公开(公告)号：US20110018120A1

公开(公告)日：2011-01-27

申请号：US12507349

申请日：2009-07-22

申请人： Robert J. Drost ,  James G. Mitchell ,  David C. Douglas

发明人： Robert J. Drost ,  James G. Mitchell ,  David C. Douglas

IPC分类号： H01L23/538

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/72 ,  H01L24/90 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2223/6638 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost.

摘要翻译： 描述了芯片封装。 该芯片封装包括彼此偏移的半导体管芯或芯片堆叠，由此限定具有暴露焊盘的露台。 位于大致平行于平台的高带宽斜坡部件电耦合到暴露的焊盘。 例如，斜坡部件可以使用：微弹簧，各向异性膜和/或焊料电耦合到半导体管芯。 因此，电触点可以具有导电性，电容性或通常的复阻抗。 此外，芯片和/或斜面部件可以使用球 - 坑对准技术相对于彼此定位。 通过消除对半导体管芯中昂贵且耗费大量的硅通孔（TSV）的需求，芯片封装便于以提供高带宽和低成本的方式堆叠芯片。

公开(公告)号：US08476749B2

公开(公告)日：2013-07-02

申请号：US12507349

申请日：2009-07-22

申请人： Robert J. Drost ,  James G. Mitchell ,  David C. Douglas

发明人： Robert J. Drost ,  James G. Mitchell ,  David C. Douglas

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/72 ,  H01L24/90 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2223/6638 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost.

摘要翻译： 描述了芯片封装。 该芯片封装包括彼此偏移的半导体管芯或芯片堆叠，从而限定具有暴露焊盘的露台。 位于大致平行于平台的高带宽斜坡部件电耦合到暴露的焊盘。 例如，斜坡部件可以使用：微弹簧，各向异性膜和/或焊料电耦合到半导体管芯。 因此，电触点可以具有导电性，电容性或通常的复阻抗。 此外，芯片和/或斜面部件可以使用球 - 坑对准技术相对于彼此定位。 通过消除对半导体管芯中昂贵且耗费大量的硅通孔（TSV）的需求，芯片封装便于以提供高带宽和低成本的方式堆叠芯片。

公开(公告)号：US08076178B2

公开(公告)日：2011-12-13

申请号：US11864369

申请日：2007-09-28

申请人： Ashok V. Krishnamoorthy ,  John E. Cunningham ,  James G. Mitchell

发明人： Ashok V. Krishnamoorthy ,  John E. Cunningham ,  James G. Mitchell

IPC分类号： H01L21/00 ,  H01L21/20

CPC分类号： H01L23/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06593 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

摘要： Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.

摘要翻译： 描述了用于组装多芯片模块（MCM）的方法的实施例。 在该方法中，包括耦合元件的流体被施加到MCM中的基板的表面。 然后，使用流体组件将至少一些联接元件定位在基板的表面上的负特征中。 注意，给定的耦合元件使用基于化学的选择和/或基于几何的选择来选择给定的负特征。 接下来，去除流体和过量的耦合元件（其位于表面上的负特征之外的区域中）。

公开(公告)号：US20110111559A1

公开(公告)日：2011-05-12

申请号：US13006227

申请日：2011-01-13

申请人： James G. Mitchell ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

发明人： James G. Mitchell ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC分类号： H01L21/50

CPC分类号： H01L25/0652 ,  H01L23/10 ,  H01L23/48 ,  H01L24/02 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/95136 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06593 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

摘要： Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.

摘要翻译： 描述了多芯片模块（MCM）的实施例。 该MCM包括第一半导体管芯和第二半导体管芯，其中可以是第一半导体管芯或第二半导体管芯的给定半导体管芯包括靠近给定半导体管芯的表面的接近连接器。 此外，给定的半导体管芯被配置为通过一个或多个接近连接器的接近通信与另一个半导体管芯通信信号。 此外，MCM包括对准板和联接到对准板的顶板。 该对准板包括被配置为容纳第一半导体管芯的第一负特征构件和被配置为容纳第二半导体管芯的第二负特征，并且顶板包括正特征。 注意，正特征耦合到第一半导体管芯，并且正特征有利于第一半导体管芯的机械定位。

公开(公告)号：US07893531B2

公开(公告)日：2011-02-22

申请号：US11864408

申请日：2007-09-28

申请人： James G. Mitchell ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

发明人： James G. Mitchell ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC分类号： H01L23/34

CPC分类号： H01L25/0652 ,  H01L23/10 ,  H01L23/48 ,  H01L24/02 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/95136 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06593 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

摘要： Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.

公开(公告)号：US5787251A

公开(公告)日：1998-07-28

申请号：US752192

申请日：1996-11-18

申请人： Graham Hamilton ,  Michael L. Powell ,  James G. Mitchell ,  Jonathan J. Gibbons

发明人： Graham Hamilton ,  Michael L. Powell ,  James G. Mitchell ,  Jonathan J. Gibbons

IPC分类号： G06F9/46 ,  G06F13/00 ,  G06F15/16

CPC分类号： G06F9/547 ,  G06F9/548

摘要： The present invention provides an elegant and simple way to provide mechanisms for invocation of objects by client applications and for argument passing between client applications and object implementations, without the client application or the operating system knowing the details of how these mechanisms work. Moreover, these mechanisms functions in a distributed computer environment with similar ease and efficiency, where client applications may be on one computer node and object implementations on another. The invention includes a new type of object, termed a "spring object," which includes a method table, a subcontract mechanism and a data structure which represents the subcontract's local private state.

摘要翻译： 本发明提供了一种优雅和简单的方式来提供用于由客户端应用程序调用对象的机制，以及客户端应用程序和对象实现之间的参数传递，而客户机应用程序或操作系统知道这些机制如何工作的细节。 此外，这些机制在分布式计算机环境中起着相似的容易性和效率的作用，其中客户端应用程序可能在一个计算机节点上，而对象实现在另一个计算机节点上。 本发明包括称为“弹簧对象”的新型对象，其包括方法表，转包机构和表示分包商的本地私有状态的数据结构。

公开(公告)号：US20120326322A1

公开(公告)日：2012-12-27

申请号：US13165599

申请日：2011-06-21

申请人： Ashok V. Krishnamoorthy ,  Craig A. Stephen ,  John E. Cunningham ,  James G. Mitchell

发明人： Ashok V. Krishnamoorthy ,  Craig A. Stephen ,  John E. Cunningham ,  James G. Mitchell

IPC分类号： H01L23/48 ,  B32B3/00

CPC分类号： H01L24/13 ,  H01L23/48 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/81097 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81815 ,  H01L2224/81855 ,  Y10T428/24479 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/0105

摘要： A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.

摘要翻译： 芯片封装包括具有正特征的衬底，其被限定在衬底的表面上并且突出在接近正特征的表面上的区域上方。 此外，芯片封装包括限定在靠近正特征的基板上的机械加强机构，其增加正特征相对于基板的横向剪切强度。 以这种方式，芯片封装可以促进包括芯片封装的多芯片模块（MCM）的增加的可靠性。

公开(公告)号：US20120266464A1

公开(公告)日：2012-10-25

申请号：US13517591

申请日：2012-06-13

申请人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

发明人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

IPC分类号： H01K3/10

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68309 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/15787 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49895 ,  Y10T29/49947 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.

摘要翻译： 描述了包括多层插入板的多层插入板和多芯片模块（MCM）。 多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。 此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。 在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到 第一个微型弹簧连接器。 类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧 连接器

公开(公告)号：US4258891A

公开(公告)日：1981-03-31

申请号：US945962

申请日：1978-09-26

申请人： James G. Mitchell ,  Winalee G. Mitchell

发明人： James G. Mitchell ,  Winalee G. Mitchell

IPC分类号： A61G12/00 ,  B62B3/10 ,  B65B67/12 ,  D06F95/00 ,  A63B55/08

CPC分类号： D06F95/004 ,  A61G12/001 ,  B62B3/106 ,  B65B67/12 ,  B62B2202/66 ,  B62B2205/06

摘要： A cover for a laundry bag supported between pivotally interconnected leg members of inverted U-shape. The cover comprises a hood having slots near the ends of its opposing side walls, for fitting over pivot members extending between the two leg members and pivoting thereon from an open position in which the mouth of the bag is exposed to a closed position in which it is completely covered. The cover may be hand operated or spring closed and foot opened.

摘要翻译： 用于衣物袋的盖子，其被支撑在倒U形的枢转互连的腿部件之间。 盖子包括一个靠近其相对的侧壁的端部附近的狭缝的罩，用于装配在两个腿部件之间延伸的枢转件上，并从袋子的嘴部露出到关闭位置的打开位置枢转 被完全覆盖 盖子可以手动操作或弹簧关闭，脚打开。

公开(公告)号：US4145822A

公开(公告)日：1979-03-27

申请号：US849681

申请日：1977-11-08

申请人： Winalee G. Mitchell ,  James G. Mitchell

发明人： Winalee G. Mitchell ,  James G. Mitchell

IPC分类号： A43B3/10 ,  A43D63/00 ,  A43B1/14 ,  A43B1/02 ,  A43B9/00

CPC分类号： A43B3/24 ,  A43B3/10

摘要： The disclosure describes various forms of scuff-type slippers which are durable and resist turning under of the heel portion in use. These include a transversely elastic vamp, a sole which can be bent transversely by tension forces in the vamp, to which it is fusion bonded, and, extending above the sole, a heel overlayer that is secured to the sole at least in part by fusion bonding along the sides thereof. Also disclosed are methods of making such slippers.

摘要翻译： 本公开内容描述了各种形式的擦伤型拖鞋，其耐用并且抵抗在使用中的后跟部分下转动。 这些包括横向弹性鞋面，鞋底，其可以通过鞋面中的张力横向地被弯曲，其被熔合在其上，并且在鞋底上方延伸至少部分地通过融合固定到鞋底的鞋跟覆盖层 沿其侧面粘合。 还公开了制造这种拖鞋的方法。