摘要:
In an illustrative implementation, a system for video storage optimization analyzes user activity to determine how to optimally store video. In a preferred embodiment, a security system records video from a plurality of security cameras and stores the video at the security system and/or a server system, along with associated metadata. The server system monitors user activity, such as live and recorded video viewing behavior, and queries for videos. The server system collects user video viewing behavior statistics, determines trends, and stores both personnel-specific and enterprise-wide settings. An optimization engine analyzes the video info, personnel-specific settings, enterprise-wide settings, and user statistics to determine a storage factor for a video. The optimization engine then determines if a video meets storage factor thresholds and settings for compression or deletion.
摘要:
In one embodiment, a chain of custody management application is configured to receive electronic recordings and physical evidence data, associate them with a security event, and automatically create and embed a hash value that aids in the authentication of both the electronic recordings and the physical evidence. A case management system may create a case record for an incident, present a form to the user, and prompt the user to electronically associate an electronic recording and physical evidence to the case record. The case management system optionally issues a call to a verification system which, in this example, automatically creates a first hash value from the electronic recording data and a second hash value from the physical evidence data. The hash values may then be embedded in an electronic case record form that may be printed on demand for use by government authorities.
摘要:
A method and apparatus for depositing a film by chemical vapor deposition comprises a showerhead for dispersing reactant gases into the processing space wherein the showerhead has a first space therein operable for receiving and dispersing the first reacting gas, and has a second space therein, generally isolated from the first space, and operable for receiving and dispersing the second reactant gas separate from the first gas dispersion for maintaining segregation of reactant gases and generally preventing premature mixture of the gases prior to their introduction into the processing space to prevent premature deposition in the system.
摘要:
Methods of chemical vapor deposition (CVD) are disclosed wherein high quality films are deposited on patterned wafer substrates. In the methods, a patterned wafer is rotated about an axis thereof in a CVD reaction chamber and reactant gases are directed into the reaction chamber and toward the patterned wafer substrate in a direction generally perpendicular to the plane of rotation of the wafer. The reaction chamber is maintained at a suitable pressure and the wafer is heated to a suitable temperature whereby a high quality film is deposited by CVD on the patterned wafer substrate. The process is applicable to deposit elemental films, compound films, alloy films and solid solution films, and is particularly advantageous in that high film deposition rates and high reactant conversion rates are achieved.
摘要:
A semiconductor wafer processing apparatus, particularly a CVD reactor, is provided with plasma cleaning electrodes integrated into process gas flow shaping structure that smoothly directs the gas past the wafer on a susceptor. The processing apparatus preferably has a showerhead or other inlet to direct a gas mixture onto a wafer and a plurality of baffles to reduce turbulence. Plasma cleaning electrodes are included in the baffles or the showerhead or both, one or more of which preferably have cleaning gas outlet orifices therein, preferably evenly distributed around the axis of the susceptor to provide uniform cleaning gas flow.
摘要:
In selected embodiments, a computer-implemented method for analyzing customer movement in a retail environment includes capturing an image of an individual at multiple locations within a retail environment and tracking the elapsed time between the individual's appearance at the various locations. For areas of the store at increased risk for shoplifting, the elapsed times may be compared to predetermined upper and/or lower elapsed time thresholds or windows to determine whether an individual is likely to commit a crime in the retail environment. The thresholds or window may be empirically determined based on analysis of historical security video footage and security incident records.
摘要:
A method for depositing a film on a substrate by plasma-enhanced chemical vapor deposition at temperatures substantially lower than conventional thermal CVD temperatures comprises placing a substrate within a reaction chamber and exciting a first gas upstream of the substrate to generate activated radicals of the first gas. The substrate is rotated within the deposition chamber to create a pumping action which draws the gas mixture of first gas radicals to the substrate surface. A second gas is supplied proximate the substrate to mix with the activated radicals of the first gas and the mixture produces a surface reaction at the substrate to deposit a film. The pumping action draws the gas mixture down to the substrate surface in a laminar flow to reduce recirculation and radical recombination such that a sufficient amount of radicals are available at the substrate surface to take part in the surface reaction. Another method utilizes a gas-dispersing showerhead that is biased with RF energy to form an electrode which generates activated radicals and ions in a concentrated plasma close to the substrate surface. The activated plasma gas radicals and ions utilized in the invention contribute energy to the surface reaction such that the film may be deposited at a substantially lower deposition temperature that is necessary for traditional thermal CVD techniques. Furthermore, the activation of these species reduces the temperature needed to complete the surface reaction. The method is particularly useful in depositing titanium-containing films at low temperatures.
摘要:
Nucleation of a refractory metal such as tungsten is initiated on a substrate of TiN without the use of silane by introducing hydrogen into a CVD reactor before the introduction of the reactant gas containing the metal, brought to reaction temperature and to reaction pressure. The process is most useful for CVD of tungsten onto patterned TiN coated silicon semiconductor wafers. Alternatively, hydrogen is introduced in a mixture with the metal containing gas, such as WF.sub.6, and maintained at subreaction pressure, of for example 100 mTorr, until the substrate is stabilized at a reaction temperature of approximately 400.degree. C. or higher, to cause the dissociation of hydrogen on the wafer surface, then elevated to a relatively high reaction pressure of, for example, 60 Torr at which nucleation is achieved. Also, the reduction reaction that deposits the tungsten film proceeds without the need for a two step nucleation-deposition process.
摘要:
A method for architectural review is provided. Project data is submitted to an architecture audit team. An exception to an approved technology for the project data is conveyed to a technology management team comprising subject matter experts from each of multiple domains. A recommendation regarding the exception to the approved technology for the project data is conveyed to an architecture review committee comprising a director representative from each domain. A decision on the recommendation regarding the exception is recorded.
摘要:
Using plasma enhanced chemical vapor deposition, various layers can be deposited on semiconductor substrates at low temperatures in the same reactor. When a titanium nitride film is required, a titanium film can be initially deposited using a plasma enhanced chemical vapor deposition wherein the plasma is created within 25 mm of the substrate surface, supplying a uniform plasma across the surface. The deposited film can be subjected to an ammonia anneal, again using a plasma of ammonia created within 25 mm of the substrate surface, followed by the plasma enhanced chemical vapor deposition of titanium nitride by creating a plasma of titanium tetrachloride and ammonia within 25 mm of the substrate surface. This permits deposition film and annealing at relatively low temperatures—less than 800° C. When titanium is so deposited over a silicon surface, titanium silicide will form at the juncture which then can be nitrided and coated with titanium or titanium nitride using the plasma enhanced chemical vapor deposition of the present invention. Thus, the present method permits the formation of multiple layers of titanium, titanium nitride, titanium silicide over the surface of the substrate in the same reactor.