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    Optical electronic package having a blind cavity for covering an optical sensor
    3.
    发明授权
    Optical electronic package having a blind cavity for covering an optical sensor 有权
    具有用于覆盖光学传感器的盲腔的光学电子封装

    公开(公告)号：US09136292B2

    公开(公告)日：2015-09-15

    申请号：US13541066

    申请日：2012-07-03

    申请人： Romain Coffy ,  Remi Brechignac

    发明人： Romain Coffy ,  Remi Brechignac

    IPC分类号： H01L27/00 ,  H01L27/146 ,  G01S7/481 ,  G01S17/02 ,  H01L25/16 ,  H01L31/167 ,  H01L31/173 ,  H01L33/48 ,  H01L33/54

    CPC分类号： H01L27/14618 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L27/14603 ,  H01L27/14643 ,  H01L27/14647 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/167 ,  H01L31/173 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.

    摘要翻译： 电子封装包括具有正面和背面的衬底晶片。 发光集成电路芯片安装在基板晶片的正面，并包括光辐射光发射器。 接收集成电路芯片也安装在基板晶片的正面，并且包括至少一个光辐射光学传感器。 透明密封剂在光学传感器和光发射器之上延伸。 不透明的密封剂封装透明密封剂。 不透明密封剂具有位于光发射器上方并且相对于光学传感器横向偏移的前窗。 因此，透明密封剂具有位于光发射器上方并且相对于光学传感器横向偏移的未覆盖的正面。 不透明的密封剂可以包括另外的前窗。 接收集成电路芯片还包括与附加前窗相对的第二光学传感器。

    OPTICAL ELECTRONIC PACKAGE
    4.
    发明申请
    OPTICAL ELECTRONIC PACKAGE 有权
    光电子包装

    公开(公告)号：US20130012276A1

    公开(公告)日：2013-01-10

    申请号：US13541066

    申请日：2012-07-03

    申请人： Romain Coffy ,  Remi Brechignac

    发明人： Romain Coffy ,  Remi Brechignac

    IPC分类号： H01L33/48 ,  H04W88/02

    CPC分类号： H01L27/14618 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L27/14603 ,  H01L27/14643 ,  H01L27/14647 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/167 ,  H01L31/173 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.

    摘要翻译： 电子封装包括具有正面和背面的衬底晶片。 发光集成电路芯片安装在基板晶片的正面，并包括光辐射光发射器。 接收集成电路芯片也安装在基板晶片的正面，并且包括至少一个光辐射光学传感器。 透明密封剂在光学传感器和光发射器之上延伸。 不透明的密封剂封装透明密封剂。 不透明密封剂具有位于光发射器上方并且相对于光学传感器横向偏移的前窗。 因此，透明密封剂具有位于光发射器上方并且相对于光学传感器横向偏移的未覆盖的正面。 不透明的密封剂可以包括另外的前窗。 接收集成电路芯片还包括与附加前窗相对的第二光学传感器。

    Optical semiconductor housing and method for making same
    5.
    发明授权
    Optical semiconductor housing and method for making same 有权
    光学半导体外壳及其制造方法

    公开(公告)号：US06969898B1

    公开(公告)日：2005-11-29

    申请号：US10129297

    申请日：2000-10-30

    申请人： Juan Exposito ,  Remi Brechignac

    发明人： Juan Exposito ,  Remi Brechignac

    IPC分类号： H01L25/16 ,  H01L31/0203 ,  H01L21/52 ,  H01L23/04 ,  H01L23/043

    CPC分类号： H01L27/14618 ,  H01L25/167 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Optical semiconductor package and its fabrication process, in which: a rear face of a first semiconductor component (3) such as a microprocessor is supported by a front face of an electrical connection support plate (1); a rear face of a second semiconductor component (11) is fixed to a front face of the said first component (3) and a front face of this second component has an optical sensor (13); first electrical connection means (6) connect the said first component to the front face of the said support plate; second electrical connection means (14) connect the said second component to the front face of the said support plate; means (17) ensure encapsulation of the said components stacked on the said support plate and of the said electrical connection means, the said encapsulation means being made from a transparent material which is opposite the said optical sensor; and external electrical connection means (24) are located on an exposed part of the said support plate.

    摘要翻译： 光半导体封装及其制造工艺，其中：诸如微处理器的第一半导体部件（3）的后表面由电连接支撑板（1）的前表面支撑; 第二半导体部件（11）的后表面固定到所述第一部件（3）的前表面，并且所述第二部件的前表面具有光学传感器（13）; 第一电连接装置（6）将所述第一部件连接到所述支撑板的前表面; 第二电连接装置（14）将所述第二部件连接到所述支撑板的前表面; 装置（17）确保堆放在所述支撑板和所述电连接装置上的所述部件的封装，所述封装装置由与所述光学传感器相对的透明材料制成; 并且外部电连接装置（24）位于所述支撑板的暴露部分上。

    Shielded housing for optical semiconductor component
    6.
    发明授权
    Shielded housing for optical semiconductor component 有权
    用于光学半导体元件的屏蔽外壳

    公开(公告)号：US06870238B2

    公开(公告)日：2005-03-22

    申请号：US10478177

    申请日：2002-05-17

    申请人： Juan Exposito ,  Remi Brechignac ,  Julien Vittu

    发明人： Juan Exposito ,  Remi Brechignac ,  Julien Vittu

    IPC分类号： G02B6/42 ,  H01L31/0203 ,  H01L31/0232 ,  H01L27/14

    CPC分类号： H01L27/14618 ,  G02B6/4277 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

    摘要： An optical semiconductor package includes an optical semiconductor component (8), a front face of which has an optical sensor (10), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection (11) of this optical semiconductor component (8). The encapsulation (2, 5) includes a glass pane letting light through to the optical sensor. The encapsulation (2, 5) includes electromagnetic screening (23, 24, 28) made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component (8).

    摘要翻译： 光学半导体封装包括光学半导体部件（8），其前表面具有光学传感器（10），并且封装限定了光学部件放置在其中并具有该光学半导体的外部电连接（11）的空腔 组件（8）。 封装（2,5）包括一个使光通过光学传感器的玻璃板。 封装（2,5）包括由外部可连接的导电材料制成的电磁屏蔽（23,24,28），该屏蔽在光学半导体封装中与光学半导体部件（8）的电连接电隔离 ）。

    Optical semiconductor housing and method for making same
    8.
    发明授权
    Optical semiconductor housing and method for making same 有权
    光学半导体外壳及其制造方法

    公开(公告)号：US06713876B1

    公开(公告)日：2004-03-30

    申请号：US10129372

    申请日：2002-10-01

    申请人： Julien Vittu ,  Remi Brechignac

    发明人： Julien Vittu ,  Remi Brechignac

    IPC分类号： H01L310232

    CPC分类号： H01L31/0203 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Optical semiconductor package and process for fabricating an optical semiconductor package, in which an electrical connection support plate (2) has a through-passage (5); a first semiconductor component (4) such as a microprocessor placed behind the support plate and lying opposite the through-passage; electrical connection metal balls (9) inserted into the annular space separating the first component from the support plate; encapsulation mechanism including an encapsulation material (12) lying in the annular space; a second semiconductor component (13), a front face (15) of which has an optical sensor and a rear face of which is fixed to the front face (20) of the first component (4) through the through-passage (5) of the support plate (2); metal electrical connection wires (17) connecting the front face of the second component and the front face of the support plate; a front encapsulation lid (21) which covers the through-passage and the metal wires at some distance and which has at least one transparent part (23) lying in front of the optical sensor, and external electrical connection (25) located on an exposed part of the support plate.

    摘要翻译： 光学半导体封装以及用于制造光学半导体封装的工艺，其中电连接支撑板（2）具有通路（5）; 第一半导体部件（4），例如放置在支撑板后面并与通路对置的微处理器; 插入到将第一部件与支撑板分离的环形空间中的电连接金属球（9） 封装机构包括位于环形空间中的封装材料（12）; 第二半导体部件（13），其前表面（15）具有光学传感器，并且其后表面经由通路（5）固定到第一部件（4）的前表面（20） 的支撑板（2）; 连接第二部件的前表面和支撑板的前表面的金属电连接线（17） 在所述光学传感器的前面具有至少一个透明部分（23）的外部电连接（25），所述前部封装盖（21）在一定距离处覆盖所述通路和所述金属线， 部分支撑板。

    Semiconductor component, wafer and package having an optical sensor
    9.
    发明申请
    Semiconductor component, wafer and package having an optical sensor 审中-公开
    具有光学传感器的半导体元件，晶片和封装

    公开(公告)号：US20050103987A1

    公开(公告)日：2005-05-19

    申请号：US10958673

    申请日：2004-10-05

    申请人： Remi Brechignac ,  Jonathan Hurwitz

    发明人： Remi Brechignac ,  Jonathan Hurwitz

    IPC分类号： H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01J5/16

    CPC分类号： H01L31/0203 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A semiconductor component, semiconductor wafer and semiconductor package include an integrated-circuit chip having, on a front face, an optical sensor and electrical connection pads between the edge of this face and this optical sensor. A protective patch made of a transparent material is placed in front of the optical sensor but does not cover the said optical connection pads. The said protective patch is fixed to the front face of the said chip by a bead of an adhesive extending annularly between, and at a certain distance from, the edge of the said optical sensor and of the electrical connection pads. At least one of the faces of the patch is covered with a protective layer of a material that filters out infrared light rays.

    摘要翻译： 半导体部件，半导体晶片和半导体封装包括集成电路芯片，其在正面上具有光学传感器和在该面的边缘与该光学传感器之间的电连接焊盘。 由透明材料制成的保护贴片放置在光学传感器的前面，但不覆盖所述光学连接垫。 所述保护贴片通过在所述光学传感器和所述电连接垫的边缘之间并且距离所述光学传感器的边缘和一定距离之间环形延伸的粘合剂珠固定到所述芯片的前表面。 补片的至少一个面被被过滤掉红外光的材料的保护层覆盖。

    Optical semiconductor package and process for fabricating the same
    10.
    发明授权
    Optical semiconductor package and process for fabricating the same 有权
    光半导体封装及其制造方法

    公开(公告)号：US06893169B1

    公开(公告)日：2005-05-17

    申请号：US10129371

    申请日：2000-10-30

    申请人： Juan Exposito ,  Remi Brechignac

    发明人： Juan Exposito ,  Remi Brechignac

    IPC分类号： H01L27/14 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  G02B6/36

    CPC分类号： H01L31/0203 ,  H01L25/167 ,  H01L2224/05553 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A process is provided for fabricating an optical semiconductor package. According to the process, a first semiconductor component is fixed to a rear face of an electrical connection support plate, and this first component is electrically connected to the support plate. An encapsulation block for the first component is molded on the rear face of the support plate. A second semiconductor component, a front face of which has an optical sensor, is fixed to one face of the first component, and this second component is electrically connected to the support plate. The second component is encapsulated on the front face of the support plate. Also provided is an optical semiconductor package.

    摘要翻译： 提供了一种用于制造光学半导体封装的工艺。 根据该过程，第一半导体部件被固定到电连接支撑板的后表面，并且该第一部件电连接到支撑板。 用于第一部件的封装块模制在支撑板的后表面上。 其前表面具有光学传感器的第二半导体部件被固定到第一部件的一个面上，并且该第二部件电连接到支撑板。 第二部件封装在支撑板的前表面上。 还提供了一种光学半导体封装。