Improved planar etched mirror facets
    3.
    发明授权
    Improved planar etched mirror facets 失效
    改进的平面蚀刻镜面

    公开(公告)号:US5103493A

    公开(公告)日:1992-04-07

    申请号:US669817

    申请日:1991-03-15

    摘要: A method, and device produced therewith, for improving the planarity of etched mirror facets 18 of integrated optic structures with non-planar stripe waveguides, such as ridge or groove diode lasers or passive devices such as modulators and switches. The curvature of the mirror facet surface at the edges of the waveguide due to topographical, lithographical and etch process effects, causes detrimental phase distortions, and is avoided by widening the waveguide end near the mirror surface thereby shifting the curved facet regions away from the light mode region to surface regions where curvature is not critical.

    摘要翻译: 一种用于改进具有非平面条纹波导的集成光学结构的蚀刻镜面18(例如脊或沟槽二极管激光器)或无源器件(诸如调制器和开关)的平面度的方法和装置。 由于地形,光刻和蚀刻过程效应,波导边缘处的镜面表面的曲率造成有害的相位失真,并且通过加宽靠近镜面的波导端来避免,从而使弯曲的小面区域远离光线 模式区域到曲面不重要的表面区域。

    Process for forming sub-micrometer patterns using silylation of resist
side walls
    4.
    发明授权
    Process for forming sub-micrometer patterns using silylation of resist side walls 失效
    使用抗蚀剂侧壁的甲硅烷基化形成亚微米图案的方法

    公开(公告)号:US4803181A

    公开(公告)日:1989-02-07

    申请号:US26799

    申请日:1987-03-17

    摘要: A process for forming sidewalls for use in the fabrication of semiconductor structures, where the thin, vertical sidewalls are "image transferred" to define sub-micron lateral dimensions.First, a patterned resist profile with substantially vertical edges is formed on a substrate on which the sidewalls are to be created. Then, the profile is soaked in a reactive organometallic silylation agent to silylate the top and the vertical edges of the resist to a predetermined depth, thereby rendering the profile surfaces highly oxygen etch resistant. In a subsequent anisotropic RIE process, the horizontal surfaces of the silylated profile and the unsilylated resist are removed, leaving the silylated vertical edges, that provide the desired free-standing sidewalls, essentially unaffected.

    摘要翻译: 用于形成用于制造半导体结构的侧壁的方法,其中薄的垂直侧壁被“图像转印”以限定亚微米横向尺寸。 首先,在其上将形成侧壁的基板上形成具有基本垂直边缘的图案化抗蚀剂轮廓。 然后,将该轮廓浸泡在反应性有机金属硅烷化剂中以将抗蚀剂的顶部和垂直边缘甲硅烷化至预定深度,从而使轮廓表面具有高耐氧蚀刻性。 在随后的各向异性RIE过程中,去除了甲硅烷基化曲线和未磺酰化的抗蚀剂的水平表面,留下提供所需的独立侧壁的甲硅烷基化的垂直边缘基本上不受影响。