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    Colloidal silica composite films for premetal dielectric applications
    4.
    发明授权
    Colloidal silica composite films for premetal dielectric applications 失效
    用于金属前介电应用的胶体二氧化硅复合膜

    公开(公告)号：US06967172B2

    公开(公告)日：2005-11-22

    申请号：US10680026

    申请日：2003-10-07

    申请人： Roger Leung ,  Denis Endisch ,  Songyuan Xie ,  Nigel Hacker ,  Yanpei Deng

    发明人： Roger Leung ,  Denis Endisch ,  Songyuan Xie ,  Nigel Hacker ,  Yanpei Deng

    IPC分类号： H01L21/316 ,  H01L21/302

    CPC分类号： H01L21/02282 ,  H01L21/02203 ,  H01L21/316 ,  H01L21/76837

    摘要： A colloidal suspension of nanoparticles composed of a dense material dispersed in a solvent is used in forming a gap-filling dielectric material with low thermal shrinkage. The dielectric material is particularly useful for pre-metal dielectric and shallow trench isolation applications. According to the methods of forming a dielectric material, the colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The intermediate layer is modified by infiltration with a liquid phase matrix material, such as a spin-on polymer, followed by curing, by infiltration with a gas phase matrix material, followed by curing, or by curing alone, to provide a gap-filling, thermally stable, etch resistant dielectric material.

    摘要翻译： 使用由分散在溶剂中的致密材料构成的纳米颗粒的胶体悬浮液来形成具有低热收缩率的间隙填充介电材料。 电介质材料特别适用于预金属电介质和浅沟槽隔离应用。 根据形成电介质材料的方法，将胶体悬浮液沉积在基底上并干燥以形成多孔中间层。 通过用液相基质材料（例如旋涂聚合物）渗透，然后通过用气相基质材料渗透，随后固化，或通过单独固化来改性中间层，从而提供间隙填充 ，耐热稳定的，耐蚀刻的介电材料。

    Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
    9.
    发明授权
    Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof 有权
    用于三层图案化应用的组合物，涂料和膜及其制备方法

    公开(公告)号：US08642246B2

    公开(公告)日：2014-02-04

    申请号：US11838854

    申请日：2007-08-14

    申请人： Joseph Kennedy ,  Songyuan Xie ,  Kim Do ,  Sudip Mukhopadhyay

    发明人： Joseph Kennedy ,  Songyuan Xie ,  Kim Do ,  Sudip Mukhopadhyay

    IPC分类号： G03F7/075 ,  G03F7/11 ,  C08L83/06

    CPC分类号： G03F7/0752 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  C08L83/06 ,  C09D183/04 ,  G03F7/091 ,  G03F7/11 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  C08L2666/44

    摘要： Compositions for use in tri-layer applications are described herein, wherein the composition has a matrix and includes: a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, at least one condensation catalyst, and at least one solvent. Tri-layer structures are also contemplated herein that comprise an organic underlayer (first layer), antireflective compositions and/or films contemplated herein (second layer) and a photoresist material (third layer) that are coupled to one another. Methods of producing a composition for tri-layer patterning applications includes: providing a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, providing at least one condensation catalyst, providing at least one solvent, providing at least one pH modifier, blending the formulated polymer and part of the at least one solvent in a reaction vessel to form a reactive mixture; and incorporating the at least one pH modifier, the at least one condensation catalyst and the remaining at least one solvent into the reactive mixture to form the composition.

    摘要翻译： 本文描述了用于三层应用的组合物，其中所述组合物具有基质，并且包括：配制的聚合物，其包含形成聚合物基质的至少一种类型的硅基部分，多个与基质偶联的乙烯基 的聚合物，以及与聚合物的基质偶联的多个苯基，至少一种缩合催化剂和至少一种溶剂。 本文还涵盖三层结构，其包括彼此耦合的有机底层（第一层），抗反射组合物和/或本文考虑的抗反射组合物（第二层）和光致抗蚀剂材料（第三层）。 制备用于三层图案化应用的组合物的方法包括：提供配制的聚合物，其包含形成聚合物基质的至少一种类型的硅基部分，与聚合物基质偶联的多个乙烯基，以及多个 提供至少一种缩合催化剂，提供至少一种溶剂，提供至少一种pH调节剂，将配制的聚合物和部分至少一种溶剂混合在反应容器中以形成 反应性混合物 并将至少一种pH调节剂，至少一种缩合催化剂和剩余的至少一种溶剂掺入到反应混合物中以形成组合物。