公开(公告)号：US20120083099A1

公开(公告)日：2012-04-05

申请号：US13270954

申请日：2011-10-11

申请人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU ,  Heung Cho KO ,  Shawn MACK

发明人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU ,  Heung Cho KO ,  Shawn MACK

IPC分类号： H01L21/322

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20100289124A1

公开(公告)日：2010-11-18

申请号：US12844492

申请日：2010-07-27

申请人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU ,  Heung Cho KO ,  Shawn MACK

发明人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU ,  Heung Cho KO ,  Shawn MACK

IPC分类号： H01L23/544 ,  H01L21/02

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20110316120A1

公开(公告)日：2011-12-29

申请号：US13228041

申请日：2011-09-08

申请人： John A. ROGERS ,  Ralph G. NUZZO ,  Matthew MEITL ,  Heung Cho KO ,  Jongseung YOON ,  Etienne MENARD ,  Alfred J. BACA

发明人： John A. ROGERS ,  Ralph G. NUZZO ,  Matthew MEITL ,  Heung Cho KO ,  Jongseung YOON ,  Etienne MENARD ,  Alfred J. BACA

IPC分类号： H01L29/20 ,  B32B38/10

CPC分类号： H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/6835 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2221/68368 ,  H01L2224/95001 ,  H01L2924/0002 ,  H01L2924/13091 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

公开(公告)号：US20140140020A1

公开(公告)日：2014-05-22

申请号：US13974963

申请日：2013-08-23

申请人： John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

发明人： John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

IPC分类号： H05K1/02 ,  H05K1/03

CPC分类号： H05K1/0283 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

摘要翻译： 本文公开了可拉伸，可折叠和任选可印刷的制造方法，用于制造当拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的诸如半导体，电子电路及其部件的装置和装置。 应变隔离层为功能器件层提供了良好的应变隔离。 多层器件被构造成将中性机械表面重合或接近具有易受应变引起的故障的材料的功能层。 中性机械表面由具有空间不均匀性质的一个或多个层定位，例如通过图案化多层器件的任何层。