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公开(公告)号：US4984268A
公开(公告)日：1991-01-08
申请号：US274219
申请日：1988-11-21
IPC分类号： H04M1/03
CPC分类号： H04M1/03
摘要： A telephone handset comprises elongated complementary upper and lower housing members that mate at their perimeters to form a hollow handset housing. The lower housing member includes a pair of spaced apart transducer receiving cavities, each being shaped to receive a cylindrical transducer surrounded by a flexible tubular gasket and form an acoustic seal therewith. Each gasket includes flanges around its circumference that project radially outward and in a direction opposite to the direction of insertion of the transducer/gasket assembly into its associated cavity. Such construction provides adequate mechanical retention between the transducer and the lower housing member and avoids the need for additional retaining hardware. The upper housing is joined to the lower housing using one or more pairs of side-mounted, interlocking hooks and latches. The upper housing further includes ribs, molded therein and positioned to maintain the transducers in place when it is joined with the lower housing.
摘要翻译： 电话听筒包括细长的互补的上部和下部壳体构件，它们在其周边配合以形成中空的手柄壳体。 下壳体构件包括一对间隔开的换能器接收空腔，每个腔体被成形为容纳由柔性管状衬垫围绕并与其形成声学密封的圆柱形换能器。 每个垫片包括围绕其圆周的凸缘，该凸缘径向向外突出并且沿与将换能器/垫圈组件插入其相关联空腔的方向相反的方向。 这种结构在换能器和下壳体构件之间提供足够的机械保持，并且避免了对额外的保持硬件的需要。 上壳体使用一对或多对侧面安装的互锁钩和闩锁连接到下壳体。 上壳体还包括模制在其中的肋，并且定位成当其与下壳体接合时将换能器保持在适当位置。
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2.发明授权Surface mount solder assembly of leadless integrated circuit packages to substrates 失效无引线集成电路封装的表面贴装焊接组件到基板
公开(公告)号：US5346118A
公开(公告)日：1994-09-13
申请号：US128492
申请日：1993-09-28
CPC分类号： H01L24/81 , H01L21/4853 , H05K3/1225 , H05K3/3436 , H05K3/3484 , H01L2224/13111 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01075 , H01L2924/01076 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K2201/0379 , H05K2201/10734 , H05K2201/10992 , H05K2203/043 , H05K2203/0545 , Y02P70/613
摘要： Described are a process for soldering at least one component having solder bumps to a substrate and a process for forming solder bumps on metal pads of an element, such as an IC package or substrate or both. The bumps are formed by stencil printing solder paste deposits on the metal pads, heating the solder paste deposits to reflow temperature of the solder in the solder paste deposits, and allowing the molten solder in each deposit to coalesce and during subsequent cooling solidify forming the bumps on the metal pads. The bumps are formed by conducting the stencil printing through apertures in an ultra-thick stencil, the apertures having trapezoidal crossection in the plane normal to the broad surfaces of the stencil with the top opening being smaller than the bottom opening and with the walls of the aperture sloping at an angle within a range of from 1 to 45 degrees from the vertical, the solder paste having a low tackiness and high metal loading, and the solder paste deposits covering an area which is equal to or exceeds an area of the metal pad in any ratio between 1.5:1 and 5:1. Bumps formed in this manner lead to the formation of reliable solder joints.
摘要翻译： 描述了将至少一个具有焊料凸块的部件焊接到基板上的工艺，以及用于在诸如IC封装或基板或两者的元件的金属焊盘上形成焊料凸块的工艺。 凸块通过在金属焊盘上的模版印刷焊膏沉积物形成，加热焊膏沉积物以回流焊膏沉积物中焊料的温度，并允许每个沉积物中的熔融焊料聚结并在随后的冷却期间固化形成凸块 在金属垫上。 通过在超厚模板中的孔进行模版印刷来形成凸块，该孔在垂直于模板的宽表面的平面中具有梯形横截面，顶部开口小于底部开口，并且壁 孔径与垂直于1至45度的角度倾斜，焊膏具有低粘性和高金属负载，并且焊膏沉积物覆盖等于或超过金属焊盘区域的面积 在1.5：1和5：1之间的任何比例。 以这种方式形成的冲击导致形成可靠的焊点。
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公开(公告)号：US06189203B1
公开(公告)日：2001-02-20
申请号：US09288750
申请日：1999-04-08
IPC分类号： H01F4106
CPC分类号： H05K1/165 , H05K1/141 , H05K3/3415 , H05K3/3436 , H05K2201/045 , H05K2201/086 , H05K2201/09063 , H05K2201/10234 , H05K2201/10257 , H05K2201/10666 , H05K2203/041 , H05K2203/0455 , H05K2203/1476 , H05K2203/1572 , Y02P70/613 , Y10T29/4902 , Y10T29/49073 , Y10T29/49126
摘要： A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.
摘要翻译： 一种可表面安装的电源和一种制造电源的方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）具有安装在上导电层上的第二焊盘上的第二引线的上部电气部件，（4）位于第一引线附近的焊料， 较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，该平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述基板的孔径并且靠近所述绕组设置的芯体，以及（6）连接到所述下导电层的衬底间导电安装件，所述衬底由具有高于焊料回流温度的熔点的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。
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4.发明授权Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board 失效可边缘安装的集成电路封装以及将其连接到印刷电路板的方法公开(公告)号：US06246016B1
公开(公告)日：2001-06-12
申请号：US09266531
申请日：1999-03-11
IPC分类号： H01R909
CPC分类号： H01L23/49805 , H01L2924/0002 , H05K3/0052 , H05K3/3442 , H05K3/366 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/09854 , H05K2201/10568 , H05K2203/167 , H01L2924/00
摘要： An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB.
摘要翻译： 一种可边缘安装的集成电路（IC）封装及其制造和组装到印刷电路板（PWB）上的方法。 在一个实施例中，封装包括：（1）具有主表面和基本上平面的边缘的衬底，以及（2）导电涂层，其具有位于主表面的一部分上的第一区域和位于主表面的一部分上的第二区域 基本上平面的边缘，第二区域基本上是平面的，以允许第二区域回流焊接到相邻的印刷线路板PWB。
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公开(公告)号：US5959842A
公开(公告)日：1999-09-28
申请号：US78791
申请日：1998-05-14
CPC分类号： H05K7/1092 , H05K1/141 , H05K2201/1003 , H05K2201/10166 , H05K2201/10424 , H05K2203/082 , H05K3/303 , H05K3/3421 , H05K3/3447 , H05K3/368
摘要： A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.
摘要翻译： 用于容纳板载电源的表面贴装封装，其制造方法以及采用该封装的板上电源。 在一个实施例中，封装包括：（1）具有第一端和第二表面安装端的多个引线，（2）电介质引线框架，其将所述多个引线相对于彼此保持在预定位置，使得至少一些 的第二表面安装端部是共面的，第一端部可连接到板上安装的电源，（3）耦合到引线框架的外壳，其形成表面安装封装的周边的一部分，和 4）位于引线框架和外壳之间的灌封材料。
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6.发明授权Magnetic device employing a winding structure spanning multiple boards and method of manufacture thereof 有权采用跨越多个板的绕组结构的磁性装置及其制造方法公开(公告)号：US06353379B1
公开(公告)日：2002-03-05
申请号：US09514822
申请日：2000-02-28
IPC分类号： H01F500
CPC分类号： H01F27/2804 , H05K1/141 , H05K1/165 , Y10T29/4902
摘要： A magnetic device and a method of manufacturing the same. In one embodiment, the device includes: (1) a magnetic core and (2) a winding structure located proximate the magnetic core. The winding structure includes:(2a) a multilayer main circuit board containing an interconnected first plurality of winding layers, (2b) a multilayer overlay board located proximate the main circuit board and containing an interconnected second plurality of winding layers and (2c) conductors coupling the first and second pluralities of winding layers together to cause the first and second pluralities of winding layers to function cooperatively as windings for the magnetic device.
摘要翻译： 磁性装置及其制造方法。 在一个实施例中，该装置包括：（1）磁芯和（2）位于磁芯附近的绕组结构。 所述绕组结构包括：（2a）包含互连的第一多个绕组层的多层主电路板，（2b）位于所述主电路板附近并且包含互连的第二多个绕组层的多层覆盖板，以及（2c） 所述第一和第二多个绕组层一起引起所述第一和第二多个绕组层作为所述磁性器件的绕组协同地起作用。
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7.发明授权Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same 有权用于电路板的基板间导电安装座，电路板和采用该电路板的电力磁性装置公开(公告)号：US06310301B1
公开(公告)日：2001-10-30
申请号：US09288749
申请日：1999-04-08
申请人： Randy T. Heinrich , Robert J. Roessler , Thang D. Truong , Matthew A. Wilkowski , William L. Woods, Jr.
发明人： Randy T. Heinrich , Robert J. Roessler , Thang D. Truong , Matthew A. Wilkowski , William L. Woods, Jr.
IPC分类号： H05K116
CPC分类号： H05K3/368 , H05K1/141 , H05K1/165 , H05K3/3436 , H05K2201/10234 , H05K2201/10257 , H05K2201/10666 , H05K2201/10992 , H05K2203/041 , H05K2203/0455 , Y02P70/613
摘要： An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.
摘要翻译： 一种用于表面安装电路板的基板间导电座，一种制造电路板的方法和一种可表面安装的电力磁性装置。 在一个实施例中，电路板包括：（1）基板，（2）由具有高于焊料回流温度的熔点的材料构成的基板间导电安装件，并且在基板的界面处包括柔性焊接点 （3）位于导电安装座附近的焊料，该导电安装件具有足够低的重量，使得焊料的液体状态的表面张力足以使导电安装座与衬底接触，因为焊料被带到 回流温度，导电安装件能够将衬底安装到相邻的衬底上并且在它们之间提供导电路径。
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8.发明授权公开(公告)号：US06205641B1
公开(公告)日：2001-03-27
申请号：US09408423
申请日：1999-09-29
IPC分类号： B23P1902
CPC分类号： B23P19/062 , H05K7/142 , Y10T29/49945 , Y10T29/53826
摘要： An anvil for a press for assembling a fastener to a plate having an aperture. The press includes a ram assembly for pressing the fastener into the plate aperture. The anvil includes a housing and a pin disposed in the housing. The pin is slidable between an extended position, partially extending outwardly of the housing and is adapted to extend through the plate aperture. The pin moves to a retracted position disposed within the housing for contact with the bottom surface of the plate. The anvil further includes a collar disposed in the housing and concentrically disposed around the pin. The collar includes a plurality of spaced apart collar sections, each collar section having a bottom flange retained by the housing and a top flange. The collar sections are movable between an expanded position when the pin is in the extended position, and a collapsed position when the pin is in the retracted position within the housing. The collar sections top flanges engage the pin top surface in the pin retracted position to form a barrier below the plate aperture to prevent fastener extruded material from protruding on the plate bottom surface after the fastener is inserted into the plate.
摘要翻译： 用于将紧固件组装到具有孔的板的压力机的砧座。 压力机包括用于将紧固件压入板孔的压头组件。 砧座包括设置在壳体中的壳体和销。 销可在延伸位置之间滑动，该延伸位置部分地延伸到外壳的外部，并且适于延伸穿过板孔。 销移动到设置在壳体内的缩回位置，以与板的底表面接触。 砧座还包括设置在壳体中并且同心地设置在销周围的轴环。 套环包括多个间隔开的套环部分，每个套环段具有由壳体保持的底部凸缘和顶部凸缘。 当销处于延伸位置时，套环段可在展开位置之间移动，并且当销处于壳体内的缩回位置时可以使其折叠。 凸缘部分顶部凸缘在销缩回位置处接合销顶表面，以在板孔下方形成阻挡件，以防止紧固件挤压材料在紧固件插入板中之后突出在板底表面上。
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公开(公告)号：US4358961A
公开(公告)日：1982-11-16
申请号：US222428
申请日：1981-01-05
CPC分类号： G01N3/08 , G01N2033/0078 , G01N2203/0062 , G01N2203/0274
摘要： A tubular piece part (10) is tested to determine the rupture strength of the part when subject to lateral expansion (F) with respect to a bore (11) of the part. In one example, a tubular segmented collet (21) is placed in the bore of the part, and a tapered pin (23) is forced a predetermined distance into the collet (X) so as to expand the collet and part radially outward by a predetermined amount. The peak force required to so expand the collet is measured (57) so as to provide an indication of the rupture strength of the part, and particularly of the weld strength of a molded plastic tube having a radial weld line (W). In particular, this method provides an indication of the likelihood that the part will fail prematurely in the field, after subsequent assembly of the part with an insert member (17) that is force fit into the bore.
摘要翻译： 测试管状件部件（10）以确定当相对于部件的孔（11）横向膨胀（F）时部件的断裂强度。 在一个示例中，管状分段夹头（21）被放置在部件的孔中，并且锥形销（23）被迫预定距离进入夹头（X），以便将夹头和部件径向向外扩张一个 预定量。 测量如此膨胀夹头所需的峰值力（57），以提供部件的断裂强度，特别是具有径向焊接线（W）的模塑塑料管的焊接强度的指示。 特别地，该方法提供了在使用插入构件（17）进行后续组装之后该部件在现场中过早失效的可能性的指示。
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