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    INTERPOSER SUBSTRATE AND A METHOD OF FABRICATING THE SAME
    3.
    发明申请
    INTERPOSER SUBSTRATE AND A METHOD OF FABRICATING THE SAME 审中-公开
    插件底座及其制造方法

    公开(公告)号：US20160037635A1

    公开(公告)日：2016-02-04

    申请号：US14547717

    申请日：2014-11-19

    Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.

    Inventor： Pao-Hung CHOU

    IPC: H05K1/11 ,  H01L21/48 ,  H05K3/46 ,  H01L23/498

    CPC classification number: H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/10378 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for fabricating an interposer substrate is provided, including forming a wiring layer on a carrier, forming an insulating layer on the carrier, forming on the wiring layer a wiring build-up layer structure that is electrically connected to the wiring layer, forming on the wiring build-up layer structure external connection pillars that are electrically connected to the wiring build-up layer structure, and removing the carrier, with the wiring layer is exposed from a surface of the insulating layer. The fabrication process of the via can be bypassed in the fabrication process by forming coreless interposer substrate on the carrier, such that the overall cost of the fabrication process can be decreased, and the fabrication process is simple. This invention further provides the interposer substrate.

    Abstract translation: 提供了一种制造插入器基板的方法，包括在载体上形成布线层，在载体上形成绝缘层，在布线层上形成与布线层电连接的布线积层层结构，形成 电连接到布线积层层结构的布线堆积层结构外部连接柱，并且从布线层移除载体从绝缘层的表面露出。 通过在载体上形成无芯插入器基板，可以在制造工艺中绕过通孔的制造工艺，从而可以降低制造工艺的总体成本，并且制造工艺简单。 本发明还提供了内插器基板。

    INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME
    9.
    发明申请
    INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME 有权
    插件底座及其制造方法

    公开(公告)号：US20160073516A1

    公开(公告)日：2016-03-10

    申请号：US14541688

    申请日：2014-11-14

    Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.

    Inventor： Pao-Hung CHOU ,  Shih-Ping HSU ,  Che-Wei HSU

    IPC: H05K3/46 ,  H01L21/48 ,  H01L23/498

    CPC classification number: H01L21/4853 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A method of fabricating an interposer substrate is provided, including: providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer; forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer; forming a second wiring layer on the first insulating layer and the conductive pillars; disposing a plurality of external connection pillars on the second wiring layer; forming a second insulating layer on the first insulating layer, with the external connection pillars being exposed from the second insulating layer; forming at least a trench on the second insulating layer; and removing the carrier. Through the formation of the interposer substrate, which does not have a core layer, on the carrier, a via process is omitted. Therefore, the method is simple, and the interposer substrate thus fabricated has a low cost. The present invention further provides the interposer substrate.

    Abstract translation: 提供一种制造插入器基板的方法，包括：提供具有第一布线层和布置在第一布线层上的多个导电柱的载体; 在载体上形成第一绝缘层，导电柱从第一绝缘层露出; 在所述第一绝缘层和所述导电柱上形成第二布线层; 在所述第二布线层上设置多个外部连接柱; 在所述第一绝缘层上形成第二绝缘层，所述外部连接柱从所述第二绝缘层露出; 在所述第二绝缘层上形成至少沟槽; 并移除载体。 通过在载体上形成不具有芯层的插入基板，省略了通孔工艺。 因此，该方法简单，并且由此制造的内插基板具有低成本。 本发明还提供了内插基板。

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