公开(公告)号：US08440546B2

公开(公告)日：2013-05-14

申请号：US13113504

申请日：2011-05-23

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L21/322

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US20120327608A1

公开(公告)日：2012-12-27

申请号：US13441598

申请日：2012-04-06

申请人： John A. ROGERS ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanging Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang

发明人： John A. ROGERS ,  Matthew Meitl ,  Yugang Sun ,  Heung Cho Ko ,  Andrew Carlson ,  Won Mook Choi ,  Mark Stoykovich ,  Hanging Jiang ,  Yonggang Huang ,  Ralph G. Nuzzo ,  Zhengtao Zhu ,  Etienne Menard ,  Dahl-Young Khang

IPC分类号： H05K7/06

CPC分类号： H01L29/72 ,  H01L21/02422 ,  H01L21/02628 ,  H01L21/4846 ,  H01L21/8258 ,  H01L23/5387 ,  H01L27/12 ,  H01L29/0657 ,  H01L2924/12041 ,  H01L2924/13091 ,  H05K1/0283 ,  H05K3/20 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00

摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

摘要翻译： 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US08039847B2

公开(公告)日：2011-10-18

申请号：US12844492

申请日：2010-07-27

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

IPC分类号： H01L29/72 ,  H01L21/31 ,  B65C11/02 ,  C23F1/00

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20150139888A1

公开(公告)日：2015-05-21

申请号：US14551348

申请日：2014-11-24

申请人： Hao Fong ,  Lifeng Zhang ,  Yong Zhao ,  Zhengtao Zhu

发明人： Hao Fong ,  Lifeng Zhang ,  Yong Zhao ,  Zhengtao Zhu

IPC分类号： C01B31/30 ,  D01D5/00

CPC分类号： D04H1/728 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/921 ,  C01P2004/16 ,  C04B35/5611 ,  C04B35/62277 ,  C04B35/634 ,  C04B2235/3843 ,  C04B2235/422 ,  C04B2235/425 ,  C04B2235/441 ,  C04B2235/5264 ,  C04B2235/77 ,  C04B2235/781 ,  C04B2235/80 ,  D01D5/0007 ,  D01F9/12 ,  D04H1/4209 ,  D04H1/4382 ,  D10B2101/14 ,  H01G11/36 ,  Y10T442/50

摘要： A method of synthesizing mechanically resilient titanium carbide (TiC) nanofibrous felts comprising continuous nanofibers or nano-ribbons with TiC crystallites embedded in carbon matrix, comprising: (a) electrospinning a spin dope for making precursor nanofibers with diameters less than 0.5 J·Lm; (b) overlaying the nanofibers to produce a nano-fibrous mat (felt); and then (c) heating the nano-felts first at a low temperature, and then at a high temperature for making electrospun continuous nanofibers or nano-ribbons with TiC crystallites embedded in carbon matrix; and (d) chlorinating the above electrospun nano-felts at an elevated temperature to remove titanium for producing carbide derived carbon (CDC) nano-fibrous felt with high specific surface areas.

摘要翻译： 一种合成机械弹性的碳化钛（TiC）纳米纤维毡的方法，包括连续的纳米纤维或具有嵌入碳基体中的TiC微晶的纳米带，其包括：（a）静电纺丝纺丝原液以制备直径小于0.5J·Lm的前体纳米纤维; （b）覆盖纳米纤维以产生纳米纤维垫（毡）; 然后（c）首先在低温下，然后在高温下加热纳米毡，以使电纺丝连续纳米纤维或纳米带与嵌入碳基体中的TiC微晶; 和（d）在升高的温度下氯化上述电纺丝纳米毡以除去钛，以生产具有高比表面积的碳化物衍生碳（CDC）纳米纤维毡。

公开(公告)号：US20140191236A1

公开(公告)日：2014-07-10

申请号：US14155010

申请日：2014-01-14

申请人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU

发明人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU

IPC分类号： H01L29/06 ,  H01L29/04

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US20090294803A1

公开(公告)日：2009-12-03

申请号：US11145574

申请日：2005-06-02

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L29/772 ,  H01L27/12 ,  H01L21/782 ,  H01L21/30 ,  H01L29/06 ,  H01L29/861

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US20070032089A1

公开(公告)日：2007-02-08

申请号：US11421654

申请日：2006-06-01

申请人： Ralph Nuzzo ,  John Rogers ,  Etienne Menard ,  Keon Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Ko

发明人： Ralph Nuzzo ,  John Rogers ,  Etienne Menard ,  Keon Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Ko

IPC分类号： H01L21/302

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US10519580B2

公开(公告)日：2019-12-31

申请号：US14551348

申请日：2014-11-24

申请人： Hao Fong ,  Lifeng Zhang ,  Yong Zhao ,  Zhengtao Zhu

发明人： Hao Fong ,  Lifeng Zhang ,  Yong Zhao ,  Zhengtao Zhu

IPC分类号： C01B32/00 ,  D04H1/728 ,  D04H1/4209 ,  D04H1/4382 ,  B82Y30/00 ,  B82Y40/00 ,  C04B35/622 ,  D01D5/00 ,  C04B35/56 ,  C04B35/634 ,  D01F9/12 ,  C01B32/921 ,  H01G11/36

摘要： A method of synthesizing mechanically resilient titanium carbide (TiC) nanofibrous felts comprising continuous nanofibers or nano-ribbons with TiC crystallites embedded in carbon matrix, comprising: (a) electrospinning a spin dope for making precursor nanofibers with diameters less than 0.5 J.Lm; (b) overlaying the nanofibers to produce a nano-fibrous mat (felt); and then (c) heating the nano-felts first at a low temperature, and then at a high temperature for making electrospun continuous nanofibers or nano-ribbons with TiC crystallites embedded in carbon matrix; and (d) chlorinating the above electrospun nano-felts at an elevated temperature to remove titanium for producing carbide derived carbon (CDC) nano-fibrous felt with high specific surface areas.

公开(公告)号：US08394706B2

公开(公告)日：2013-03-12

申请号：US13270954

申请日：2011-10-11

申请人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Cho Ko ,  Shawn Mack

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US20120083099A1

公开(公告)日：2012-04-05

申请号：US13270954

申请日：2011-10-11

申请人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU ,  Heung Cho KO ,  Shawn MACK

发明人： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU ,  Heung Cho KO ,  Shawn MACK

IPC分类号： H01L21/322

CPC分类号： H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

摘要翻译： 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。