Forming metal preforms and metal balls
    5.
    发明授权
    Forming metal preforms and metal balls 有权
    成型金属预制件和金属球

    公开(公告)号:US08561880B2

    公开(公告)日:2013-10-22

    申请号:US13371430

    申请日:2012-02-11

    IPC分类号: B23K31/02

    摘要: A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.

    摘要翻译: 描述了用于形成和/或释放金属预成型件,金属形状和焊球的工艺和工具,其包括柔性模具或片材,注射成型金属如焊料,以及在焊球的情况下,液体或气体环境以减少或去除金属 金属(焊料)回流之前或期间的氧化物,以增加表面张力以形成球形或基本上球形的焊球。

    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    10.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开
    高密度集成电路设备,测试探针及其使用方法

    公开(公告)号:US20080129319A1

    公开(公告)日:2008-06-05

    申请号:US11930033

    申请日:2007-10-30

    IPC分类号: G01R31/02

    摘要: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    摘要翻译: 本发明涉及一种高密度测试探针,其提供用于测试晶片形式的高密度和高性能集成电路或作为离散芯片的装置。 测试探针由嵌入柔性或高模量弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 空间变压器由多层集成电路芯片封装基板形成。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除,留下布置在弹性体中并且与空间变压器电接触的线阵列。空间变压器可以具有一组引脚,这些引脚位于空间变压器的相反表面上, 其中细长导体被接合。 这些销插入第二空间变压器(例如印刷电路板)上的插座中以形成探针组件。 或者,插入器电连接器可以设置在第一和第二空间变压器之间。