：待粘合的部件被保持在具有可在规定温度下建立组件的热偏置能力的支撑部件上; 提供保持能力，例如使用真空，以保持部件与支撑件的配准和热接触; 并且提供热止回阀能力以控制通过支撑构件的热流的速率，从而控制局部放热的散热。

    Optical alignment of superpositioned objects
    8.
    发明授权
    Optical alignment of superpositioned objects 失效
    重叠对象的光学对齐

    公开(公告)号：US06295128B1

    公开(公告)日：2001-09-25

    申请号：US08476178

    申请日：1995-06-07

    申请人： Raymond Robert Horton ,  Chandrasekhar Narayan ,  Michael Jon Palmer

    发明人： Raymond Robert Horton ,  Chandrasekhar Narayan ,  Michael Jon Palmer

    IPC分类号： G01B1100

    CPC分类号： H01L21/681 ,  G02F1/13452

    摘要： In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating fine pitch conductors and pads for bonding is achieved by observation of the reflection of one conductor or pad in the surface of the opposite substrate and relatively moving the substrates to eliminate the reflection.

    摘要翻译： 在相对的基板上对准重叠物体时，通过相对于从相对基板的表面反射的一个物体的图像的相对运动来实现精度和简单性。 通过观察相对基板的表面中的一个导体或垫的反射并相对移动基板以消除反射来实现用于接合的配合细间距导体和焊盘的对准。

    Fine pitch bonding
    9.
    发明授权
    Fine pitch bonding 失效
    细间距键合

    公开(公告)号：US5687078A

    公开(公告)日：1997-11-11

    申请号：US476531

    申请日：1995-06-07

    申请人： Raymond Robert Horton ,  Chandrasekhar Narayan ,  Michael Jon Palmer

    发明人： Raymond Robert Horton ,  Chandrasekhar Narayan ,  Michael Jon Palmer

    IPC分类号： H01L21/00 ,  G01K7/00

    CPC分类号： H01L21/67144

    摘要： In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with "X" - "Y" registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.

    摘要翻译： 在焊接站中，提供了一种工具原理，其中第一和第二工具部分分别保持第一和第二装置部分，每个装置部分具有精细的导体周期性边缘接合区域，与工具部件重叠对准，为光学对准提供空间和可访问性， 用于粘合热和压力。 工具构件保持具有“X” - “Y”配准能力的第一位置登记的装置部分，其位置具有可由工具的锥形边缘访问的精细导体周期性的边缘，其允许光学精细对准调整和结合 热和压力应用。